-
公开(公告)号：US09402301B2
公开(公告)日：2016-07-26
申请号：US14565744
申请日：2014-12-10
Applicant: Raytheon Company
Inventor： Waid Paine , James S. Wilson , Cary C. Kyhl , Robert S. Isom
CPC classification number: H05K1/0204 , H01Q21/0025 , H01R12/72 , H05K1/0237 , H05K1/111 , H05K1/183 , H05K7/20509 , H05K2201/06 , H05K2201/09036 , H05K2201/10098
Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.
Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 衬底，其布置在所述散热器的表面上，使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面，并为设置在基板中的发热电路提供热路径。
-
公开(公告)号：US09362469B2
公开(公告)日：2016-06-07
申请号：US14975030
申请日：2015-12-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Seok Park
IPC: H01L23/053 , H01L33/58 , H01L33/56 , H01L33/62 , H01L33/40
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.
-
公开(公告)号：US20160100494A1
公开(公告)日：2016-04-07
申请号：US14504948
申请日：2014-10-02
Applicant: Honeywell International Inc.
Inventor： Peter Novysedlak , Ondrej Hajek , Martin Konecny , Milan Vasicek
CPC classification number: H05K5/0239 , B81B7/0032 , G01D3/028 , G01D11/245 , G01P1/023 , H05K1/0212 , H05K5/0013 , H05K5/0213 , H05K2201/06
Abstract: An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.
Abstract translation: 提供了用于热稳定电路板上的温度敏感元件的外壳。 外壳包括构造成安装在电路板的第一侧的至少一个温度敏感元件的一部分上的第一盖部分。 第一盖部分包括第一盖和从第一盖的周边延伸的至少一个侧壁。 外壳还包括第二盖部分，其构造成安装在与第一盖部分相对的电路板的第二侧的一部分上。 第二盖部分包括第二盖，以及从第二盖的周边延伸的至少一个侧壁。 第一和第二盖部被构造成可释放地与电路板连接。
-
公开(公告)号：US20160021787A1
公开(公告)日：2016-01-21
申请号：US14387451
申请日：2013-09-23
Applicant: TELLABS OPERATIONS, INC.
Inventor： Zhen Lei , Qinzhen Ba , Zongxian Duan , Huihui Yu
CPC classification number: H05K7/20409 , B23P15/26 , H01L23/3677 , H01L23/4093 , H01L2924/0002 , H05K1/0203 , H05K2201/06 , H01L2924/00
Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.
Abstract translation: 一种用于散热器组件的装置和系统，以及用于形成散热器组件的步骤。 散热器组件包括散热器，散热器具有从基座延伸的基部和翅片，以及布置在散热片之间的散热片上的弹簧夹。 弹簧夹包括相对于散热器的底部形成第一角度并且包括相对于散热器的底部形成第二角度的第二突出部的第一突出部。 第一和第二突片连接到电路板。 因此，提供了与传统布置相比节省空间并且允许电路板上的更高密度的笼子的保持架的散热器附件。
-
45.发明授权公开(公告)号：US09240534B2
公开(公告)日：2016-01-19
申请号：US14507560
申请日：2014-10-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Seok Park
IPC: H01L23/053 , H01L33/60 , H01L33/62 , F21K99/00 , H01L33/52 , H01L33/64 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/24
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.
Abstract translation: 发光封装，包括基底; 基底上的发光器件; 电连接到所述发光装置的电路层; 由透光材料形成的光学构件; 以及引导构件，所述引导构件引导所述光学构件，所述引导构件包括开口，设置在所述基座的最上表面上的第一部分和连接到所述光学构件的边缘部分的第二部分。 引导构件的第一部分定位成高于光学构件的底表面，基座的最上表面比引导构件的第二部分更靠近引导构件的第一部分，并且引导构件的边缘部分 光学构件比引导构件的第一部分更靠近引导构件的第二部分。
-
Patent Agency Ranking
46.发明申请CIRCUIT BOARD, ELECTRONIC MODULE AND ILLUMINATING DEVICE HAVING THE CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE CIRCUIT BOARD 有权具有电路板的电路板，电子模块和照明装置以及制造电路板的方法公开(公告)号：US20150107882A1
公开(公告)日：2015-04-23
申请号：US14407074
申请日：2013-06-14
Applicant: OSRAM GmbH
Inventor： Jianghui Yang , Chuanpeng Zhong , Hao Li , Xiaomian Chen
CPC classification number: H05K1/053 , H01L2224/48091 , H01L2224/73265 , H05K1/0201 , H05K1/0203 , H05K1/0204 , H05K1/0284 , H05K1/0306 , H05K1/056 , H05K1/142 , H05K1/181 , H05K3/10 , H05K2201/048 , H05K2201/06 , H05K2201/09745 , H05K2201/10106 , H05K2201/10416 , Y10T29/49155 , H01L2924/00014
Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.
Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。
-
公开(公告)号：US20150047882A1
公开(公告)日：2015-02-19
申请号：US14380981
申请日：2013-02-26
Applicant: APPLIED NANOTECH HOLDINGS, INC.
CPC classification number: H05K1/053 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , H01L23/373 , H01L2924/0002 , H05K1/0284 , H05K1/09 , H05K1/181 , H05K3/12 , H05K2201/0104 , H05K2201/0137 , H05K2201/0195 , H05K2201/0323 , H05K2201/06 , H05K2201/10106 , H01L2924/00 , C04B35/522 , C04B41/4539 , C04B41/5001 , C04B41/5031 , C04B41/5089 , C04B41/5059 , C04B41/5092 , C04B41/522 , C04B41/5063 , C04B41/5064 , C04B41/4535 , C04B41/4572 , C04B41/5127
Abstract: Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.
Abstract translation: 不同种类的印刷浆料或油墨被用于各种组合以在石墨基材上形成多个陶瓷电介质层，以便产生有效的介电陶瓷层，其与石墨基材和印刷的铜迹线具有良好的粘合性，并具有很强的绝缘性能。 糊剂或油墨可以包含高导热性粉末。
-
48.发明申请公开(公告)号：US20150021645A1
公开(公告)日：2015-01-22
申请号：US14507560
申请日：2014-10-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Seok PARK
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.
Abstract translation: 发光封装，包括基底; 基底上的发光器件; 电连接到所述发光装置的电路层; 由透光材料形成的光学构件; 以及引导构件，所述引导构件引导所述光学构件，所述引导构件包括开口，设置在所述基座的最上表面上的第一部分和连接到所述光学构件的边缘部分的第二部分。 引导构件的第一部分定位成高于光学构件的底表面，基座的最上表面比引导构件的第二部分更靠近引导构件的第一部分，并且引导构件的边缘部分 光学构件比引导构件的第一部分更靠近引导构件的第二部分。
-
公开(公告)号：US20110266582A1
公开(公告)日：2011-11-03
申请号：US13182389
申请日：2011-07-13
Applicant: Park Jun Seok
Inventor： Park Jun Seok
IPC: H01L33/58
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.
Abstract translation: 一种半导体发光封装，包括具有平坦部分的顶表面的基座，该基部成形为大致圆形; 基底上的多个半导体发光器件; 电连接到所述多个半导体发光器件的电路层; 在基座上的多个屏幕构件; 以及多个由透光材料形成的光学部件，使得从至少一个半导体发光器件发射的光通过其中，其中每个屏蔽部件具有围绕至少一个半导体发光器件的开口，每个 筛部件的开口成形为大致圆形，基部的直径大于筛部件的开口直径，并且光学部件的边缘部分与一个筛网部件接触。
-
公开(公告)号：US07821020B2
公开(公告)日：2010-10-26
申请号：US10578150
申请日：2005-07-21
Applicant: Jun Seok Park
Inventor： Jun Seok Park
IPC: H01L29/227
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device includes a metal base, an electrical circuit layer provided at an upper side of the metal base for providing a conductive path, a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base, an insulating layer sandwiched between the metal base and the electrical circuit layer, an electrode layer provided at an upper side of the electrical circuit layer, and a wire for electrically connecting the electrode layer and the light emitting device. The light emitting device package has improved light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.
Abstract translation: 发光器件包括金属基底，设置在金属基底的上侧的用于提供导电路径的电路层，安装在具有比金属基底上的第一区域更小的厚度的第二区域中的发光器件， 夹在金属基底和电路层之间的绝缘层，设置在电路层上侧的电极层和用于电连接电极层和发光器件的导线。 发光器件封装具有改善的发光效率，因为发光器件被放置在金属基底的小厚度部分上。
-
-
-
-
-
-
-
-
-
Search Results
94
records
(took 0.015 seconds)
