公开(公告)号：US20120119853A1

公开(公告)日：2012-05-17

申请号：US13386009

申请日：2009-07-21

Applicant: Taras Kushta

Inventor： Taras Kushta

IPC: H01P1/203

CPC classification number: H01P1/20345 ,  H01P1/2056 ,  H01P7/04 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718

Abstract: A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric.

Abstract translation: 谐振元件设置有多层板，其包括通过电介质隔离的多个导体层，穿过多层板的信号通路导体和多个接地通孔，贯穿于多层板并且围绕信号通过 导体。 多层板包括第一导体层，第二导体层和布置在第一和第二导体层之间的波纹状导体层。 波纹状导体层包括连接到信号通孔导体的瓦楞信号板和连接到多个通孔的波纹接地板，通过电介质隔离波纹信号板。

公开(公告)号：US08125789B2

公开(公告)日：2012-02-28

申请号：US12046893

申请日：2008-03-12

Applicant: Takao Nishimura

Inventor： Takao Nishimura

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/15798 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09272 ,  H05K2201/09381 ,  H05K2201/09709 ,  H05K2201/09772 ,  H05K2201/0979 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.

Abstract translation: 布线基板包括多个电极端子，电子部件的外部连接端子与该电极端子的一个主表面上排成一行，电极端子各自包括：第一直线部分; 第二直线部分，沿与第一直线部分的方向不同的方向从第一线性部分的端部延伸; 以及作为第一直线部和第二直线部连接的部分的弯曲部。

公开(公告)号：US08115109B2

公开(公告)日：2012-02-14

申请号：US12427991

申请日：2009-04-22

Applicant: Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

Inventor： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

IPC: H05K1/11

CPC classification number: H05K3/361 ,  H01L2224/11003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01019 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/167 ,  Y10T29/49126

Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

Abstract translation: 其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路​​板，电线的端面（36b）位于从接头的端部撤出的位置 第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W） 与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

公开(公告)号：US20110292625A1

公开(公告)日：2011-12-01

申请号：US13117614

申请日：2011-05-27

Applicant: HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

Inventor： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC: H05K7/06

CPC classification number: H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract translation: 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US20110279195A1

公开(公告)日：2011-11-17

申请号：US13187910

申请日：2011-07-21

Applicant: Taras KUSHTA ,  Kaoru NARITA ,  Tomoyuki KANEKO ,  Shin-ichi OGOU

Inventor： Taras KUSHTA ,  Kaoru NARITA ,  Tomoyuki KANEKO ,  Shin-ichi OGOU

IPC: H01P5/12

CPC classification number: H05K1/116 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09727

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; the length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract translation: 根据一个实施例，形成在多层基板中连接通孔结构和平面传输线的宽带转变，作为信号通孔焊盘和布置在相同导体层处的平面传输线之间的中间连接。 过渡的横向尺寸等于一端的通孔焊盘直径和另一端的带宽度; 转换的长度可以等于平面传输线方向上的间隙孔的特征尺寸，或者根据通过三维全波模拟获得的数字图，定义为在时域中提供极小的超额感抗 。

公开(公告)号：US08013685B2

公开(公告)日：2011-09-06

申请号：US12281460

申请日：2007-03-02

Applicant: Taras Kushta ,  Kaoru Narita ,  Tomoyuki Kaneko ,  Shin-ichi Ogou

Inventor： Taras Kushta ,  Kaoru Narita ,  Tomoyuki Kaneko ,  Shin-ichi Ogou

IPC: H03H7/38

CPC classification number: H05K1/116 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09727

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract translation: 根据一个实施例，形成在多层基板中连接通孔结构和平面传输线的宽带转变，作为信号通孔焊盘和布置在相同导体层处的平面传输线之间的中间连接。 过渡的横向尺寸等于一端的通孔焊盘直径和另一端的带宽度; 转换的长度可以等于平面传输线方向上的间隙孔的特征尺寸，或者定义为根据通过三维全波模拟获得的数值图在时域中提供最小的额外的电抗 。

公开(公告)号：US07937822B2

公开(公告)日：2011-05-10

申请号：US12454967

申请日：2009-05-27

Applicant: Eiji Misaizu ,  Makoto Hiramoto

Inventor： Eiji Misaizu ,  Makoto Hiramoto

IPC: G01R3/00

CPC classification number: H05K3/3405 ,  G01L1/2287 ,  H05K1/118 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10287 ,  H05K2201/1034 ,  Y10T29/49007 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method is for connecting a tab pattern formed on a base sheet and a lead wire, wherein the tab pattern includes: a tab main portion; and a connecting portion formed to continue from one edge line of the tab main portion and to extend from the tab main portion along an extension line that is substantially orthogonal to the edge line, and wherein the method includes: connecting the lead wire on the tab main portion by bonding the lead wire at a position being displaced from the extension line of the connecting portion for more than a given offset amount where the extension line is identical to a center line of the connecting portion, the position being within a given distance from the edge line of the tab main portion.

Abstract translation: 一种用于连接形成在基片和引线上的突片图案的方法，其中突片图案包括：突片主体部分; 以及连接部，其形成为从所述突片主体的一个边缘线延伸并且从所述突片主体部分沿着与所述边缘线大致正交的延伸线延伸，并且其中所述方法包括：将所述引线连接到所述突片 主要部分通过将引线接合在从连接部分的延伸线偏移超过给定偏移量的位置处，其中延伸线与连接部分的中心线相同，该位置在距离 突片主体部分的边缘线。

公开(公告)号：US20110094782A1

公开(公告)日：2011-04-28

申请号：US12647395

申请日：2009-12-25

Applicant: HUA-LI ZHOU ,  CHIA-NAN PAI ,  SHOU-KUO HSU

Inventor： HUA-LI ZHOU ,  CHIA-NAN PAI ,  SHOU-KUO HSU

IPC: H05K1/16

CPC classification number: H05K1/0253 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ≈ 8  Wpad + 10  T 0.8  Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.

Abstract translation: 印刷电路板包括信号平面和参考平面。 信号平面包括焊盘，安装在焊盘上的无源元件以及通过焊盘与无源元件电连接的信号传输线。 参考平面为通过无源元件和信号传输线传输的信号提供返回路径。 在对应于无源元件的参考平面中定义空隙，以增加返回路径的长度。 垂直于信号传输线的第一轴的长度满足以下等式：W 1≈8 Wpad + 10 T T W W W T T T + T，其中W pad是焊盘的宽度，Wtrace是 传输线的宽度，T是焊盘的高度。

公开(公告)号：US07916495B2

公开(公告)日：2011-03-29

申请号：US12049493

申请日：2008-03-17

Applicant: Chun-Line Huang

Inventor： Chun-Line Huang

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2203/058 ,  Y02P70/611 ,  Y02P70/613

Abstract: A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit.

Abstract translation: 通用焊盘与具有不同尺寸的多个SMD部件一起使用。 每个SMD组件包括第一导电部分和第二导电部分。 通用焊盘包括第一焊盘单元和第二焊盘单元。 第一和第二焊盘单元分别电连接到SMD部件的第一和第二导电部分。 第一和第二垫单元中的每一个包括主要部分和第一延伸部分。 第一延伸部分从主要部分的第一侧壁延伸并且包括第一边界，第二边界和第三边界。 第一延伸部分的第二边界和第三边界彼此平行，以便于SMD部件的第一和第二导电部分相对于第一焊盘单元和第二焊盘单元的对准。

公开(公告)号：US20110063816A1

公开(公告)日：2011-03-17

申请号：US12805939

申请日：2010-08-25

Applicant: Hiroyuki Tanabe ,  Toshiki Naito

Inventor： Hiroyuki Tanabe ,  Toshiki Naito

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K3/363 ,  G11B5/484 ,  H05K1/056 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/09381 ,  H05K2201/09727 ,  Y10T29/49126

Abstract: A wired circuit board includes a first wired circuit board provided with a first conductive pattern which has first terminals comprising placement surfaces for placing a meltable metal and first wires continuous with the first terminals; and a second wired circuit board provided with a second conductive pattern which has second terminals connected with the first terminals through the meltable metal and second wires continuous with the second terminals. The first wired circuit board and the second wired circuit board are arranged so that a first plane containing the first terminals and a second plane containing the second terminals are intersected with each other, and the placement surfaces are zoned so as to gradually widen toward the second terminals.

Abstract translation: 布线电路板包括：第一布线电路板，其具有第一导电图案，第一导电图案具有第一端子，第一端子包括用于放置可熔金属的布置表面和与第一端子连续的第一布线; 以及设置有第二导电图案的第二布线电路板，其具有通过可熔融金属与第一端子连接的第二端子，以及与第二端子连续的第二导线。 第一布线电路板和第二布线电路板被布置成使得包含第一端子的第一平面和包含第二端子的第二平面彼此相交，并且放置表面被分区以朝向第二端子逐渐变宽 终端。