中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

851 records (took 0.022 seconds)

    PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT
    41.
    发明申请
    PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT 审中-公开
    印刷电路板与内置电阻元件

    公开(公告)号：US20110252639A1

    公开(公告)日：2011-10-20

    申请号：US13172974

    申请日：2011-06-30

    Applicant: Hironori Tanaka

    Inventor： Hironori Tanaka

    IPC: H05K3/10

    CPC classification number: H05K1/167 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09536 ,  H05K2201/09809 ,  H05K2203/1453 ,  Y10T29/49155 ,  Y10T29/49169

    Abstract: A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode, and a resistive element comprising a resistive material provided in the resistor-filling part wherein the resistor-filling part is substantially enclosed by the first electrode and the second electrode.

    Abstract translation: 一种具有内置电阻元件的印刷电路板，包括形成在绝缘构件表面上的第一电极，与第一电极相邻设置以在其间形成空间的第二电极，由第一电极之间的空间形成的电阻器填充部分， 第一电极和第二电极，以及电阻元件，其包括设置在电阻器填充部分中的电阻材料，其中电阻器填充部分基本上被第一电极和第二电极包围。

    Method for fabricating a printed circuit board having a coaxial via
    42.
    发明授权
    Method for fabricating a printed circuit board having a coaxial via 有权
    一种具有同轴通孔的印刷电路板的制造方法

    公开(公告)号：US08035038B2

    公开(公告)日：2011-10-11

    申请号：US12101426

    申请日：2008-04-11

    Applicant: Wheling Cheng ,  Roger Karam ,  Sergio Camerlo

    Inventor： Wheling Cheng ,  Roger Karam ,  Sergio Camerlo

    IPC: H05K1/11

    CPC classification number: H05K1/0222 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/09309 ,  H05K2201/09809 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49162 ,  Y10T29/49165

    Abstract: A method of fabricating a printed circuit board having a coaxial via is disclosed. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through the plurality of layers to connect GND layers in the printed circuit board, forming or inserting into the hollow via a conductor coated with non-conductive material, covering the top layer and bottom layer with dielectric and patterned signal layers, covering the top layer and bottom layer with a masking agent, plating the top layer and bottom layer with a conductive material that connects signal traces within via, and removing the masking agent from the top layer and bottom layer.

    Abstract translation: 公开了一种制造具有同轴通孔的印刷电路板的方法。 该方法包括组装多个配置在堆叠中的层，使得多个层具有顶层信号层和底层信号层; 通过多个层形成中空通孔以连接印刷电路板中的GND层，通过涂覆有非导电材料的导体形成或插入中空，用介电和图案化的信号层覆盖顶层和底层，覆盖 顶层和底层具有掩蔽剂，用连接通孔内的信号迹线的导电材料电镀顶层和底层，以及从顶层和底层除去掩蔽剂。

    SUBSTRATE OF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
    44.
    发明申请
    SUBSTRATE OF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR 审中-公开
    电路模块的基板及其制造方法

    公开(公告)号：US20110226518A1

    公开(公告)日：2011-09-22

    申请号：US13130675

    申请日：2009-11-24

    Applicant: Risato Ohhira

    Inventor： Risato Ohhira

    IPC: H05K1/11 ,  H05K3/02

    CPC classification number: H05K1/0243 ,  H01P3/003 ,  H01P5/107 ,  H05K1/0219 ,  H05K2201/0919 ,  H05K2201/09318 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10T29/49156

    Abstract: A coplanar line formed on a high-frequency substrate of a high-frequency module includes a first dielectric layer, a signal line which is formed on the surface of the first dielectric layer and connected to a core line of a coaxial connector, a ground which is formed in opposite areas beside the signal line with a clearance therebetween, and a lower ground of the first dielectric layer. A second dielectric layer is laminated with the first dielectric layer so as to interpose the lower ground therebetween. Additionally, the lower ground is exposed on the terminal face of the high-frequency substrate coupled with the coaxial connector in either the first dielectric layer or the second dielectric layer and connected to an outer conductor of the coaxial connector. Thus, it is possible to prevent an insertion loss from increasing due to electromagnetic emission occurring in the clearance of the high-frequency substrate in response to transmitting signals in a high frequency range.

    Abstract translation: 形成在高频模块的高频基板上的共平面线包括第一电介质层，形成在第一电介质层的表面上并连接到同轴连接器的芯线的信号线， 形成在信号线旁边的相对区域中，其间具有间隙，以及第一介电层的下部接地。 第二电介质层与第一电介质层层叠以便在其间插入较低的接地。 此外，下部接地暴露在与第一电介质层或第二电介质层中的同轴连接器耦合的高频衬底的端子面上，并连接到同轴连接器的外部导体。 因此，可以防止由于高频基板的间隙中发生的电磁辐射响应于高频范围内的发送信号而增加插入损耗。

    HIGH IMPEDANCE ELECTRICAL CONNECTION VIA
    46.
    发明申请
    HIGH IMPEDANCE ELECTRICAL CONNECTION VIA 有权
    高阻抗电气连接

    公开(公告)号：US20110095851A1

    公开(公告)日：2011-04-28

    申请号：US12607027

    申请日：2009-10-27

    Applicant: Christopher P. Wyland

    Inventor： Christopher P. Wyland

    IPC: H01P7/08

    CPC classification number: H01L23/66 ,  H01L23/64 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0251 ,  H05K1/116 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

    Abstract: Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.

    Abstract translation: 差分信号的通孔通常比与其相连的信号线阻抗更低。 导致阻抗失配的噪声和反射信号可能要求电路以远低于所需的频率运行。 本发明的一个或多个实施例避免了电路中的阻抗不匹配，并且通过向通孔的每个端部添加裂环谐振器（SSR）提供具有较高阻抗的通孔来实现本领域的进步。

    CIRCUIT BOARD ARRANGEMENT
    47.
    发明申请
    CIRCUIT BOARD ARRANGEMENT 审中-公开
    电路板安排

    公开(公告)号：US20100321915A1

    公开(公告)日：2010-12-23

    申请号：US12740938

    申请日：2008-11-03

    Applicant: Ralf Wendler ,  Jorg Romahn ,  Annette Bolcke

    Inventor： Ralf Wendler ,  Jorg Romahn ,  Annette Bolcke

    IPC: H05K1/11

    CPC classification number: H05K3/325 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09381 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10265

    Abstract: An arrangement including a first circuit board having a contact surface for contacting of a connecting element, a second circuit board, and a connecting element. The contact surface has a central contact point and a concentric ring surrounding the central contact point. The connecting element which is electrically contacted at a first side with the second circuit board and which at a second side in opposite relationship to the first side includes a first spring element at least one second spring element. The first spring element is electrically contacted with the central contact point of the first circuit board and the at least one second spring element is electrically contacted with the concentric ring of the first circuit board.

    Abstract translation: 一种装置，包括具有用于接触连接元件，第二电路板和连接元件的接触表面的第一电路板。 接触表面具有中心接触点和围绕中心接触点的同心环。 在第一侧与第二电路板电接触并且在与第一侧相反的第二侧的连接元件包括至少一个第二弹簧元件的第一弹簧元件。 第一弹簧元件与第一电路板的中心接触点电接触，并且至少一个第二弹簧元件与第一电路板的同心环电接触。

    FLEXIBLE PRINTED CIRCUIT AND FABRICATION METHOD THEREOF
    49.
    发明申请
    FLEXIBLE PRINTED CIRCUIT AND FABRICATION METHOD THEREOF 有权
    柔性印刷电路及其制造方法

    公开(公告)号：US20100314164A1

    公开(公告)日：2010-12-16

    申请号：US12568471

    申请日：2009-09-28

    Applicant: Chung-Lun WU ,  Fu-An Chu ,  Ja-Ee Li

    Inventor： Chung-Lun WU ,  Fu-An Chu ,  Ja-Ee Li

    IPC: H05K9/00 ,  H05K1/00 ,  H05K3/00

    CPC classification number: H05K1/0221 ,  H05K1/0245 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/0715 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49124

    Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.

    Abstract translation: 提供了一种柔性印刷电路及其制造方法。 至少一根信号线设置在塑料基板上。 两条接地线平行设置在信号线的两侧。 提供屏蔽层，与塑料基板接触以形成室，其中信号线和接地线被包裹在其中。 在信号线和屏蔽层之间实现柔性介电层以提供电隔离。

    Shielded via
    50.
    发明授权
    Shielded via 有权
    屏蔽通过

    公开(公告)号：US07781889B2

    公开(公告)日：2010-08-24

    申请号：US11477703

    申请日：2006-06-29

    Applicant: Bram Leader ,  Richard R. Doersch

    Inventor： Bram Leader ,  Richard R. Doersch

    IPC: H01L23/48 ,  H01L23/535 ,  H05K3/42

    CPC classification number: H05K1/0222 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09809 ,  H01L2924/00

    Abstract: A system may include a first conductive ground pad, a second conductive ground pad, a first conductive via coupling the first ground pad to the second ground pad, a first conductive signal trace, a second conductive signal trace, and a second conductive via disposed within the first conductive via and coupling the first conductive signal trace to the second conductive signal trace. The first conductive ground pad and the second conductive ground pad may be disposed between the first conductive signal trace and the second conductive signal trace.

    Abstract translation: 系统可以包括第一导电接地焊盘，第二导电接地焊盘，将第一接地焊盘耦合到第二接地焊盘的第一导电通孔，第一导电信号迹线，第二导电信号迹线和设置在第二接地焊盘内的第二导电通孔 第一导电通孔并将第一导电信号迹线耦合到第二导电信号迹线。 第一导电接地焊盘和第二导电接地焊盘可以设置在第一导电信号迹线和第二导电信号迹线之间。

Patent Agency Ranking