公开(公告)号：US3562036A

公开(公告)日：1971-02-09

申请号：US3562036D

申请日：1967-07-07

Applicant: ELECTRO CONNECTIVE SYSTEMS INC

Inventor： TRAVIS LAWRENCE R

IPC: H01B7/08 ,  H01B13/00 ,  H01B13/10 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  B44C1/22 ,  C23F1/04

CPC classification number: H01B7/08 ,  H01B13/00 ,  H01B13/103 ,  H05K1/0266 ,  H05K1/0393 ,  H05K3/0079 ,  H05K3/0097 ,  H05K3/061 ,  H05K3/28 ,  H05K2201/09936 ,  H05K2203/1545

Abstract: METHOD OF DEPOSITING RESIST ON A CONTINUOUSLY MOVING WEB OF CONDUCTOR METAL FOIL BACKED BY FLEXIBLE DIELECTRIC MATERIAL WHEREIN A RESIST PATTERN IS DEPOSITED ON THE FOIL AT ONE STATION AND A DIFFERENT RESIST PATTERN IS DEPOSITED ON THE FOIL AT ANOTHER STATION, FROM WHICH WEB AN INDEFINITED LENGTH OF FLAT FLEXIBLE CABLE AND CIRCUITS IS FORMED BY ETCHING THE FOIL, THE SELECTION OF RESIST DEPOSITION BEING CONTROLLED BY SENSING OF PREVIOUSLY FORMED CONTROL INDICIA IN THE FORM OF OPENINGS, SUCH AS NOTCHES OR HOLES, LOCATED ALONG THE WEB AT A PREDETERMINED TRANSVERSE POSITION ON THE WEB.

公开(公告)号：US3018568A

公开(公告)日：1962-01-30

申请号：US69560457

申请日：1957-11-12

Applicant: ELECTRONIC AIDS INC

Inventor： MORRIS TISCHLER

IPC: G09B23/18 ,  H05K1/02

CPC classification number: G09B23/185 ,  H05K1/0266 ,  H05K2201/0108 ,  H05K2201/09936

公开(公告)号：US20180018484A1

公开(公告)日：2018-01-18

申请号：US15634347

申请日：2017-06-27

Applicant: BIOTRONIK SE & Co. KG

Inventor： Alok Sharan ,  Anthony A. Primavera

IPC: G06K7/10 ,  G06K7/12

CPC classification number: G06K7/10366 ,  G06K7/10722 ,  G06K7/12 ,  H05K1/0266 ,  H05K1/0269 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098 ,  H05K2201/2054

Abstract: A system and method for marking components of an assembly and/or portions of an assembly including at least one of the components with a plurality of markers, each component and/or portion including its own marker or markers, to be read in an operational sequence so as to generate at least one identifier representative of a characteristic and/or feature of the assembly. Any marker can be a certain type of marker, the combination of which can be used to generate an identifier. A certain type of marker 1 need not be dedicated to a certain component. Each marker can be associated with a proxy value, which can be obtained by reading the marker with a reader. An identifier of the assembly can then be generated by employing a predetermined sequence of reading the markers.

公开(公告)号：US09728889B2

公开(公告)日：2017-08-08

申请号：US14817886

申请日：2015-08-04

Applicant: Goodrich Corporation

Inventor： Michael Abbott ,  Andrew Slanker ,  Brian Syverson ,  Eric Joseph Reed ,  Scott R Durkee ,  Alexander White

IPC: H01R13/58 ,  H01R12/70 ,  H01R43/20 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/58 ,  H01R12/7076 ,  H01R43/205 ,  H05K1/0257 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/116 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A circuit card is disclosed. The circuit card may have a strain relief aperture and a conductor contact. A conductor may extend through the strain relief aperture and connect in electrical continuity with the conductor contact. The circuit card may have a conformal coating, such as poly(p-xylylene) polymer applied. The conformal coating may be applied in layers, and the layers may have different thicknesses.

公开(公告)号：US20170012189A1

公开(公告)日：2017-01-12

申请号：US15271762

申请日：2016-09-21

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Toshio HATA ,  Makoto AGATANI ,  Shinya ISHIZAKI ,  Makoto MATSUDA ,  Tomokazu NADA ,  Toyonori UEMURA

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L23/544

CPC classification number: H01L33/60 ,  G03F9/7073 ,  G03F9/7076 ,  G03F9/708 ,  G03F9/7084 ,  H01L23/544 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48137 ,  H05K1/0269 ,  H05K3/12 ,  H05K3/28 ,  H05K2201/09918 ,  H05K2201/09936 ,  H01L2924/00

Abstract: A light emitting device (10) includes light emitting elements (12), conductor wirings (14), and alignment marks (18) formed on a substrate (11). The alignment marks (18) and the conductor wirings (14) are formed by printing.

Abstract translation: 发光器件（10）包括发光元件（12），导体布线（14）和形成在基板（11）上的对准标记（18）。 对准标记（18）和导体布线（14）通过印刷形成。

公开(公告)号：US09380696B2

公开(公告)日：2016-06-28

申请号：US14136957

申请日：2013-12-20

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shinsaku Watanabe

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0269 ,  H05K1/0266 ,  H05K1/0274 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/09936

Abstract: A flexible printed circuit board having a copper foil character with good visibility and without copper foil pattern peeling. The flexible printed circuit board has a base material having optical transparency, a wiring pattern formed on one surface of the base material; a first opaque cover lay film covering a surface of the wiring pattern, a character formed on the other surface of the base material; and a second opaque cover lay film covering a surface of the character. The first opaque cover lay film has an opening portion is formed therein, and the character is formed so as to be visually recognizable through the opening portion.

Abstract translation: 具有铜箔字符的柔性印刷电路板，具有良好的可视性并且没有铜箔图案剥离。 柔性印刷电路板具有具有光学透明性的基材，形成在基材的一个表面上的布线图案; 覆盖所述布线图案的表面的第一不透明覆盖膜，形成在所述基材的另一个表面上的字符; 以及覆盖角色表面的第二不透明覆盖膜。 第一不透明覆盖膜在其中形成有开口部分，并且该字符形成为通过开口部分在视觉上可识别。

公开(公告)号：US20160037637A1

公开(公告)日：2016-02-04

申请号：US14449089

申请日：2014-07-31

Applicant: Keysight Technologies, Inc.

Inventor： Brian Wade Carlson ,  William Hollender ,  Donald Ingram

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/4638 ,  H05K2201/041 ,  H05K2201/0919 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166

Abstract: A printed circuit board (PCB) includes a stack of core layers disposed one over another, and electrically conductive interconnects extending vertically in the stack. Each of the core layers includes a substrate having opposite major surfaces, an electrically conductive active trace extending along at least one of the major surfaces, and an indicium. The stack also has an exposed edge where the indicia of the layers are together revealed. The indicia provide identifying and/or fiducial information about the PCB.

Abstract translation: 印刷电路板（PCB）包括一层叠置的芯层，以及在堆叠中垂直延伸的导电互连。 每个芯层包括具有相反主要表面的基底，沿主要表面中的至少一个延伸的导电活性迹线和标记。 堆叠还具有暴露的边缘，其中层的标记一起显露。 标记提供关于PCB的识别和/或基准信息。

公开(公告)号：US20150273868A1

公开(公告)日：2015-10-01

申请号：US14666640

申请日：2015-03-24

Applicant: New System S.R.L.

Inventor： Mitja VODOPIVEC ,  Rajko ZBOGAR

IPC: B41J11/00

CPC classification number: B41J11/002 ,  B41J3/543 ,  H05K1/0266 ,  H05K2201/09936 ,  H05K2203/013

Abstract: According to the present application, a printing unit is provided. The printing unit may include a first print head, a second print head, a UV pinning light source between the first print head and the second print head and a UV curing light source on an outer side of one or the other of the first print head and second print head. A printing apparatus of the type that uses liquid ink for printing on the surfaces of printed circuit boards is also provided. With the present application, it is possible to print high resolution images in one single pass.

Abstract translation: 根据本申请，提供了一种印刷单元。 打印单元可以包括在第一打印头和第二打印头之间的第一打印头，第二打印头，UV钉扎光源和在第一打印头中的一个或另一个的外侧上的UV固化光源 和第二打印头。 还提供了一种在印刷电路板的表面上使用液体油墨进行印刷的印刷装置。 在本申请中，可以在一次通过中打印高分辨率图像。

公开(公告)号：US09113584B2

公开(公告)日：2015-08-18

申请号：US13982036

申请日：2012-01-30

Applicant: Hangfeng Ji ,  Abraham Rudolf Balkenende ,  Hong Chen

Inventor： Hangfeng Ji ,  Abraham Rudolf Balkenende ,  Hong Chen

IPC: H05K7/00 ,  H05K3/30 ,  H05K3/22 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/305 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/321 ,  H05K3/34 ,  H05K2201/09936 ,  H05K2203/047 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/1089

Abstract: The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.

Abstract translation: 印刷电路板组件技术领域本发明涉及印刷电路板组件（10），所述印刷电路板组件包括：基板（100）; 两个或多个被分类的电子部件，其中根据所述部件所属的类别，每个部件通过具有不同的预定热释放温度的固定装置固定到基板。 本发明还涉及组装印刷电路板组件的方法和拆卸根据本发明的印刷电路板组件的方法。

公开(公告)号：US20150171294A1

公开(公告)日：2015-06-18

申请号：US14419841

申请日：2013-07-11

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Toshio Hata ,  Makoto Agatani ,  Shinya Ishizaki ,  Makoto Matsuda ,  Tomokazu Nada ,  Toyonori Uemura

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  G03F9/7073 ,  G03F9/7076 ,  G03F9/708 ,  G03F9/7084 ,  H01L23/544 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48137 ,  H05K1/0269 ,  H05K3/12 ,  H05K3/28 ,  H05K2201/09918 ,  H05K2201/09936 ,  H01L2924/00

Abstract: A light emitting device (10) includes light emitting elements (12), conductor wirings (14), and alignment marks (18) formed on a substrate (11). The alignment marks (18) and the conductor wirings (14) are formed by printing.

Abstract translation: 发光器件（10）包括发光元件（12），导体布线（14）和形成在基板（11）上的对准标记（18）。 对准标记（18）和导体布线（14）通过印刷形成。