公开(公告)号：US09706647B2

公开(公告)日：2017-07-11

申请号：US14276413

申请日：2014-05-13

Applicant: MC10, INC.

Inventor： Yung-Yu Hsu ,  John Work ,  Kevin J. Dowling

IPC: H05K1/02 ,  A61B5/00 ,  H01L23/538 ,  H05K1/18 ,  H01L23/14

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

公开(公告)号：US20160272132A1

公开(公告)日：2016-09-22

申请号：US15034446

申请日：2014-10-15

Applicant: SUMITOMO WIRING SYSTEMS, LTD. ,  AutoNetworks Technologies, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Yoshikazu HACHIYA

IPC: B60R16/03 ,  H02G3/08

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box includes a bus bar circuit unit obtained by arranging a plurality of bus bars including a power source-side bus bar to be connected to a power source line and a ground-side bus bar to be connected to a ground line on insulated boards. In the electrical junction box, the power source-side bus bar and the ground-side bus bar are arranged adjacent to each other, and an oxide deposition inhibiting structure is provided in exposed portions of the insulated board exposed through a gap between the power source-side bus bar and the ground-side bus bar.

Abstract translation: 本发明提供一种具有新颖结构的电接线盒，其能够在不依赖于电接线盒的防水结构的情况下防止水渗透后的车辆起火。 电接线盒包括汇流条电路单元，其通过布置多个汇流条而获得，所述汇流条包括要连接到电源线的电源侧汇流条和要与绝缘的地线连接的接地侧汇流条 董事会 在电接线盒中，电源侧汇流条和接地侧汇流条彼此相邻布置，并且在绝缘板的暴露部分中设置氧化物沉积抑制结构，该绝缘板通过电源 旁边的巴士酒吧和地面侧的巴士吧。

公开(公告)号：US09173302B2

公开(公告)日：2015-10-27

申请号：US12439576

申请日：2007-05-28

Applicant: Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

Inventor： Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

IPC: H01L31/042 ,  H05K3/32 ,  H01L31/18 ,  H01L31/05

CPC classification number: H05K3/323 ,  H01L31/0512 ,  H01L31/18 ,  H05K2201/09945 ,  Y02E10/50 ,  Y10T428/25

Abstract: The conductive adhesive film of the invention is a conductive adhesive film for electrical connection between photovoltaic cell surface electrodes and wiring members, which comprises an insulating adhesive 2 and conductive particles 1 and has a (t/r) value in the range of 0.75-17.5, where r (μm) is the mean particle size of the conductive particles 1 and t (μm) is the thickness of the conductive adhesive film, wherein the content of the conductive particles 1 is 1.7-15.6 vol % based on the total volume of the conductive adhesive film.

Abstract translation: 本发明的导电性粘接膜是在光电池用表面电极与布线部件之间进行电连接的导电性粘合膜，其包含绝缘性粘合剂2和导电性粒子1，（t / r）的值在0.75〜17.5的范围内 ，其中r（μm）是导电粒子1的平均粒径，t（μm）是导电性粘接膜的厚度，导电性粒子1的含量相对于导电性粒子1的总体积为1.7〜15.6体积％ 导电胶膜。

公开(公告)号：US08638542B2

公开(公告)日：2014-01-28

申请号：US12833185

申请日：2010-07-09

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01G4/06 ,  H01G4/005 ,  H01G7/00

CPC classification number: H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

Abstract translation: 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

公开(公告)号：US08304664B2

公开(公告)日：2012-11-06

申请号：US12777605

申请日：2010-05-11

Applicant: Tsuyoshi Kobayashi ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

Inventor： Tsuyoshi Kobayashi ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

IPC: H05K1/11

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/305 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.

Abstract translation: 一种电子部件（芯片）安装结构，包括具有端子的芯片，具有与芯片的端子电连接的端子的布线板以及设置在芯片和布线板之间的插入板，并且具有包括绝缘基底 材料具有在其厚度方向上穿透绝缘基材的大量丝状导体。 芯片的端子通过设置在插入板中的多个丝状导体电连接到布线板的端子。

公开(公告)号：US20110117357A1

公开(公告)日：2011-05-19

申请号：US13003231

申请日：2009-07-07

Applicant: Yusuke Hatanaka ,  Shinya Suzuki

Inventor： Yusuke Hatanaka ,  Shinya Suzuki

IPC: B32B3/26 ,  C25D5/02

CPC classification number: H05K3/323 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/3011 ,  H05K2201/0116 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T428/24997 ,  Y10T428/24998 ,  H01L2924/00

Abstract: A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are disposed at a density of 1×106 to 1×1010 micropores/mm2. The through micropores are filled with a metal at a filling ratio of at least 30% and a polymer layer is formed on at least one surface of the insulating base.

Abstract translation: 提供了具有优异的长期稳定性并且能够以高接合强度通过热压接而简单接合的微结构。 微结构包括绝缘基底，其中孔径为10〜500nm的细孔以1×10 6〜1×10 10个微孔/ mm 2的密度配置。 贯通微孔以填充率至少为30％的金属填充，并且在绝缘基底的至少一个表面上形成聚合物层。

公开(公告)号：US20090288697A1

公开(公告)日：2009-11-26

申请号：US12439576

申请日：2007-05-28

Applicant: Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

Inventor： Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

IPC: H01L31/042 ,  B32B5/16

CPC classification number: H05K3/323 ,  H01L31/0512 ,  H01L31/18 ,  H05K2201/09945 ,  Y02E10/50 ,  Y10T428/25

Abstract: The conductive adhesive film of the invention is a conductive adhesive film for electrical connection between photovoltaic cell surface electrodes and wiring members, which comprises an insulating adhesive 2 and conductive particles 1 and has a (t/r) value in the range of 0.75-17.5, where r (μm) is the mean particle size of the conductive particles 1 and t (μm) is the thickness of the conductive adhesive film, wherein the content of the conductive particles 1 is 1.7-15.6 vol % based on the total volume of the conductive adhesive film.

Abstract translation: 本发明的导电性粘接膜是在光电池用表面电极与布线部件之间进行电连接的导电性粘合膜，其包含绝缘性粘合剂2和导电性粒子1，（t / r）的值在0.75〜17.5的范围内 ，其中r（mum）是导电颗粒1的平均粒度，t（mum）是导电粘合剂膜的厚度，其中导电颗粒1的含量相对于导电性颗粒1的总体积为1.7-15.6体积％ 导电胶膜。

公开(公告)号：US20090208731A1

公开(公告)日：2009-08-20

申请号：US12370477

申请日：2009-02-12

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: B32B5/16 ,  B05D5/12

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2203/0425 ,  Y10T428/254 ,  H01L2924/00

Abstract: A conductive adhesive film includes an insulating adhesive material and a plurality of conductive particles dispersed in the insulating adhesive material, wherein the conductive particles are arranged in the insulating adhesive material at a predetermined pitch.

Abstract translation: 导电性粘合膜包括绝缘性粘合剂材料和分散在绝缘性粘合剂材料中的多个导电性粒子，其中，导电性粒子以预定的间距配置在绝缘性粘接材料中。

公开(公告)号：US07408263B2

公开(公告)日：2008-08-05

申请号：US11417860

申请日：2006-05-03

Applicant: Jeffrey Scott Meth

Inventor： Jeffrey Scott Meth

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09945 ,  Y10T29/49126

Abstract: Anisotropic conductive coatings and electronic devices made using the coatings are provided. The anisotropic conductive coatings are particularly useful in electronic devices that contain flexible substrates.

Abstract translation: 提供各向异性导电涂层和使用涂层制成的电子器件。 各向异性导电涂层在包含柔性基底的电子器件中特别有用。

公开(公告)号：US20060249301A1

公开(公告)日：2006-11-09

申请号：US11417860

申请日：2006-05-03

Applicant: Jeffrey Meth

Inventor： Jeffrey Meth

IPC: H05K1/11 ,  H01L23/52

CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09945 ,  Y10T29/49126

Abstract: Anisotropic conductive coatings and electronic devices made using the coatings are provided. The anisotropic conductive coatings are particularly useful in electronic devices that contain flexible substrates.

Abstract translation: 提供各向异性导电涂层和使用涂层制成的电子器件。 各向异性导电涂层在包含柔性基底的电子器件中特别有用。