公开(公告)号：US20070134007A1

公开(公告)日：2007-06-14

申请号：US11703782

申请日：2007-02-08

Applicant: Seung-deog An ,  Min-seon Kim

Inventor： Seung-deog An ,  Min-seon Kim

IPC: G03G15/00

CPC classification number: H05K1/11 ,  H05K3/325 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10265 ,  H05K2203/044

Abstract: Disclosed is a printed circuit board comprising a contact terminal, which prevents a poor contact and reduces a manufacturing cost, and an image forming apparatus having the same. The printed circuit board comprises a circuit part for controlling and processing an operation of electronic appliance, and a large-area contact terminal formed by a group of small-area terminals for electric connection with external device. The small-area terminals can be formed in various types, respectively having regular size and shape and being distanced a predetermined interval. Accordingly, unevenness of the large-area contact terminal surface caused by soldering is prevented since a plurality of small-area terminals constitute a unit contact terminal of over a predetermined size. Therefore, quality of contact with external terminal improves. Further, manufacturing cost is reduced, and the manufacturing process becomes simple.

公开(公告)号：US07196617B2

公开(公告)日：2007-03-27

申请号：US10932960

申请日：2004-09-02

Applicant: Jay C. Sinnett ,  David J. Myatt ,  Arthur R. Metcalf

Inventor： Jay C. Sinnett ,  David J. Myatt ,  Arthur R. Metcalf

IPC: B60C23/00

CPC classification number: H01R4/02 ,  B29D2030/0072 ,  B60C23/0493 ,  H01Q1/2241 ,  H01Q1/40 ,  H01R4/20 ,  H01R12/53 ,  H01R13/58 ,  H01R13/5808 ,  H01R13/5845 ,  H01R43/0256 ,  H01R2201/02 ,  H01R2201/26 ,  H05K3/301 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/1194

Abstract: A strain-resistant electrical connection and a method of making the same is provided. A wire or other conductive lead is connected to a circuit in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the lead relative to the circuit. A material is configured around the lead and near the point of connection to the circuit so as to create a region of decreasing flexibility or graduated stiffness near the point of connection. In certain embodiments, the lead may also be coiled or otherwise shaped to provide additional ability to withstand mechanical stresses. In other embodiments, additional elements may be provided to assist in controlling the stiffness near the connection point.

Abstract translation: 提供耐应变电气连接及其制造方法。 电线或其他导电引线以使得连接更能抵抗机械应力（例如引线相对于电路的移动或旋转）的方式连接到电路。 材料围绕引线构造并且靠近与电路的连接点，以便在连接点附近产生减小的柔性或渐变刚度的区域。 在某些实施例中，引线也可以被卷绕或以其他方式成形以提供额外的承受机械应力的能力。 在其他实施例中，可以提供附加元件以帮助控制连接点附近的刚度。

公开(公告)号：US07192286B2

公开(公告)日：2007-03-20

申请号：US10917407

申请日：2004-08-13

Applicant: Seung-deog An ,  Min-seon Kim

Inventor： Seung-deog An ,  Min-seon Kim

IPC: H01R12/00

CPC classification number: H05K1/11 ,  H05K3/325 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10265 ,  H05K2203/044

Abstract: Disclosed is a printed circuit board comprising a contact terminal, which prevents a poor contact and reduces a manufacturing cost, and an image forming apparatus having the same. The printed circuit board comprises a circuit part for controlling and processing an operation of electronic appliance, and a large-area contact terminal formed by a group of small-area terminals for electric connection with external device. The small-area terminals can be formed in various types, respectively having regular size and shape and being distanced a predetermined interval. Accordingly, unevenness of the large-area contact terminal surface caused by soldering is prevented since a plurality of small-area terminals constitute a unit contact terminal of over a predetermined size. Therefore, quality of contact with external terminal improves. Further, manufacturing cost is reduced, and the manufacturing process becomes simple.

Abstract translation: 公开了一种印刷电路板，其包括接触端子，其防止接触不良并降低制造成本，以及具有该接触端子的图像形成装置。 印刷电路板包括用于控制和处理电子设备的操作的电路部分和由一组用于与外部设备电连接的小区域端子形成的大面积接触端子。 小区域终端可以形成为各种类型，分别具有规则的大小和形状，并且以预定的间隔间隔开。 因此，由于多个小区域端子构成超过预定尺寸的单元接触端子，因此防止了由焊接引起的大面积接触端子表面的不均匀性。 因此，与外部端子的接触质量提高。 此外，制造成本降低，制造过程变得简单。

公开(公告)号：US07177158B1

公开(公告)日：2007-02-13

申请号：US11365267

申请日：2006-02-28

Applicant: Zi-Gui Luo ,  Fred Chen

Inventor： Zi-Gui Luo ,  Fred Chen

IPC: H05K7/00 ,  H05K1/16

CPC classification number: H05K3/301 ,  H01M2/0222 ,  H01M6/16 ,  H01M10/425 ,  H05K3/325 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10265 ,  H05K2201/10643

Abstract: A press-activated electronic component discharging facilitating apparatus is proposed, which is designed for use with a battery-powered electronic component, such as a CMOS (Complementary Metal Oxide Semiconductor) memory unit installed on a computer motherboard, for providing the CMOS memory unit with a user-operated press-activated discharging facilitating function, and which is characterized by the capability of allowing the user to facilitate the discharging of the CMOS memory unit simply by pressing the battery cell used to power the CMOS memory unit, without having to dismount the battery cell from the motherboard and flip hardware jumpers as in the case of prior art. This feature allows the discharging process of the CMOS memory to be carried out more conveniently and efficiently.

Abstract translation: 提出了一种按压激活的电子元件放电促进装置，其被设计用于与电池供电的电子部件一起使用，诸如安装在计算机主板上的CMOS（互补金属氧化物半导体）存储器单元，用于向CMOS存储器单元提供 用户操作的按压激活放电促进功能，并且其特征在于，允许用户简单地通过按压用于为CMOS存储器单元供电的电池单元而容易地放电CMOS存储器单元的能力，而不必卸下 如现有技术的情况，来自主板的电池单元和翻转硬件跳线。 该特征允许更方便和有效地执行CMOS存储器的放电过程。

公开(公告)号：US07032311B2

公开(公告)日：2006-04-25

申请号：US10179560

申请日：2002-06-25

Applicant: Eli Razon

Inventor： Eli Razon

IPC: H01B19/00

CPC classification number: H01L24/85 ,  H01L21/4825 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01R13/2407 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10719 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.

公开(公告)号：US06948940B2

公开(公告)日：2005-09-27

申请号：US10411175

申请日：2003-04-10

Applicant: Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

Inventor： Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

IPC: G01R1/067 ,  G01R31/28 ,  H01L21/48 ,  H01L23/498 ,  H01R4/48 ,  H01R13/03 ,  H01R13/24 ,  H01R13/33 ,  H01R43/16 ,  H05K3/32 ,  H05K3/40 ,  H01R12/00

CPC classification number: G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

Abstract translation: 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 在替代实施例中，去除垫以留下独立的螺旋接触。

公开(公告)号：US20030196826A1

公开(公告)日：2003-10-23

申请号：US10402289

申请日：2003-03-28

Inventor： David J. Alcoe

IPC: H01L023/02

CPC classification number: H05K13/0465 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00014

Abstract: An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

Abstract translation: 电子封装包括其上具有接触焊盘的衬底，位于接触焊盘上的诸如焊球的可重新构件，以及位于可重整构件周围的弹性构件。 弹性构件在可重整构件上施加环形力，使得当可重整构件软化时，弹性构件使可重整构件伸长。 该伸长率适应上述基底与在可重整构件的自由端连接的另一基底之间的热应力和其它应力。 还提供了一种用于将弹性构件定位在可重整构件上和周围的装置。

公开(公告)号：US20030160668A1

公开(公告)日：2003-08-28

申请号：US10085492

申请日：2002-02-27

Inventor： James W. Stansbury

IPC: H03J003/20

CPC classification number: H05K1/18 ,  H01F17/02 ,  H01F21/04 ,  H01F41/045 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2203/171

Abstract: A tuning circuit for a circuit board having an inductor coupling a first and a second trace, the tuning circuit including a first tuning coil having a loop partially extending over the inductor and a second tuning coil having a loop also partially extending over the inductor. The loop of the second tuning coil also partially extends over the loop of the first tuning coil. The circuit is tuned by adjusting the spacing between the loops of the first and second tuning coils and/or adjusting the spacing between the loops and the circuit board.

Abstract translation: 一种用于具有耦合第一和第二迹线的电感器的电路板的调谐电路，所述调谐电路包括具有部分地延伸到所述电感器上的环路的第一调谐线圈和具有也部分地延伸到所述电感器上的环路的第二调谐线圈。 第二调谐线圈的环路也部分地延伸超过第一调谐线圈的环路。 通过调整第一和第二调谐线圈的环路之间的间距和/或调节环路和电路板之间的间距来调节电路。

公开(公告)号：US06409520B1

公开(公告)日：2002-06-25

申请号：US09919431

申请日：2001-07-31

Applicant: Bobby J. Self

Inventor： Bobby J. Self

IPC: H01R1200

CPC classification number: H01R4/02 ,  H01R12/52 ,  H01R12/7082 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10265 ,  H05K2201/1034

Abstract: An electrical connection structure and method allow the coupling of one printed circuit board with another without the use of cables or connectors. An edge of one printed circuit board contains a plurality of plated split holes. Within each hole, an electrically conductive leg is maintained by way of solder, thus providing electrical connectivity between the first and second printed circuit boards. Additionally, a method of soldering a wire coil into a series of such edge-positioned plated split holes and subsequently cutting the coil along the edge of the first printed circuit board will yield the desired conductive legs.

Abstract translation: 电连接结构和方法允许一个印刷电路板与另一个印刷电路板的耦合，而不使用电缆或连接器。 一个印刷电路板的边缘包含多个电镀分离孔。 在每个孔内，通过焊料保持导电支脚，从而提供第一和第二印刷电路板之间的电连接。 此外，将线圈焊接成一系列这种边缘定位的电镀分离孔并随后沿着第一印刷电路板的边缘切割线圈的方法将产生所需的导电支腿。

公开(公告)号：US06354845B1

公开(公告)日：2002-03-12

申请号：US09584988

申请日：2000-06-01

Applicant: Karl Erich Wolf ,  William Lonzo Woods, Jr.

Inventor： Karl Erich Wolf ,  William Lonzo Woods, Jr.

IPC: H01R1200

CPC classification number: H01R12/58 ,  H01R12/52 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/096 ,  H05K2201/10265 ,  H05K2201/10909

Abstract: An apparatus for connecting a plurality of electrical circuits borne upon a plurality of substrates is disclosed. A first substrate of the plurality of substrates has a first aperture having a first diametral displacement and a first inner wall. A portion of the first inner wall is electrically connected with a first circuit borne upon the first substrate. The apparatus comprises a sheet of electrically conductive material arranged to a displacement from an axis in a substantially helical orientation about the axis. The material has a spring characteristic when the helical orientation establishes the displacement at a spring displacement. The spring characteristic urges the conductive material to a greater displacement from the axis than the spring displacement and permits insertion of the apparatus in the first aperture. The spring characteristic and the first diametral dimension cooperate to seat the apparatus in the first aperture to establish electrical connection with the first circuit. The method comprises the steps of: (a) spirally winding a sheet of electrically conductive material to an insertion diametral displacement generally equal to or slightly greater than the first diametral displacement; and (b) urging the spirally wound sheet into the first aperture.

Abstract translation: 公开了一种用于连接承载在多个基板上的多个电路的装置。 多个基板的第一基板具有第一直径位移的第一孔和第一内壁。 第一内壁的一部分与承载在第一基板上的第一电路电连接。 该装置包括导电材料片，布置成围绕轴线以大致螺旋方向从轴线移位。 当螺旋方向确定弹簧位移时的位移时，该材料具有弹簧特性。 弹簧特性促使导电材料从轴线移动到比弹簧位移更大的位移，并允许将装置插入第一孔中。 弹簧特性和第一直径尺寸协调将装置安置在第一孔中以与第一电路建立电连接。 该方法包括以下步骤：（a）将一片导电材料螺旋卷绕到通常等于或略大于第一直径位移的插入直径位移; 和（b）将螺旋卷绕的片材推动到第一孔中。