公开(公告)号：US09293400B2

公开(公告)日：2016-03-22

申请号：US14590021

申请日：2015-01-06

Applicant: Infineon Technologies AG

Inventor： Sergey Ananiev

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H05K3/34

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.

公开(公告)号：US07458828B2

公开(公告)日：2008-12-02

申请号：US11624409

申请日：2007-01-18

Applicant: Slobadan Pavlovic

Inventor： Slobadan Pavlovic

IPC: H01R12/00

CPC classification number: H01R43/0256 ,  H01R4/023 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface mount electrical connector includes a terminal body having a first elongate member that cooperates with a housing to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having an aperture therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

Abstract translation: 表面安装电连接器包括终端主体，其具有与壳体配合的第一细长构件，以将终端主体固定到连接器壳体。 终端主体的第二细长构件包括具有穿过其中的孔的弯曲部分。 弯曲部分包括有助于自动组装操作的凸面，并且该孔有助于克服液体焊料中的表面张力，由此促进安全的电连接。

公开(公告)号：US07207837B2

公开(公告)日：2007-04-24

申请号：US11504176

申请日：2006-08-15

Applicant: Hiroshi Nakano

Inventor： Hiroshi Nakano

IPC: H01R13/70

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A circuit board connector (1) has a housing (10), male terminals (20) and fixing members (30). Each fixing member (30) is formed by bending a metal plate into an L-shape to define a mounting portion (31) to mount the fixing member (30) to the housing (10), and a bonding portion (32) to be soldered. The bonding portion (32) is formed with connecting pieces (33) by making U-shaped cuts through the bonding portion (32) and then bending areas enclosed by the cuts upward. A clearance (S) is defined between the bottom edge of the leading end of each connecting piece (33) and the corresponding through hole (34). The lower surfaces of the connecting pieces (33) and the inner surfaces of the through holes (34) can be soldered.

Abstract translation: 电路板连接器（1）具有壳体（10），阳端子（20）和固定构件（30）。 每个固定构件（30）通过将金属板弯曲成L形形成以形成用于将固定构件（30）安装到壳体（10）的安装部分（31）和形成为 焊接。 通过在接合部分（32）上形成U形切口，然后由向上切割的弯曲区域形成接合部分（32）。 在每个连接件（33）的前端的底部边缘和相应的通孔（34）之间限定有间隙（S）。 连接片（33）的下表面和通孔（34）的内表面可被焊接。

公开(公告)号：US20060113666A1

公开(公告)日：2006-06-01

申请号：US11282834

申请日：2005-11-21

Applicant: Jun Oonishi

Inventor： Jun Oonishi

IPC: H01L23/48

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component has an outer lead extending from a package for connection to a circuit pattern on a printed circuit board by using a connecting member. The outer lead has a hole having an opening at least on a connecting member facing side in a portion of the outer lead for connecting the outer lead to the circuit pattern.

Abstract translation: 表面安装的电子部件具有从用于连接到印刷电路板上的电路图案的封装件延伸的外部引线，通过使用连接部件。 外部引线具有至少在外部引线的一部分中的连接构件朝向侧的开口，用于将外部引线连接到电路图案。

公开(公告)号：US06527162B2

公开(公告)日：2003-03-04

申请号：US09907599

申请日：2001-07-19

Applicant: Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

Inventor： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC: B23K3102

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

公开(公告)号：US20020105790A1

公开(公告)日：2002-08-08

申请号：US09970355

申请日：2001-10-03

Inventor： Takumi Naruse ,  Kenichi Kozaki ,  Kazuhiro Eguchi ,  Katsumi Sasaki

IPC: H05K001/11

CPC classification number: H01R12/57 ,  H01P1/00 ,  H01P1/2053 ,  H01R12/52 ,  H01R12/718 ,  H01R12/721 ,  H05K3/3405 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10386 ,  H05K2201/10757 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A circuit component comprising a circuit board and a terminal for mounting the circuit board on a second circuit board. A length of the circuit board is 10 mm-80 mm, a difference in a coefficient of thermal expansion between the circuit board and the second circuit board is or 0.2null10null5/null C. greater. The terminal is made of an elastic material, and comprised of a first connection section, a second connection section and an elastic section disposed between the first and second connection sections. and the terminal separates the circuit board from the second circuit board by 0.3 mm-5 mm. In the circuit components of the present invention, deterioration in the conduction between the circuit board and the second circuit board due to heat cycles can be prevented. Thus, a circuit component having stable operating characteristics for a long period of time is obtained.

Abstract translation: 一种电路部件，包括电路板和用于将电路板安装在第二电路板上的端子。 电路板的长度为10mm-80mm，电路板和第二电路板之间的热膨胀系数差为0.2×10 -5 /℃。 端子由弹性材料制成，包括第一连接部分，第二连接部分和布置在第一和第二连接部分之间的弹性部分。 并且端子将电路板与第二电路板分开0.3mm-5mm。 在本发明的电路部件中，可以防止由于热循环导致的电路板和第二电路板之间的导通性的恶化。 因此，获得长时间具有稳定的工作特性的电路部件。

公开(公告)号：US05998239A

公开(公告)日：1999-12-07

申请号：US162003

申请日：1998-09-28

Applicant: Hisao Tomizawa

Inventor： Hisao Tomizawa

IPC: H01L23/367 ,  H01L29/06 ,  H05K1/02 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/31 ,  H01L23/367 ,  H05K3/341 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L29/0657 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/10158 ,  H05K1/0203 ,  H05K2201/0373 ,  H05K2201/066 ,  H05K2201/10568 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A method of manufacturing a semiconductor device with a mount 2 secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.

Abstract translation: 一种制造半导体器件的方法，其具有固定在电路板1上以将二极管芯片3支撑在其上的安装件2。 形成在安装件2上的多个支脚7,12与电路板1上的电极4接触以形成至少凹陷14.支架2还具有形成在周边的与电极4相对的倾斜表面8 焊料9填充在支腿7,12之间的凹陷14和电路板1与安装件2的倾斜表面8之间的扩口区域13中，以防止支架从电极4剥离或脱离。

公开(公告)号：US5666721A

公开(公告)日：1997-09-16

申请号：US373785

申请日：1995-01-17

Applicant: Shoji Sakemi

Inventor： Shoji Sakemi

IPC: H01R12/72 ,  H01R43/20 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H01R9/00

CPC classification number: H01R43/205 ,  H05K1/117 ,  H05K3/3405 ,  H01R12/725 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2203/0545 ,  H05K2203/167 ,  H05K3/305 ,  H05K3/3426 ,  H05K3/3484 ,  Y10T29/49149

Abstract: A lead 20 protrudes from a main body 19a of a connector 18. A connector electrode 13 extends along a surface 10a of a printed circuit board 10. A solder paste 26, applied onto the connector electrode 13, is offset a predetermined distance inward from the edge of the printed circuit board 10. The lead 20 is shifted along the surface of connector electrode 13 inwardly from the edge of the printed circuit board 10 until a distal end 20a of the lead 20 is brought into contact with the solder paste 26. Then, the solder paste 26 is melted under the condition where the distal end 20a is brought into contact with the solder paste 26, thereby soldering the connector 18 on the printed circuit board 10.

Abstract translation: 引线20从连接器18的主体19a突出。连接器电极13沿着印刷电路板10的表面10a延伸。施加到连接器电极13上的焊膏26从内部偏离预定距离 引线20从连接器电极13的表面向内移动，从印刷电路板10的边缘向内移动，直到导线20的远端20a与焊膏26接触。然后， 焊膏26在远端20a与焊膏26接触的状态下熔化，从而将连接器18焊接在印刷电路板10上。

公开(公告)号：US5659953A

公开(公告)日：1997-08-26

申请号：US464384

申请日：1995-06-05

Applicant: Stanford W. Crane, Jr. ,  Maria M. Portuondo

Inventor： Stanford W. Crane, Jr. ,  Maria M. Portuondo

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01R9/00 ,  H05K3/00

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4623 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  H05K3/321 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及在所述多层基板的内表面上的所述阱内形成的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从所述多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

公开(公告)号：US5543586A

公开(公告)日：1996-08-06

申请号：US208519

申请日：1994-03-11

Applicant: Stanford W. Crane, Jr. ,  Maria M. Portuondo

Inventor： Stanford W. Crane, Jr. ,  Maria M. Portuondo

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H05K1/02

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4623 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  H05K3/321 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及形成在多层基板的内表面上的阱内的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。