公开(公告)号：US3625783A

公开(公告)日：1971-12-07

申请号：US3625783D

申请日：1969-05-07

Applicant: WESTERN ELECTRIC CO

Inventor： COUCOULAS ALEXANDER

IPC: H01L21/607 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  B29C27/08 ,  B23K31/02 ,  B65C9/04

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/3421 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/1078 ,  H05K2201/10924 ,  H05K2201/10977 ,  H05K2203/0278

Abstract: Methods and apparatus for simultaneously bonding a plurality of first workpieces to spaced-apart locations on at least one second workpiece. The invention is particularly suited for simultaneously bonding a plurality of lead wires to the terminal land areas of an integrated circuit or other electronic device. A deformable, compliant support member is spirally wound with a continuous metallic filament. After the spiral has been formed it is secured to the support member by any suitable adhesive means. The edges of the support member are sheared to cut the spiral windings and thus form a plurality of lead wires. The indentations which are formed on the reverse side of the support member when the spiral is cut may be used for alignment purposes. Thermal and/or mechanical bonding energy applied through the support member bonds the plurality of lead wires to the integrated circuit.

公开(公告)号：US3056939A

公开(公告)日：1962-10-02

申请号：US4532360

申请日：1960-07-26

Applicant: ILLINOIS TOOL WORKS

Inventor： RAYBURN CHARLES C

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10871 ,  H05K2201/10878

公开(公告)号：US11710931B2

公开(公告)日：2023-07-25

申请号：US17341083

申请日：2021-06-07

Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD

Inventor： Xiaogang Liu ,  Kun Liu ,  Rongzhe Guo ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A backplane connector includes a housing and a number of terminal modules assembled to the housing. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space. The terminal module includes a first signal terminal and a second signal terminal. The housing includes a number of insulating protrusions integrally extending from the base. The insulating protrusions extend into the receiving space. The terminal modules are assembled in the insulating protrusions. Compared with the prior art, the insulating protrusions of the present disclosure is integrally formed with the base, thereby improving the structural strength of the housing and improving the durability of the backplane connector.

公开(公告)号：US11705670B2

公开(公告)日：2023-07-18

申请号：US17340974

申请日：2021-06-07

Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD

Inventor： Xiaogang Liu ,  Kun Liu ,  Rongzhe Guo ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A backplane connector includes a housing, a number of terminal modules, a metal shielding surrounding portion and a mounting block. The housing includes a base, a receiving groove and a number of insulating protrusions integrally extending from the base. The terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot. The second signal terminal has a second mounting foot. The metal shield surrounding member includes a first tail portion, a second tail portion and a hollow portion sleeved on the insulating protrusion. The mounting block is received in the receiving groove. As a result, the shielding effect of the backplane connector is improved.

公开(公告)号：US11699880B2

公开(公告)日：2023-07-11

申请号：US17334157

申请日：2021-05-28

Applicant: Dongguan Luxshare Technologies Co., Ltd

Inventor： Tao Song ,  Kun Liu ,  Rongzhe Guo ,  Chuanqi Gong ,  Xiaogang Liu ,  Ming Li

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A backplane connector includes a number of wafers and a spacer for assembling the number of wafers together. Each wafer includes an insulating frame. The insulating frame includes a first protrusion. The spacer includes a body portion. The body portion has a number of slots for holding the first protrusions of the wafers. A periphery of each slot is surrounded by the body portion. Compared with the prior art, the spacer of the present disclosure is provided with a number of slots for holding the first protrusions of the wafers. As a result, the wafers can be easily assembled and fixed as a whole.

公开(公告)号：US11674977B2

公开(公告)日：2023-06-13

申请号：US17682769

申请日：2022-02-28

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/0466 ,  G01R1/0735 ,  G01R1/07364 ,  H05K1/0268 ,  H05K1/0283 ,  H05K1/0296 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US20180323010A1

公开(公告)日：2018-11-08

申请号：US15810738

申请日：2017-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Jae Yeol CHOI ,  Young Ghyu AHN ,  Soo Hwan SON ,  Se Hun PARK ,  Gu Won JI

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01G4/232 ,  H01G2/065 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/1078

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

公开(公告)号：US20180070449A1

公开(公告)日：2018-03-08

申请号：US15560264

申请日：2016-03-08

Applicant: OMRON Corporation

Inventor： Seiki Shimoda ,  Masaaki Abe

IPC: H05K1/18 ,  H01H50/02 ,  H01H50/14

CPC classification number: H05K1/181 ,  H01H50/023 ,  H01H50/043 ,  H01H50/047 ,  H01H50/14 ,  H01H51/229 ,  H01H2001/5888 ,  H05K2201/10053 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10931

Abstract: An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

公开(公告)号：US09865953B2

公开(公告)日：2018-01-09

申请号：US15646234

申请日：2017-07-11

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/415 ,  H01R13/11 ,  H01R43/04 ,  H01R12/71

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US09761972B2

公开(公告)日：2017-09-12

申请号：US15200695

申请日：2016-07-01

Applicant: MERCURY SYSTEMS, INC.

Inventor： Philip Beucler ,  Daniel Coolidge ,  Darryl J. McKenney ,  Kevin Jorczak

IPC: H01R9/05 ,  H01R12/71 ,  H01R12/58 ,  H01R13/652 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.