公开(公告)号：US5736784A

公开(公告)日：1998-04-07

申请号：US740595

申请日：1996-10-31

Applicant: Lewis R. Dove

Inventor： Lewis R. Dove

IPC: H01L23/498 ,  H01L23/66 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/48 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/45 ,  H05K1/0243 ,  H05K3/3426 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/45013 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01031 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/141 ,  H05K2201/0792 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A variable-width lead interconnection structure disposed between a printed circuit board and a multichip module is presented. An edge clip with leads having a widened middle section is provided to optimize manufacturability and electrical performance. Each lead has a characteristic width and spacing of conventional leads where the leads are soldered to a multichip module or PCB. However, in between each end, each lead has a middle section that is widened to provide a characteristic impedance closer to the ideal 50 ohms, thus producing structures with better return loss at high frequencies.

Abstract translation: 提出了布置在印刷电路板和多芯片模块之间的可变宽度引线互连结构。 提供具有加宽中间部分的引线的边缘夹以优化可制造性和电性能。 每个引线具有传统引线的特征宽度和间距，其中引线焊接到多芯片模块或PCB。 然而，在每个端部之间，每个引线具有被加宽的中间部分，以提供更接近理想的50欧姆的特征阻抗，从而产生在高频下具有更好的回波损耗的结构。

公开(公告)号：US5484964A

公开(公告)日：1996-01-16

申请号：US384186

申请日：1995-02-06

Applicant: Peter F. Dawson, deceased ,  by Shirley B. Dawson, executor ,  Jacques Leibovitz ,  Voddarahalli K. Nagesh

Inventor： Peter F. Dawson, deceased ,  by Shirley B. Dawson, executor ,  Jacques Leibovitz ,  Voddarahalli K. Nagesh

IPC: H01L23/498 ,  H05K3/34 ,  H05K1/14

CPC classification number: H01L23/49811 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10946 ,  Y02P70/613

Abstract: The present invention is a double headed pin for electrically interconnecting a PGA substrate carrier to a surface mount printed circuit board. The double headed pins provide for a stronger interconnection to the conductive pads on the surface mount printed circuit board. The increase in contact and soldering wetting area makes the interconnections stronger and more durable.

Abstract translation: 本发明是用于将PGA基板载体电连接到表面安装印刷电路板的双头引脚。 双头引脚提供了与表面贴装印刷电路板上的导电焊盘更牢固的互连。 接触和焊接润湿区域的增加使互连更坚固，更耐用。

公开(公告)号：US5315484A

公开(公告)日：1994-05-24

申请号：US972922

申请日：1992-11-06

Applicant: Seiji Asano

Inventor： Seiji Asano

IPC: H01H1/58 ,  H01H3/16 ,  H01H11/00 ,  H05K1/11 ,  H05K3/34 ,  H05K1/16

CPC classification number: H05K3/3421 ,  H01H1/5805 ,  H05K1/111 ,  H01H11/00 ,  H01H3/16 ,  H05K2201/09663 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2201/10818 ,  H05K2203/042 ,  H05K2203/044 ,  H05K2203/048 ,  H05K3/3452 ,  H05K3/3468 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board is provided with two soldering land portions on respective lead lines. Each of the soldering land portions has two sub-soldering land portions and a narrow connecting portion for connecting the sub-soldering portions, so that the land portions are substantially H-shaped. When the printed circuit board is dip soldered after being coated with a solder-proof layer exposing the soldering land portions, solder sticks to the soldering land portions in such a way that it is thicker on the sub-soldering land portions but thinner on the narrow connecting portions. Thereafter, the synchro contacts of a camera flash unit are positioned on the respective narrow connecting portions and soldered to the lead lines by a soldering iron or hot air.

Abstract translation: 印刷电路板在各自的引线上设置有两个焊接区域。 每个焊接部分具有两个子焊接台面部分和用于连接副焊接部分的窄连接部分，使得焊盘部分大致为H形。 当印刷电路板在涂覆有暴露焊接部分的防焊层之后进行浸焊时，焊料粘附到焊接焊盘部分，使得它们在次焊接焊盘部分上较厚，而在窄焊盘 连接部分。 此后，相机闪光灯单元的同步触点位于相应的窄连接部分上，并通过烙铁或热空气焊接到引线。

公开(公告)号：US4864079A

公开(公告)日：1989-09-05

申请号：US166128

申请日：1988-03-09

Applicant: Alan Barlow

Inventor： Alan Barlow

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H05K2201/09772 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: A surface-mounted electrical component has rectangular section leads that project outwardly from the edges of the component body. The leads are bent down towards the surface of the substrate and are twisted through 90 degrees about their length to make the leads compliant in a direction transverse of their width where they emerge from the body. The lower end of the leads are straight and untwisted, making a vertical butt solder joint with contact pads on the substrate. The twisted region of the leads are treated, such as by nickel plating, to render them non-wetted by solder. Because of the greater spacing possible between the contact pads, conductive tracks can extend through gaps between the contact pads beneath the body of the component.

Abstract translation: 表面安装的电气部件具有从部件主体的边缘向外突出的矩形截面引线。 引线朝向基板的表面向下弯曲并围绕其长度扭转90度，以使引线在横向于其宽度的方向上从它们从主体出来。 引线的下端是直的和未扭曲的，使得在基板上具有接触焊盘的垂直对接焊点。 处理引线的扭曲区域，例如通过镀镍处理，使其不被焊料润湿。 由于接触焊盘之间的间隔越大，导电轨迹可以延伸穿过部件主体下方的接触垫之间的间隙。

公开(公告)号：US4751199A

公开(公告)日：1988-06-14

申请号：US5675

申请日：1987-01-21

Applicant: William S. Phy

Inventor： William S. Phy

IPC: H05K1/02 ,  H05K3/34 ,  H05K7/12 ,  H05K5/00

CPC classification number: H05K7/12 ,  H05K3/3426 ,  H05K1/0271 ,  H05K2201/10719 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/53174

Abstract: A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a strip form by means of break tabs disposed between adjacent elements. Each terminal element provides two spaced, generally parallel mounting surfaces that are resiliently connected to one another by means of an integral intermediate section. While the terminal elements are interconnected in strip form, one of the mounting surfaces of each element can be bonded to an associated attachment region on the semiconductor substrate. After all of the terminals of the strip have been so bonded, the break tabs between adjacent terminals can be removed to thereby separate the terminals from one another. The package which then results contains discrete compliant terminals which are suitable for subsequent surface attachment to the printed circuit board.

Abstract translation: 适用于集成电路封装的阵列类型的引线框架，以提供用于吸收由热变化引起的机械应力的高度依从性，包括一系列单独的端子元件，其通过设置的断开突片连接成带状 在相邻元素之间。 每个端子元件提供两个间隔开的，大致平行的安装表面，其通过一体的中间部分弹性地相互连接。 当端子元件以带状形式互连时，每个元件的一个安装表面可以结合到半导体衬底上的相关联的附接区域。 在条的所有端子已经被接合之后，可以去除相邻端子之间的断开突片，从而将端子彼此分开。 然后结果的封装包含适合于后续表面连接到印刷电路板的分立的柔性端子。

公开(公告)号：US4672358A

公开(公告)日：1987-06-09

申请号：US864777

申请日：1986-05-19

Applicant: Theodore S. Pryst ,  John G. Kirschner

Inventor： Theodore S. Pryst ,  John G. Kirschner

IPC: H01C1/01 ,  H01C1/034 ,  H01C1/084 ,  H01C1/14 ,  H01C1/148 ,  H01C13/02 ,  H01C17/00 ,  H01F27/29 ,  H01G4/224 ,  H01G4/252 ,  H01L23/48 ,  H05K1/18 ,  H05K3/34 ,  H01C1/02

CPC classification number: H05K3/3426 ,  H01C17/006 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point on the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.

Abstract translation: 可以使用常规设计的功率电阻作为其核心来制造表面贴装功率电阻器。 传统的电阻器被重新加工，以便使其引线从靠近其从电阻器的大致管状体到引线端部的出现点平坦化。 然后将返工电阻器从一个引线的平坦部分上的点封装到另一个引线上的对应点，所得到的模具被成形为具有至少两个相对的平坦表面。 然后从成形体出来的引线的带状部分根据需要成型，以提供成品。 可以为具有轴向引线的任何部件制造类似的表面贴装电气部件。

公开(公告)号：US4333069A

公开(公告)日：1982-06-01

申请号：US206703

申请日：1980-11-14

Applicant: Joseph P. Worth ,  Bert B. Fletcher

Inventor： Joseph P. Worth ,  Bert B. Fletcher

IPC: H01C1/01 ,  H01C1/14 ,  H01C17/28 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01C17/28 ,  H01C1/01 ,  H01C1/14 ,  H05K3/308 ,  H01F2027/295 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/166 ,  H05K3/3447 ,  Y10T29/49082 ,  Y10T29/49087

Abstract: An electrical resistor comprising an elongated resistor body having a resistance wire winding extending between its ends and terminals at each end contact the resistance winding and each comprise a strip of given width having a first end portion extending about and secured with an end of the body, and a second end portion which extends in a direction transverse to the axis of the body and has a tip for being received through an opening in a printed circuit board. Each strip has an intermediate neck portion of reduced width which is positioned proximate to the resistor body and is twisted so that the second portion extends in a plane which is perpendicular to the axis of the body and in the same direction with and spaced from that of the other terminal allowing adjustment of the distance between their tips. The second end portions each have a shoulder proximate to its tip which is seated on the surface of a circuit board, fixing the position of the resistor and stabilizing its mounting thereon.The method of making an electrical resistor comprises the steps of segmenting a continuous wire wound core to provide resistor bodies, and cutting out portions of a continuous substantially plane strip of metal material at spaced locations therealong to provide narrow neck regions, and first and second end portions above and below each neck region.

Abstract translation: 一种电阻器，包括细长电阻体，其具有在其端部之间延伸的电阻线绕组和在每个端部处的端子与电阻绕组接触，并且每个包括具有给定宽度的条带，该第一端部围绕主体的端部延伸并固定， 以及第二端部，该第二端部在横向于所述主体的轴线的方向上延伸并且具有用于通过印刷电路板中的开口接收的尖端。 每个条具有减小的宽度的中间颈部，其位于接近电阻体的位置，并且被扭转，使得第二部分在垂直于主体的轴线并沿与该主体的轴线相同的方向延伸并且与 另一个终端允许调整他们的提示之间的距离。 第二端部各自具有靠近其尖端的肩部，其位于电路板的表面上，固定电阻器的位置并稳定其安装在其上。 制造电阻器的方法包括以下步骤：分割连续绕线芯以提供电阻体，并在其间隔开的位置处切割金属材料连续基本上平面的条的部分以提供窄的颈部区域，以及第一和第二端 每个颈部上方和下方的部分。

公开(公告)号：US3516155A

公开(公告)日：1970-06-23

申请号：US3516155D

申请日：1967-02-02

Applicant: BUNKER RAMO

Inventor： SMITH CHARLES W

IPC: H01R12/00 ,  H05K3/34 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0482 ,  H05K3/3421 ,  H05K3/3426 ,  H05K13/0465 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2203/0173 ,  H05K2203/1581 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T156/10

公开(公告)号：US20240341036A1

公开(公告)日：2024-10-10

申请号：US18372062

申请日：2023-09-23

Applicant: DARWIN PRECISIONS CORPORATION

Inventor： Yi Feng Chen ,  Chia Tsun Huang ,  Keng-Kuei Liang

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/0393 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/10818

Abstract: An electronic device includes a substrate, conductive circuit lines, an anisotropic conductive block, and a plastic layer. The substrate has an arrangement surface having a mounting area and a coverage area, and the coverage area surrounds the mounting area. The conductive circuit lines are arranged in the coverage area. Each of the conductive circuit lines partially passes through the mounting area. The anisotropic conductive block includes an anisotropic conductive layer. The anisotropic conductive layer has a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive block covers the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the coverage area.

公开(公告)号：US20190183125A1

公开(公告)日：2019-06-20

申请号：US16107755

申请日：2018-08-21

Applicant: Advanced Powertrain Engineering, LLC

Inventor： Paul Fathauer

IPC: A01N43/90 ,  A01N47/02 ,  C07D417/04 ,  C07D401/04 ,  C07D513/04 ,  A01N43/76 ,  C07D471/04 ,  C07D413/04 ,  A01N43/78 ,  C07D498/04

CPC classification number: A01N43/90 ,  A01N43/76 ,  A01N43/78 ,  A01N47/02 ,  C07D401/04 ,  C07D413/04 ,  C07D417/04 ,  C07D471/04 ,  C07D498/04 ,  C07D513/04 ,  F16K31/02 ,  H05K1/115 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.