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    Light emitting unit and liquid crystal display device using the same
    44.
    发明申请
    Light emitting unit and liquid crystal display device using the same 审中-公开
    发光单元和使用其的液晶显示装置

    公开(公告)号：US20090065797A1

    公开(公告)日：2009-03-12

    申请号：US12230447

    申请日：2008-08-28

    Applicant: Yong Suk Kim ,  Hoon Hur

    Inventor： Yong Suk Kim ,  Hoon Hur

    IPC: H01L21/00 ,  G02F1/1335

    CPC classification number: H05K1/142 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167

    Abstract: A light emitting unit capable of widely adjusting brightness or size, and a liquid crystal display device using the same are disclosed. The light emitting unit includes a circuit board including circuit lines having a plurality of connecting members, and a plurality of unit module connected to the connecting members of the circuit board. The unit module is coupled with at least one light emitting device.

    Abstract translation: 公开了能够广泛调节亮度或尺寸的发光单元以及使用其的液晶显示装置。 发光单元包括电路板，其包括具有多个连接构件的电路线，以及连接到电路板的连接构件的多个单元模块。 单元模块与至少一个发光装置耦合。

    Socket for Electronic Component
    45.
    发明申请
    Socket for Electronic Component 失效
    电子元器件插座

    公开(公告)号：US20080220631A1

    公开(公告)日：2008-09-11

    申请号：US11915349

    申请日：2006-05-25

    Applicant: Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

    Inventor： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

    IPC: H01R12/00

    CPC classification number: F21V29/56 ,  F21K9/00 ,  F21S2/005 ,  F21V19/0025 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/22 ,  H01R13/514 ,  H05K1/0204 ,  H05K1/142 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/209 ,  Y10S439/928

    Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

    Abstract translation: 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。

    Memory module
    48.
    发明授权
    Memory module 失效
    内存模块

    公开(公告)号：US07145779B2

    公开(公告)日：2006-12-05

    申请号：US11009250

    申请日：2004-12-10

    Applicant: Shih-Hsiung Lien

    Inventor： Shih-Hsiung Lien

    IPC: H05K7/10 ,  H05K7/02

    CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

    Abstract: A memory module includes a plurality of memory units and an assembling holder. Each of the memory units includes a memory substrate, at least a memory chipset having a predetermined memory capacity mounted on the memory substrate, and an electric terminal provided at a lower edge portion of the memory substrate. The assembling holder includes an elongated unit housing having an elongated receiving slot extended therealong and a signal terminal provided along the unit housing, wherein the electric terminals of the memory substrates are detachably inserted into the receiving slot of the unit housing to electrically connect the electric terminals with the signal terminal, such that the memory units are alignedly and detachably mounted along the receiving slot in an edge to edge manner.

    Abstract translation: 存储器模块包括多个存储器单元和组装保持器。 每个存储器单元包括存储器基板，至少存储器芯片组具有安装在存储器基板上的预定存储器容量，以及设置在存储器基板的下边缘部分处的电端子。 组装保持器包括细长单元壳体，其具有沿其延伸的细长接收槽和沿单元壳体设置的信号端子，其中存储器基板的电端子可拆卸地插入到单元壳体的接收槽中，以电连接电端子 信号端子，使得存储器单元沿着接收槽以边缘到边缘的方式对齐地和可拆卸地安装。

    Memory module
    50.
    发明申请
    Memory module 失效
    内存模块

    公开(公告)号：US20050127368A1

    公开(公告)日：2005-06-16

    申请号：US10998312

    申请日：2004-11-26

    Applicant: Shih-Hsiung Lien

    Inventor： Shih-Hsiung Lien

    IPC: G11C5/04 ,  H05K1/11 ,  H05K1/14 ,  H01L29/04

    CPC classification number: G11C5/04 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/209

    Abstract: The memory module includes a plurality of memory units, each of which include a memory substrate, at least a memory chip having a predetermined memory capacity mounted on the memory substrate, and a conductive terminal provided at a lower edge portion of the memory substrate to electrically connect with the memory chip. An assembling arrangement includes a first joint provided at a side edge of each of the memory substrates and a second joint provided at an opposed side edge of each of the memory substrates, wherein the first joint of the memory unit is detachably engaged with the second joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner, such that the memory units form the memory module.

    Abstract translation: 存储器模块包括多个存储器单元，每个存储器单元包括存储器基板，至少一个具有安装在存储器基板上的预定存储器容量的存储器芯片，以及设置在存储器基板的下边缘部分处以电 连接内存芯片。 组装装置包括设置在每个存储器基板的侧边缘处的第一接头和设置在每个存储器基板的相对侧边缘处的第二接头，其中存储单元的第一接头可拆卸地与第二接头 以使得存储器单元以边缘到边缘方式彼此对准地连接，使得存储器单元形成存储器模块。

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