公开(公告)号：US20160099498A1

公开(公告)日：2016-04-07

申请号：US14870273

申请日：2015-09-30

Applicant: ROGERS CORPORATION

Inventor： Kristi Pance ,  Karl Sprentall ,  Murali Sethumadhavan

IPC: H01Q1/38 ,  H01F10/28 ,  H01F1/055 ,  H01Q1/48

CPC classification number: H01Q1/38 ,  H01F1/0551 ,  H01F1/344 ,  H01F1/37 ,  H01F10/205 ,  H01F10/28 ,  H01Q1/48 ,  H01Q15/004 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/083

Abstract: A magneto-dielectric substrate includes a first dielectric layer, a second dielectric layer spaced apart from the first dielectric layer, and at least one magnetic reinforcing layer disposed between and in intimate contact with the first dielectric layer and the second dielectric layer.

Abstract translation: 磁介电基片包括第一介电层，与第一介电层隔开的第二电介质层，以及至少一个磁性增强层，设置在第一介电层和第二电介质层之间并与之紧密接触。

公开(公告)号：US20160079506A1

公开(公告)日：2016-03-17

申请号：US14950136

申请日：2015-11-24

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.

Abstract translation: 布线基板包括陶瓷层和导电构件。 陶瓷层具有最上层的陶瓷层和最下层的陶瓷层。 导电构件包括设置在最上层陶瓷层的上表面上的上导电层，介于陶瓷层之间的内导电层和设置在最下陶瓷层下表面的下导电层。 导电构件限定了将上导电层，内导电层和下导电层电连接的通孔。 连接到下导电层的第一通孔的总数大于连接到上导电层的第二通孔的总数。

公开(公告)号：US09282637B2

公开(公告)日：2016-03-08

申请号：US13968812

申请日：2013-08-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Jin Yun ,  Hyuk Soo Lee ,  In Hee Cho ,  Jae Man Park ,  Myeong Jeong Kim ,  Jong Heum Yoon ,  Jeung Ook Park ,  Jong Sik Lee ,  Gun Young Gil ,  Thanh Kieu Giang ,  Jin Hwan Kim

IPC: B32B27/38 ,  H05K1/02 ,  H05K1/03 ,  C08G59/28 ,  C08G59/30 ,  C08L63/00 ,  H05K1/05 ,  C08K3/00

CPC classification number: H05K1/0373 ,  C08G59/28 ,  C08G59/30 ,  C08K3/013 ,  C08L63/00 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0209 ,  C08K3/0033

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract translation: 提供了包含环氧树脂的环氧树脂化合物，该环氧树脂包括结晶环氧树脂，固化剂和无机填料。 另外，提供了一种辐射热电路板，其包括金属板，形成在金属板上的绝缘层; 以及形成在绝缘层上的电路图案，其中通过固化包括结晶环氧树脂，固化剂和无机填料的环氧树脂的环氧树脂化合物来形成绝缘层。

公开(公告)号：US20160066431A1

公开(公告)日：2016-03-03

申请号：US14938354

申请日：2015-11-11

Applicant: Mitsubishi Electric Corporation

Inventor： Sohei SAMEJIMA ,  Tsuyoshi OZAKI ,  Hiroyuki OSUGA ,  Teruhiko KUMADA

IPC: H05K3/00 ,  H05K3/40

CPC classification number: H05K3/445 ,  H05K3/0011 ,  H05K3/02 ,  H05K3/40 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09809

Abstract: A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.

Abstract translation: 制造印刷电路板（10）的方法包括以下步骤：形成包括具有主通孔（3a）的碳纤维增强塑料的芯体; 在所述芯的下表面上形成第一粘合构件（4a）以覆盖所述主通孔（3a）; 将绝缘构件加载到所述主通孔（3a）中; 在所述芯的上表面上形成第二粘合构件（4b）; 在所述第一粘合部件（4a）的下方形成第三粘接部件（6a）。 在第二粘合部件（4b）上形成第四粘合部件（6b）; 并在芯上形成互连。

公开(公告)号：US20160060429A1

公开(公告)日：2016-03-03

申请号：US14775691

申请日：2014-10-23

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： YUKI KITAI ,  HIROAKI FUJIWARA ,  HIROSUKE SAITO

IPC: C08K5/521 ,  H05K1/03 ,  C08K3/34 ,  C08K5/5399 ,  C08K3/36

CPC classification number: C08K5/521 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2300/24 ,  C08J2371/12 ,  C08K3/34 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5399 ,  C08K2201/014 ,  C08L63/00 ,  C08L71/126 ,  C08L79/04 ,  C08L101/00 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.

Abstract translation: 热固性树脂组合物含有热固性树脂，能够与热固性树脂反应的固化剂和阻燃剂。 阻燃剂包含与热固性树脂和硬化剂的混合物相容的第一荧光体化合物和与该混合物不相容的第二荧光体化合物。

公开(公告)号：US20160014892A1

公开(公告)日：2016-01-14

申请号：US14861272

申请日：2015-09-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sumiyo Nakamura ,  Takahiro Sumi ,  Takahiro Oka

IPC: H05K1/03 ,  H05K3/12 ,  H05K1/11 ,  H05K3/46 ,  C04B35/20 ,  H05K1/02

CPC classification number: H05K1/0306 ,  C04B35/195 ,  C04B35/20 ,  C04B35/62218 ,  C04B35/62625 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/80 ,  H01L21/4867 ,  H01L23/12 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/099 ,  H05K2201/09909 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract translation: 提供一种绝缘陶瓷膏，陶瓷电子元件，以及陶瓷电子元件的制造方法，能够防止窄间距端子电极之间的焊料短路，并抑制覆盖一部分端子电极的绝缘体的裂纹产生 点火步骤 陶瓷电子部件包括陶瓷多层基板，形成在陶瓷多层基板的表面上的端子电极和形成在陶瓷多层基板的表面上以覆盖一部分端子电极的绝缘陶瓷膜。 绝缘陶瓷膜的暴露表面部分（富含凝胶层的层）的热膨胀系数低于陶瓷多层基板的热膨胀系数。

公开(公告)号：US09235121B2

公开(公告)日：2016-01-12

申请号：US14237618

申请日：2012-08-09

Applicant: Toshimasa Nagoshi ,  Shigeo Tanaka

Inventor： Toshimasa Nagoshi ,  Shigeo Tanaka

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/027 ,  H05K3/28 ,  C08G59/18 ,  C08L63/00 ,  C08L63/10

CPC classification number: G03F7/0388 ,  C08G59/1455 ,  C08G59/186 ,  C08L63/00 ,  C08L63/10 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  H05K3/287 ,  H05K2201/0209

Abstract: The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.

Abstract translation: 本发明提供一种感光性树脂组合物，其包含（a）成分：酸改性环氧树脂，（b）成分：具有烯键式不饱和基团的光聚合性单体，（c）成分：光聚合引发剂，（d ）组分：环氧树脂和（e）组分：无机填料，其中（a）组分包含酸改性的双酚型酚醛清漆型环氧树脂，并且感光性树脂组合物还满足预定条件，并提供感光性膜 永久抗蚀剂和使用其的永久抗蚀剂的制造方法。

公开(公告)号：US09232655B2

公开(公告)日：2016-01-05

申请号：US14582282

申请日：2014-12-24

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Hiroto Tamaki

IPC: H01L33/00 ,  H05K1/18 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.

Abstract translation: 在包括含有银的导电构件的布线基板中抑制了变色。 布线基板包括陶瓷层和包括设置在陶瓷层的上表面上的导电层的导电构件。 导电构件包括银，并且导电层的上表面的至少一部分被覆盖层覆盖。 覆盖层包括层叠在无机反射层上的无机反射层和玻璃层。

公开(公告)号：US20150319853A1

公开(公告)日：2015-11-05

申请号：US14647272

申请日：2013-11-27

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： Tomo CHIBA ,  Hiroshi TAKAHASHI ,  Eisuke SHIGA ,  Yoshihiro KATO

IPC: H05K1/03 ,  C08J5/24 ,  H05K1/05 ,  C08L63/00

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2457/08 ,  C08F283/124 ,  C08G59/245 ,  C08G59/3218 ,  C08G73/0655 ,  C08J5/24 ,  C08J2363/00 ,  C08J2463/04 ,  C08J2479/00 ,  C08J2483/07 ,  C08K3/36 ,  C08K5/315 ,  C08L51/085 ,  C08L61/06 ,  C08L63/00 ,  C08L79/04 ,  C08L79/085 ,  C08L2203/20 ,  C08L2205/035 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10T428/24802 ,  Y10T428/249921 ,  Y10T428/2962 ,  Y10T442/2951 ,  C08F220/10

Abstract: An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

Abstract translation: 本发明的目的是提供一种树脂组合物，其具有用于诸如高阻燃性的印刷电路板材料所需的各种性能，并且可以获得具有高成型性的固化产物，在去污步骤中具有高抗化学药品 ，小的热膨胀系数，包含树脂组合物的预浸料，包含预浸料的层压体，包括预浸料的金属箔包覆层压板和包括预浸料的印刷电路板。 包含丙烯酸 - 硅氧烷共聚物（A），无卤环氧树脂（B），氰酸酯化合物（C）和/或酚醛树脂（D）和无机填料（E）的树脂组合物。

公开(公告)号：US20150313012A1

公开(公告)日：2015-10-29

申请号：US14647672

申请日：2013-01-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Guangbing CHEN ,  Xianping ZENG

IPC: H05K1/03 ,  C08K5/3417 ,  B32B15/20 ,  C08L71/00 ,  B32B15/14 ,  C08G65/48 ,  C08K5/53

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G65/485 ,  C08G77/20 ,  C08J5/24 ,  C08K5/3417 ,  C08K5/53 ,  C08K5/5425 ,  C08K5/549 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L83/04 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209

Abstract: Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.

Abstract translation: 在本发明中公开了一种树脂组合物，其包含改性聚苯醚树脂和含有不饱和双键的有机硅化合物。 还公开了使用上述树脂组合物制备高频电路基板的方法和通过该制备方法获得的高频电路基板。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高层间粘合力，低介电常数和低介电损耗角正切，并且非常适合作为电路基板 高频电子设备。