公开(公告)号：US08018568B2

公开(公告)日：2011-09-13

申请号：US12712096

申请日：2010-02-24

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

IPC: G02F1/13

CPC classification number: H01L31/022466 ,  B82Y10/00 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/1884 ,  H01L51/0021 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5253 ,  H01L2251/5369 ,  H05K1/095 ,  H05K3/06 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/026 ,  Y02E10/50

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US07875807B2

公开(公告)日：2011-01-25

申请号：US11673904

申请日：2007-02-12

Applicant: Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

Inventor： Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

IPC: H05K1/02

CPC classification number: H05K3/325 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13455 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0314 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/0542 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05147

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract translation: 电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成， 以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。 所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

公开(公告)号：US07851059B2

公开(公告)日：2010-12-14

申请号：US11529453

申请日：2006-09-28

Applicant: Gary Stevens ,  James D. B. Smith ,  John W. Wood

Inventor： Gary Stevens ,  James D. B. Smith ,  John W. Wood

IPC: B32B5/16 ,  B32B27/38 ,  B32B29/00

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

公开(公告)号：US20100239851A1

公开(公告)日：2010-09-23

申请号：US11529453

申请日：2006-09-28

Applicant: Gary Stevens ,  James D.B. Smith ,  John W. Wood

Inventor： Gary Stevens ,  James D.B. Smith ,  John W. Wood

IPC: B32B5/16 ,  B32B29/06 ,  C08L63/00

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

Abstract translation: 由主体树脂基体（42）和高导热性填料（30）构成的高导热性树脂，其混合在主体树脂内以形成树脂混合物。 填料包含至少3-5重量％的树脂混合物，并且填料在至少一个维度上平均为1-100nm，并且其中颗粒小于平均粒径为1000nm的颗粒' 最长尺寸。 主体树脂基体在高导热性填料（30）周围形成有序的树脂壳（40），由此树脂分子垂直于高热导率填料的表面排列。 在高导热性填料之间形成有序树脂壳（44）的重叠，使得通过树脂混合物产生有序树脂壳的连续路径。

公开(公告)号：US07442878B2

公开(公告)日：2008-10-28

申请号：US11538823

申请日：2006-10-05

Applicant: William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

Inventor： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

IPC: H05K1/16

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US20070072425A1

公开(公告)日：2007-03-29

申请号：US10574603

申请日：2004-10-06

Applicant: Fumiaki Kikui ,  Akio Morishita ,  Masato Yasuoka

Inventor： Fumiaki Kikui ,  Akio Morishita ,  Masato Yasuoka

IPC: H01L21/461 ,  H01L21/302 ,  H01L21/4763 ,  H01L29/94 ,  H01L27/108 ,  H01L29/76 ,  H01L31/119

CPC classification number: H05K1/056 ,  H05K1/053 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: A substrate according to the present invention includes a metal plate, and an insulating film, which is provided on the surface of the metal plate and which includes needle alumina particles and granular particles. The substrate of the present invention has excellent insulating property and can be manufactured on an industrial basis with acceptable efficiency.

Abstract translation: 根据本发明的基板包括金属板和绝缘膜，其设置在金属板的表面上并且包括针状氧化铝颗粒和颗粒状颗粒。 本发明的基板具有优异的绝缘性能，可以在工业上以可接受的效率制造。

公开(公告)号：US07062848B2

公开(公告)日：2006-06-20

申请号：US10665335

申请日：2003-09-18

Applicant: Alfred I-Tsung Pan ,  Yoocham Jeon ,  Scott Haubrich

Inventor： Alfred I-Tsung Pan ,  Yoocham Jeon ,  Scott Haubrich

IPC: H05K3/10 ,  H01B1/00

CPC classification number: H05K1/097 ,  B41M1/06 ,  B41M1/10 ,  B41M1/12 ,  B41M3/006 ,  B82Y30/00 ,  C09D11/30 ,  H01L29/7869 ,  H05K2201/0248 ,  Y10S977/786 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24893

Abstract: Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition, at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contact to provide a conductive path. The nanostructures arranged in a conductive path can be sintered or used as a conductive material without sintering.

Abstract translation: 用于制备导电路径的组合物和方法可以包括可印刷组合物，其包括液体载体和多个纳米结构。 多个纳米结构可以在液体载体内具有至少约5:1的纵横比。 纳米结构的实例包括纳米带，纳米板，纳米棒，纳米线，纳米棒以及这些材料的混合物。 这些可印刷组合物可用于在基材上形成导电路径。 可印刷组合物可以使用任何数量的常规印刷技术施加到基材上。 在施加可印刷组合物之后，可以除去液体载体的至少一部分，使得纳米结构可以充分接触以提供导电路径。 布置在导电路径中的纳米结构可以烧结或用作导电材料而不进行烧结。

公开(公告)号：US20060113680A1

公开(公告)日：2006-06-01

申请号：US11327260

申请日：2006-01-06

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: H01L23/48 ,  H01L23/28

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US20040201112A1

公开(公告)日：2004-10-14

申请号：US10411163

申请日：2003-04-10

Inventor： Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

IPC: H01L023/48 ,  H01L029/40 ,  H01L021/44

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

Abstract translation: 一种电子组件，包括第一电子元件，第二电子元件和它们之间的耐久性柔性接合。 该键包括包括细长导电颗粒的各向异性导电粘合剂。 该键通过细长的接触区域在第一电子元件和第二电子元件之间提供至少一个电路径。 该键在功能上维持至少约200个弯曲。

公开(公告)号：US06611065B2

公开(公告)日：2003-08-26

申请号：US09987396

申请日：2001-11-14

Applicant: Motohide Takeichi ,  Junji Shinozaki

Inventor： Motohide Takeichi ,  Junji Shinozaki

IPC: H01L2329

CPC classification number: H05K3/323 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/10674 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.