公开(公告)号：US06225572B1

公开(公告)日：2001-05-01

申请号：US09403966

申请日：1999-11-01

Applicant: Jean Marc Nicolaï ,  Marc Duarte

Inventor： Jean Marc Nicolaï ,  Marc Duarte

IPC: H05K116

CPC classification number: H05K3/3447 ,  H01R9/16 ,  H01R12/58 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/10401

Abstract: An assembly including a printed-circuit electronics card mounted on a metal substrate, and in electronic communication with the same, includes a capsule which is crimped into a cavity in the metal substrate and which extends through a hole in the electronics card, the edges of said hole being metallised, the capsule being soldered to the metallised area of the edges.

Abstract translation: 包括安装在金属基板上并与其电子连通的印刷电路电子卡的组件包括：胶囊，其被压接在金属基板中的空腔中并延伸穿过电子卡的孔， 所述孔被金属化，所述胶囊被焊接到边缘的金属化区域。

公开(公告)号：US5934914A

公开(公告)日：1999-08-10

申请号：US845016

申请日：1997-04-22

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC: B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

公开(公告)号：US5915754A

公开(公告)日：1999-06-29

申请号：US652381

申请日：1996-05-23

Applicant: Hans-Martin Hiller ,  Martin Stratmann ,  Wolfram Debus ,  Gunter Oppermann ,  Friedrich Werhahn

Inventor： Hans-Martin Hiller ,  Martin Stratmann ,  Wolfram Debus ,  Gunter Oppermann ,  Friedrich Werhahn

IPC: H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/3672 ,  H01L23/3677 ,  H01L23/3736 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10416 ,  Y10T29/49142 ,  Y10T29/49144

Abstract: A method of mounting an electronic power component to a cooling element includes finishing at least a bonding area of the cooling element with a finish for use during soldering, forming an indentation in the bonding area of the cooling element, placing adhesive in the indentation, attaching the power component to the cooling element using the adhesive, and thereafter soldering the power component to the cooling element. The finishing melts during soldering and the adhesive prevents shifting of the power component on the cooling element during soldering. Alternatively, the power component is attached to a printed circuit board by adhesive bonding prior to soldering.

Abstract translation: 一种将电子功率部件安装到冷却元件的方法包括：在焊接期间至少结合冷却元件的接合区域，以及在冷却元件的接合区域中形成压痕，将粘合剂放置在压痕中，连接 使用粘合剂将冷却元件的功率分量，然后将功率部件焊接到冷却元件。 在焊接期间精加工熔化，并且粘合剂防止在焊接期间功率部件在冷却元件上的移动。 或者，功率部件通过在焊接之前的粘结而附接到印刷电路板。

公开(公告)号：US5343616B1

公开(公告)日：1998-12-29

申请号：US83735792

申请日：1992-02-14

Applicant: ROCK LTD

Inventor： ROBERTS JOSEPH A

IPC: H05K1/09 ,  H01R12/04 ,  H01R31/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/38 ,  H05K3/46 ,  H05K7/14 ,  H05K9/00 ,  H05K3/02

CPC classification number: H05K7/1451 ,  H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49217 ,  Y10T29/49222 ,  Y10T29/49906

公开(公告)号：US5831835A

公开(公告)日：1998-11-03

申请号：US808785

申请日：1997-02-28

Applicant: Josef Dirmeyer ,  Christian Plankl ,  Marten Swart ,  Alfred Gottlieb

Inventor： Josef Dirmeyer ,  Christian Plankl ,  Marten Swart ,  Alfred Gottlieb

IPC: H05K7/06 ,  H05K1/00 ,  H05K1/18 ,  H05K3/20 ,  H05K7/02 ,  H05K9/00

CPC classification number: H05K7/02 ,  H05K3/202 ,  H05K1/0284 ,  H05K1/187 ,  H05K2201/0382 ,  H05K2201/09118 ,  H05K2201/09736 ,  H05K2201/10371 ,  H05K2201/2072 ,  H05K2203/1545

Abstract: A device with an electric circuit configuration includes electrical components and a pressed grid stamped from a metal strip for electrically conductively connecting the electrical components to one another. The pressed grid has bent-over large-area peripheral regions and a plug part with connection pins stamped out of the metal strip.

Abstract translation: 具有电路配置的装置包括电气部件和从金属带冲压的用于将电气部件彼此导电连接的压制网格。 压制的格栅具有弯曲的大面积周边区域和具有从金属条冲压出的连接销的插头部分。

公开(公告)号：US5812378A

公开(公告)日：1998-09-22

申请号：US511131

申请日：1995-08-04

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H05K7/12 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/72 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06733 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子的连接器包括具有多个孔的片状体，理想地布置成规则的格子图案。 每个孔设置有弹性层状接触，例如金属板的环，其具有在主体的第一主表面的孔的内部向内延伸的多个突起。 连接器主体的第二表面上的端子电连接到触点。 连接器可以附接到诸如多层电路板的基板，使得连接器上的端子电连接到基板内的引线。 具有凸起引线的微电子元件可以与连接器接合并且因此连接到基板，通过将凸块引线推进到连接器的孔中以与触点接合凸起引线。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US5703752A

公开(公告)日：1997-12-30

申请号：US518505

申请日：1995-08-23

Applicant: Suk Ha Woo

Inventor： Suk Ha Woo

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K7/20

CPC classification number: H05K3/4084 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/4092 ,  H05K3/44

Abstract: A heat dissipating apparatus for a semiconductor device for use in a motor drive that improves heat dissipation efficiency by transferring heat from the semiconductor device directly to a heat sink, using ground leads or nonconnection leads of element lead pins. In addition, it is possible to connect the semiconductor device to the heat sink without extra fixing members

Abstract translation: 一种用于电机驱动器中的半导体器件的散热装置，其通过使用元件引线引脚的接地引线或非连接引线将热量从半导体器件直接传递到散热器来提高散热效率。 此外，可以在没有额外的固定构件的情况下将半导体器件连接到散热器

公开(公告)号：US5590460A

公开(公告)日：1997-01-07

申请号：US277336

申请日：1994-07-19

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K3/36

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  H05K3/0032 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

Abstract translation: 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。 因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。

公开(公告)号：US5588207A

公开(公告)日：1996-12-31

申请号：US437085

申请日：1995-05-05

Applicant: Kouji Kawakita ,  Masahide Tsukamoto ,  Yasukiho Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

Inventor： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasukiho Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10 ,  H05K3/20

CPC classification number: H05K3/4046 ,  H01L2224/16237 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first conductive layer provided on the first surface of the base; a second conductive layer provided on the second surface of the base; and a conductive particle buried in each of the through-holes in a pressurized state for electrically connecting the first conductive layer and the second conductive layer.

Abstract translation: 一种双面印刷电路板，包括具有第一表面，基本上平行于第一表面的第二表面和形成在基底中的多个通孔的基底; 设置在所述基座的第一表面上的第一导电层; 设置在所述基座的第二表面上的第二导电层; 以及以加压状态掩埋在每个通孔中的导电颗粒，用于电连接第一导电层和第二导电层。

公开(公告)号：US5477612A

公开(公告)日：1995-12-26

申请号：US16002

申请日：1993-02-10

Applicant: Joseph A. Roberts

Inventor： Joseph A. Roberts

IPC: H05K1/09 ,  H01R12/04 ,  H01R31/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/38 ,  H05K3/46 ,  H05K7/14 ,  H05K9/00 ,  H05K3/02

CPC classification number: H05K7/1451 ,  H01R31/00 ,  H05K3/045 ,  H05K3/4614 ,  H05K9/0039 ,  H05K1/036 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4647 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49217 ,  Y10T29/49222 ,  Y10T29/49906

Abstract: A supported conductive network (SCN), which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The methods and apparatus for making the conductive network involve forming a sheet of conductive material into ridges and troughs one of which defines the conductive network and the other of which is waste material and then mechanically removing the waste material. The conductive network thus formed is supported by a dielectric layer.

Abstract translation: 可以是柔性或刚性的支撑导电网络（SCN）可以具有与其他网络的相应导体连接的自对准导体。 导电网络可以制成密集的接触簇，用作电连接器或电路。 用于制造导电网络的方法和装置包括将导电材料片形成为脊和槽，其中一个限定了导电网络，另一个限定了导电网络，另一个是废料，然后机械地除去废料。 由此形成的导电网络由电介质层支撑。