公开(公告)号：US09967981B2

公开(公告)日：2018-05-08

申请号：US15000432

申请日：2016-01-19

Applicant: Koito Manufacturing Co., Ltd.

Inventor： Yoshiaki Aiso ,  Koji Uchino ,  Hiromi Nakamura ,  Takayuki Otsubo

IPC: H01L33/62 ,  H05K3/10 ,  B60Q1/26 ,  H05K3/18 ,  F21S8/10 ,  B60Q1/34 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/105 ,  B60Q1/2696 ,  B60Q1/34 ,  F21S43/13 ,  F21S43/14 ,  F21S43/195 ,  F21S43/31 ,  F21S45/47 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin molded article, and a light emitting element mounted on the base unit and electrically connected to the first circuit pattern. The base unit includes a mounting surface portion directed in a prescribed direction such that the light emitting element is mounted thereon, and a sidewall surface portion connected to the mounting surface portion in a plane intersection state, and the sidewall surface portion is formed as an inclined surface intersecting with the mounting surface portion at an obtuse angle.

公开(公告)号：US09947989B2

公开(公告)日：2018-04-17

申请号：US14401418

申请日：2013-05-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Soon Young Hyun ,  So Yeon Kim ,  Won Ha Moon ,  Seok Bae ,  Nam Yang Lee ,  Hyung Eui Lee

IPC: H01Q1/24 ,  H01Q1/38 ,  H05K3/20 ,  H04M1/02 ,  H05K3/38

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H04M1/026 ,  H05K3/202 ,  H05K3/386 ,  H05K2201/086 ,  H05K2201/09018 ,  H05K2201/10098

Abstract: Provided are an antenna for a communication terminal, and a method of manufacturing the same, the antenna including: a communication terminal case; and a radiator layer formed of a metal material in an inner curved surface part of the communication terminal case.

公开(公告)号：US09894760B2

公开(公告)日：2018-02-13

申请号：US14993197

申请日：2016-01-12

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  Kenn Twigg ,  Jim Patterson

IPC: H05K1/11 ,  H05K1/05 ,  H05K1/09 ,  H01B13/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2203/0315

Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

公开(公告)号：US20180020549A1

公开(公告)日：2018-01-18

申请号：US15646086

申请日：2017-07-10

Applicant: ROHM CO., LTD.

Inventor： Motohiro TOYONAGA ,  Yasuhiro FUWA ,  Mamoru YAMAGAMI ,  Isamu NISHIMURA

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/31 ,  H05K1/11 ,  H05K3/00 ,  H01L23/00 ,  H05K1/02 ,  H05K3/28 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K1/186 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2924/15156 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10636 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/014

Abstract: An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.

公开(公告)号：US20180017813A1

公开(公告)日：2018-01-18

申请号：US15629610

申请日：2017-06-21

Applicant: Spy Eye, LLC

Inventor： Eric Anthony Perozziello ,  Edward John Palen ,  Michael West Wiemer

IPC: G02C11/00 ,  G02B27/01 ,  G02C7/04 ,  H01F27/28 ,  H01Q1/22 ,  H01Q9/04 ,  H05K3/18 ,  H05K3/10 ,  H05K3/00 ,  H05K1/16 ,  H05K1/11 ,  H05K1/09 ,  H05K1/18 ,  H05K3/14 ,  H05K3/16

CPC classification number: G02C11/10 ,  G02B27/0172 ,  G02C7/04 ,  H01F17/0006 ,  H01F27/2804 ,  H01F41/042 ,  H01Q1/22 ,  H01Q1/273 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/04 ,  H02J50/10 ,  H05K1/09 ,  H05K1/11 ,  H05K1/165 ,  H05K1/181 ,  H05K3/0026 ,  H05K3/0044 ,  H05K3/107 ,  H05K3/146 ,  H05K3/16 ,  H05K3/18 ,  H05K3/182 ,  H05K2201/0108 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10128 ,  H05K2203/107 ,  Y02P70/611

Abstract: A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.

公开(公告)号：US09829159B2

公开(公告)日：2017-11-28

申请号：US14913627

申请日：2014-08-22

Applicant: MOLEX INCORPORATED ,  Daniel B. McGowan ,  Michael C. Picini

Inventor： Daniel B. McGowan ,  Michael C. Picini

IPC: F21K99/00 ,  H05K1/18 ,  H05K1/05 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H05K3/00 ,  H05K3/12 ,  F21K9/20 ,  H05K1/11 ,  F21Y115/10

CPC classification number: F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/05 ,  H05K1/117 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/12 ,  H05K2201/09018 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

公开(公告)号：US09541274B2

公开(公告)日：2017-01-10

申请号：US13322579

申请日：2010-05-11

Applicant: Ralph Bertram ,  Tobias Frost ,  Christian Herbold ,  Steffen Strauss

Inventor： Ralph Bertram ,  Tobias Frost ,  Christian Herbold ,  Steffen Strauss

IPC: F21V21/00 ,  F21V29/70 ,  F21S4/00 ,  F21V23/02 ,  F21V29/00 ,  F21V7/00 ,  F21V29/74 ,  H05K1/18 ,  F21V3/04 ,  F21V7/22 ,  F21V29/506 ,  F21Y101/00

CPC classification number: F21V29/70 ,  F21S4/20 ,  F21V3/061 ,  F21V3/062 ,  F21V7/005 ,  F21V7/22 ,  F21V23/02 ,  F21V29/004 ,  F21V29/20 ,  F21V29/506 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: An illumination module may include at least one flexible carrier for a plurality of heat sources, including light sources, wherein the carrier is provided for being bent over at least part of its width.

Abstract translation: 照明模块可以包括用于多个热源的至少一个柔性载体，包括光源，其中所述载体设置成在其宽度的至少一部分上弯曲。

公开(公告)号：US09528667B1

公开(公告)日：2016-12-27

申请号：US14844796

申请日：2015-09-03

Applicant: Rodrigo M. Pereyra

Inventor： Rodrigo M. Pereyra

IPC: F21V23/00 ,  F21K99/00 ,  H05K3/00

CPC classification number: F21K9/90 ,  F21K9/232 ,  F21V23/005 ,  F21Y2107/20 ,  F21Y2115/10 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/085 ,  H05K2203/1453

Abstract: A method of manufacturing a lamp comprising forming a first sheet segment (48) into a first shell portion (110) after forming a first electrically conductive trace (70) on the first sheet segment (48) and after placing a first plurality of LEDs (90) on the first sheet segment (48); forming a second sheet segment (50) into a second shell portion (120) after forming a second electrically conductive trace (80) on the second plastic segment (50) and after placing a second plurality of LEDs (90) on the second sheet segment (50); and joining the first shell portion (110) and the second shell portion (120) into a bulb enclosure (40) defining an interior region (42) therein. The first and second sheet segments (48, 50) are preferably thermoformed and may be connected by a web (60).

Abstract translation: 一种制造灯的方法，包括在第一片段（48）上形成第一导电迹线（70）之后并且在放置第一多个LED（第一片段）之后，将第一片段（48）形成第一壳部分（110） 90）在第一片段（48）上; 在第二塑料段（50）上形成第二导电迹线（80）之后，在将第二多个LED（90）放置在第二片段上之后，将第二片段（50）形成第二壳部分（120） （50）; 以及将所述第一外壳部分（110）和所述第二外壳部分（120）接合到其中限定内部区域（42）的灯泡外壳（40）中。 第一和第二片段（48,50）优选地被热成型，并且可以通过网（60）连接。

公开(公告)号：US20160360625A1

公开(公告)日：2016-12-08

申请号：US15102326

申请日：2014-11-19

Applicant: JOLED INC.

Inventor： Shinya OGASAWARA ,  Teruo NANMOKU

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K5/0017 ,  G02F1/1339 ,  G02F1/134309 ,  G02F1/13452 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2201/56 ,  G02F2202/022 ,  G09F9/301 ,  G09G3/3225 ,  G09G3/3266 ,  G09G3/3677 ,  G09G2300/0426 ,  G09G2300/0452 ,  H01L51/5237 ,  H01L2251/5338 ,  H05B33/0803 ,  H05B33/086 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09018 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: A display device includes: a display panel including a first curved portion that is curved; and a drive circuit board on which a circuit for driving the display panel is formed. The drive circuit board includes a second curved portion that is curved following the first curved portion, and each of a plurality of components including one of a resistor and a capacitor and mounted on the second curved portion is mounted on the drive circuit board so that a crosswise direction of the component in plan view, which is a direction perpendicular to an alignment direction of a plurality of electrodes of the component, follows a curving direction of the second curved portion.

Abstract translation: 显示装置包括：显示面板，包括弯曲的第一弯曲部分; 以及其上形成有用于驱动显示面板的电路的驱动电路板。 所述驱动电路基板包括与所述第一弯曲部分相反的曲线的第二弯曲部分，并且安装在所述第二弯曲部分上的包括电阻器和电容器中的一个的多个部件中的每个部件安装在所述驱动电路板上，使得 在垂直于该部件的多个电极的取向方向的方向的平面图中的部件的横向方向遵循第二弯曲部分的弯曲方向。

公开(公告)号：US20160286662A1

公开(公告)日：2016-09-29

申请号：US15033567

申请日：2014-10-31

Applicant: PPG INDUSTRIES OHIO, INC. ,  SI-CAL TECHNOLOGIES, INC., A NISSHA COMPANY

Inventor： Jaye Tyler ,  Paul F. Cheetham ,  Darren Burn ,  Gregory J. McCollum

IPC: H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/207 ,  B32B7/06 ,  B32B37/025 ,  B32B38/10 ,  B32B2037/268 ,  B44C1/24 ,  B44C3/02 ,  H01L21/6835 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0017 ,  H05K3/007 ,  H05K3/38 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2203/0156 ,  H05K2203/1545

Abstract: Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.

Abstract translation: 公开了将导电材料转移到基底的方法。 所述方法包括：a）使至少一部分基底与布置在载体膜上的导电材料接触; 和b）在200-400°F的温度和30至150psi的压力范围内，将热和压力施加到衬底和载体膜上1至40秒的时间段 ，使得导电材料粘附到基底。 还公开了形成层状结构的方法。