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公开(公告)号：US08826530B2
公开(公告)日：2014-09-09
申请号：US12732635
申请日：2010-03-26
Applicant: Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
Inventor： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
CPC classification number: H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
Abstract: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
Abstract translation: 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。
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52.发明授权Wiring structure having a plurality of circuit boards with an insulating sleeve in a terminal insertion hole 有权接线结构，具有在端子插入孔中具有绝缘套筒的多个电路板公开(公告)号：US08366457B2
公开(公告)日：2013-02-05
申请号：US13233160
申请日：2011-09-15
Applicant: Takeyoshi Yamamoto , Keisuke Takahashi , Yoshikatsu Hasegawa
Inventor： Takeyoshi Yamamoto , Keisuke Takahashi , Yoshikatsu Hasegawa
IPC: H01R12/00
CPC classification number: H05K3/4046 , H01R12/58 , H05K3/202 , H05K3/4611 , H05K2201/09581 , H05K2201/0969 , H05K2201/10303 , H05K2201/10833
Abstract: A wiring structure includes a board assembly and pin terminals. In each of pin terminal insertion holes formed in the board assembly, a terminal connection portion electrically connected to a metal foil wire and fitted onto the pin terminal so as to hold the pin terminal is provided in a through-hole of at least one of a plurality of circuit boards forming the board assembly, which forms a part of the pin terminal insertion hole, whereas an insulating sleeve blocking contact between the pin terminal and each of the remaining circuit boards is fitted into through-holes of the remaining circuit boards, which form the remaining part of the pin terminal insertion hole.
Abstract translation: 布线结构包括板组件和销端子。 在形成在板组装体中的每一个销端子插入孔中，与金属箔线电连接并安装在销端子上以便固定销端子的端子连接部分设置在至少一个 形成板组件的多个电路板，其形成销端子插入孔的一部分，而将引脚端子和每个剩余电路板之间的绝缘套筒阻塞接触装配到剩余电路板的通孔中， 形成销端子插入孔的剩余部分。
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公开(公告)号：US20130026653A1
公开(公告)日：2013-01-31
申请号：US13636324
申请日：2011-03-22
Applicant: Shintaro Yamamichi , Katsumi Kikuchi , Yoshiki Nakashima , Kentaro Mori
Inventor： Shintaro Yamamichi , Katsumi Kikuchi , Yoshiki Nakashima , Kentaro Mori
CPC classification number: H05K1/185 , H01L23/49816 , H01L23/5384 , H01L23/5389 , H01L23/66 , H01L24/18 , H01L24/19 , H01L2224/04105 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/1461 , H01L2924/15311 , H01L2924/3511 , H05K3/4605 , H05K2201/09581 , H05K2201/10674 , H05K2203/1469 , H01L2924/00
Abstract: In a manufacturing method of a semiconductor device incorporating a semiconductor element in a multilayered wiring structure including a plurality of wiring layers and insulating layers, a semiconductor element is mounted on a silicon support body whose thickness is reduced to a desired thickness and which are equipped with a plurality of through-vias running through in the thickness direction; an insulating layer is formed to embed the semiconductor element; then, a plurality of wiring layers is formed on the opposite surfaces of the silicon support body in connection with the semiconductor element. Thus, it is possible to reduce warping which occurs in proximity to the semiconductor element in manufacturing, thus improving a warping profile in the entirety of a semiconductor device. Additionally, it is possible to prevent semiconductor elements from becoming useless, improve a yield rate, and produce a thin-type semiconductor device with high-density packaging property.
Abstract translation: 在包含多个布线层和绝缘层的多层布线结构中包含半导体元件的半导体器件的制造方法中，将半导体元件安装在硅支撑体上，该硅支撑体的厚度减小到期望的厚度并且配备有 多个穿过厚度方向的通孔; 形成绝缘层以嵌入半导体元件; 那么在与硅半导体元件相连的硅支撑体的相对表面上形成多个布线层。 因此，可以减少在制造中在半导体元件附近发生的翘曲，从而改善整个半导体器件的翘曲轮廓。 此外，可以防止半导体元件变得无用，提高成品率，并且可以生产具有高密度封装性能的薄型半导体器件。
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公开(公告)号：US08143532B2
公开(公告)日：2012-03-27
申请号：US12366017
申请日：2009-02-05
Applicant: Leilei Zhang
Inventor： Leilei Zhang
IPC: H05K1/11
CPC classification number: H05K3/42 , H05K1/0366 , H05K3/0055 , H05K3/16 , H05K3/4076 , H05K2201/0769 , H05K2201/09581 , H05K2201/09827
Abstract: A through hole is formed in a circuit board that has fibers dispersed in a polymer matrix. Copper is sputtered within the through hole to form a sufficiently conductive layer for electrolytic plating over the sputtered copper layer.
Abstract translation: 在具有分散在聚合物基质中的纤维的电路板中形成通孔。 在通孔内溅射铜，以在溅射的铜层上形成用于电解电镀的足够导电的层。
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公开(公告)号：US08079667B2
公开(公告)日：2011-12-20
申请号：US12338169
申请日：2008-12-18
Applicant: Michael Y. Young , Patrick C. Cheung , Stephen David White , John R. Andrews , David J. Gervasi
Inventor： Michael Y. Young , Patrick C. Cheung , Stephen David White , John R. Andrews , David J. Gervasi
CPC classification number: B41J2/14233 , B41J2002/14306 , B41J2002/14491 , B41J2202/18 , H05K1/0272 , H05K1/115 , H05K3/429 , H05K2201/09581 , H05K2201/09809 , H05K2203/0315
Abstract: A drop generator having a via structure configured for electrical and fluidic interconnection. The via structure includes an electrically conductive layer and an electrically insulating layer disposed on the electrically conductive layer.
Abstract translation: 具有经配置以用于电和流体互连的通孔结构的液滴发生器。 通孔结构包括导电层和设置在导电层上的电绝缘层。
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Patent Agency Ranking
56.发明申请METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE 审中-公开制造压电振动器，振荡器，电子器件和无线电控制时序的方法公开(公告)号：US20110249535A1
公开(公告)日：2011-10-13
申请号：US13167283
申请日：2011-06-23
Applicant: Yoichi Funabiki , Masashi Numata , Kazuyoshi Sugama
Inventor： Yoichi Funabiki , Masashi Numata , Kazuyoshi Sugama
CPC classification number: H03H9/21 , H03H3/04 , H03H9/1021 , H03H2003/026 , H03H2003/0492 , H05K1/0306 , H05K3/4046 , H05K2201/09581 , H05K2201/10242 , Y10T29/42
Abstract: A method of manufacturing a piezoelectric vibrator according to the invention includes the steps of: inserting a core portion of a conductive rivet member, which includes a planar base portion and the core portion extending in a direction vertical to the surface of a base portion, into a penetration hole of the base substrate and bringing the base portion of the rivet member into contact with a first surface of the base substrate; applying a paste-like glass frit on a second surface of the base substrate and moving a first squeegee which comes into contact with the second surface with an attack angle in one direction to thereby fill the glass frit in the penetration hole; and moving a second squeegee which comes into contact with the second surface with an attack angle in a direction opposite to the one direction to thereby fill the glass frit applied redundantly on the second surface in the penetration hole.
Abstract translation: 根据本发明的制造压电振动器的方法包括以下步骤：将导电铆钉构件的芯部插入到包括平面基部和在垂直于基部的表面的方向上延伸的芯部上， 所述基底基板的贯通孔，使所述铆钉部件的基部与所述基底基板的第一面接触; 在基底基板的第二表面上施加糊状玻璃料，并使与第二表面接触的第一刮板以一个方向的攻角移动，从而填充穿透孔中的玻璃料; 并且以与所述一个方向相反的方向的攻角来移动与所述第二表面接触的第二刮板，从而将穿透孔中的所述第二表面上冗余地施加的玻璃料填充。
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公开(公告)号：US07843302B2
公开(公告)日：2010-11-30
申请号：US11429157
申请日：2006-05-08
Applicant: Yasuhiko Mano , Takashi Kariya , Shinobu Kato
Inventor： Yasuhiko Mano , Takashi Kariya , Shinobu Kato
IPC: H01F5/00
CPC classification number: H05K3/4046 , H01F17/0006 , H01F17/06 , H01F41/046 , H01F2017/002 , H01F2017/065 , H01L23/645 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/3011 , H01L2924/3025 , H05K1/0233 , H05K1/115 , H05K1/185 , H05K3/42 , H05K3/4602 , H05K2201/086 , H05K2201/09581 , Y10T29/4902 , H01L2224/05599
Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
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公开(公告)号：US20100243305A1
公开(公告)日：2010-09-30
申请号：US12732635
申请日：2010-03-26
Applicant: Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
Inventor： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
CPC classification number: H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
Abstract: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
Abstract translation: 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。
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公开(公告)号：US20100117779A1
公开(公告)日：2010-05-13
申请号：US12692907
申请日：2010-01-25
Applicant: Yasuhiko MANO , Takashi Kariya , Shinobu Kato
Inventor： Yasuhiko MANO , Takashi Kariya , Shinobu Kato
IPC: H01F5/00
CPC classification number: H05K3/4046 , H01F17/0006 , H01F17/06 , H01F41/046 , H01F2017/002 , H01F2017/065 , H01L23/645 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/3011 , H01L2924/3025 , H05K1/0233 , H05K1/115 , H05K1/185 , H05K3/42 , H05K3/4602 , H05K2201/086 , H05K2201/09581 , Y10T29/4902 , H01L2224/05599
Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
Abstract translation: 嵌入印刷电路板的电感器包括沿着印刷电路板的厚度方向延伸的导体和与导体接触而不间隙的磁体。 例如，磁性体由具有圆柱形管状的铁氧体构成。 导体由在圆筒形管状铁氧体的内周面上电镀形成的铜膜构成。 电感器沿印刷电路板的厚度方向插入。
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公开(公告)号：US20090224863A1
公开(公告)日：2009-09-10
申请号：US12466911
申请日：2009-05-15
Applicant: Yasuhiko Mano , Takashi Kariya , Shinobu Kato
Inventor： Yasuhiko Mano , Takashi Kariya , Shinobu Kato
IPC: H01F5/00
CPC classification number: H05K3/4046 , H01F17/0006 , H01F17/06 , H01F41/046 , H01F2017/002 , H01F2017/065 , H01L23/645 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/3011 , H01L2924/3025 , H05K1/0233 , H05K1/115 , H05K1/185 , H05K3/42 , H05K3/4602 , H05K2201/086 , H05K2201/09581 , Y10T29/4902 , H01L2224/05599
Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
Abstract translation: 嵌入印刷电路板的电感器包括沿着印刷电路板的厚度方向延伸的导体和与导体接触而不间隙的磁体。 例如，磁性体由具有圆柱形管状的铁氧体构成。 导体由在圆筒形管状铁氧体的内周面上电镀形成的铜膜构成。 电感器沿印刷电路板的厚度方向插入。
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