Abstract:
An arrangement for interconnecting a pair of hybrid integrated circuit boards mounted by means of pins in an upstanding position on a horizontally extending base circuit board in closely spaced, substantially parallel relationship, each of the hybrid circuit boards being provided with a row of contact terminals extending along the upper edge thereof together with a secondary printed circuit board having a row of downwardly directed, spring-like contact elements mounted along each side edge, the contact elements beng spaced so as to correspond with the contact terminals on the hybrid boards and with oppositely disposed contact elements being interconnected by a conductor whereby the secondary board may be detachably mounted in a horizontally extending position across the upper edges of the hybrid boards with the contact elements in each row in circuit making engagement with the adjacent contact terminals on the underlying hybrid boards thereby interconnecting the printed circuits of the hybrid boards.
Abstract:
An improved method for transferring electrical components from a breadboard to a printed circuit board and mounting the components thereon is disclosed, as well as an apparatus for facilitating such transfer and mounting. In a preferred case, the breadboard comprises a solderless breadboard socket. A printed circuit board having a drilled hole pattern and circuit pattern matching that of a solderless breadboard socket is placed over the solderless breadboard socket so that the holes in each are aligned. Breadboarding is done by pushing the leads of various components through the printed circuit board and into the solderless breadboard socket. When the desired circuit is completed, the composite is utilized as one side of a container with the component side forming an inner surface thereof. Particles smaller than the components, such as polymer pellets, are introduced into the container to surround and cover the components and hold the components in place. The solderless breadboard socket is then removed and the component leads can be soldered to the appropriate conductive strips thereby completing mounting of the circuit on the printed circuit board.
Abstract:
A matrix assembly comprised of a plurality of electrical components (diodes) having one lead or electrical connector thereof permanently or semi-permanently attached to a printed circuit board and in electrical contact with the printed circuit conductors on it. The electrical components are disposed and retained within openings extending through a spacer, in a fashion such that the other lead or electrical connector thereof functions as a plug to receive a contact pin receptacle. The openings in the spacer function to support the electrical components and to guide the contact pin receptacles into engagement with the electrical connectors of the electrical components. In this fashion, an electrical path may be readily made, or interrupted, to program or encode the matrix circuit, by simply affixing an electrical component into the appropriate ones of the openings in the spacer and electrically connecting the one lead thereof. Upon being plugged into the contact pin receptacles, the electrical interconnections are established. The contact pin receptacles can be affixed to another support member such as, for example, another printed circuit board.
Abstract:
A microelectronic panel comprising a printed circuit board with etched circuits and a multilayer, multiterminal laminar bus bar system mechanically attached to the board and electrically connected with the etched circuits, with said etched circuits connecting electrically with sockets, said bussing system being nondestructively removable from said board and having controlled impedance characteristics.
Abstract:
A communication system includes first and second circuit card assemblies mated such that first and second PCBs move relative to each other along a board mating axis parallel to a slot in the first PCB with the first PCB oriented perpendicular to the second PCB and with first and second mating ends of first and second electrical connectors oriented parallel to the board mating axis. The first and second circuit card assemblies are mated such that the first electrical connector and the second electrical connector move relative to each other along a connector mating axis perpendicular to the board mating axis. First mating interfaces of first contacts are mated to second mating interfaces of second contacts in a contact mating direction non-parallel to the board mating axis and non-parallel to the connector mating axis.
Abstract:
Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.
Abstract:
A high-current connector and a high-current connection device, the high-current connection device comprises a circuit board and at least one group of (two) high-current connectors. Each high-current connector comprises a conductive mating member and a conductive combined shunt. The conductive mating member has a main body and an alignment soldering leg, the main body is formed as a columnar body and has a bottom surface and a top surface, the alignment soldering leg integrally extends from the bottom surface and protrudes from the bottom surface. The conductive combined shunt has a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins are positioned on both sides of the alignment soldering leg. The alignment soldering leg of the high-current connector is inserted into and electrically connected to the middle conductive holes of the circuit board, and the shunt pins of the high-current connector are respectively inserted into and electrically connected to the first conductive holes of the circuit board.