Interconnection arrangement for circuit boards
    51.
    发明授权
    Interconnection arrangement for circuit boards 失效
    电路板的互连布置

    公开(公告)号:US4250536A

    公开(公告)日:1981-02-10

    申请号:US973358

    申请日:1978-12-26

    CPC classification number: H05K1/144 H01R13/68 H05K2201/10333 H05K2201/10946

    Abstract: An arrangement for interconnecting a pair of hybrid integrated circuit boards mounted by means of pins in an upstanding position on a horizontally extending base circuit board in closely spaced, substantially parallel relationship, each of the hybrid circuit boards being provided with a row of contact terminals extending along the upper edge thereof together with a secondary printed circuit board having a row of downwardly directed, spring-like contact elements mounted along each side edge, the contact elements beng spaced so as to correspond with the contact terminals on the hybrid boards and with oppositely disposed contact elements being interconnected by a conductor whereby the secondary board may be detachably mounted in a horizontally extending position across the upper edges of the hybrid boards with the contact elements in each row in circuit making engagement with the adjacent contact terminals on the underlying hybrid boards thereby interconnecting the printed circuits of the hybrid boards.

    Abstract translation: 用于将一对混合集成电路板互连在一个以水平方向延伸的基座电路板上的直立位置上以紧密间隔的基本上平行的关系连接的混合集成电路板,每个混合电路板设置有一排接触端子, 沿着其上边缘连同具有沿着每个侧边缘安装的一排向下指向的弹簧状接触元件的次级印刷电路板,所述接触元件分开以与混合电路板上的接触端子对应,并且相对地 布置的接触元件通过导体互连,从而二次板可以可拆卸地安装在跨越混合板的上边缘的水平延伸的位置上,每排中的接触元件与电路板上的相邻接触端子接合 从而互连了印刷电路 混合板。

    Method for transferring electrical components from a breadboard to a
printed circuit board
    52.
    发明授权
    Method for transferring electrical components from a breadboard to a printed circuit board 失效
    将电气部件从面包板传送到印刷电路板的方法

    公开(公告)号:US4080729A

    公开(公告)日:1978-03-28

    申请号:US763062

    申请日:1977-01-27

    Abstract: An improved method for transferring electrical components from a breadboard to a printed circuit board and mounting the components thereon is disclosed, as well as an apparatus for facilitating such transfer and mounting. In a preferred case, the breadboard comprises a solderless breadboard socket. A printed circuit board having a drilled hole pattern and circuit pattern matching that of a solderless breadboard socket is placed over the solderless breadboard socket so that the holes in each are aligned. Breadboarding is done by pushing the leads of various components through the printed circuit board and into the solderless breadboard socket. When the desired circuit is completed, the composite is utilized as one side of a container with the component side forming an inner surface thereof. Particles smaller than the components, such as polymer pellets, are introduced into the container to surround and cover the components and hold the components in place. The solderless breadboard socket is then removed and the component leads can be soldered to the appropriate conductive strips thereby completing mounting of the circuit on the printed circuit board.

    Abstract translation: 公开了一种用于将电气部件从面包板传送到印刷电路板并将部件安装在其上的改进方法,以及用于促进这种传送和安装的装置。 在优选情况下,面包板包括无焊面包板插座。 具有钻孔图案的印刷电路板和与无焊面包板插座的电路图案匹配的印刷电路板放置在无焊面包板插座上,使得每个孔中的孔对齐。 通过将各种组件的引线通过印刷电路板推入无焊面包板插座来实现面包板。 当期望的电路完成时,复合材料被用作容器的一侧,其中元件侧形成其内表面。 小于组分(例如聚合物颗粒)的颗粒被引入容器中以围绕和覆盖部件并将部件保持在适当位置。 然后去除无焊面包板插座,并将组件引线焊接到适当的导电条上,从而完成电路在印刷电路板上的安装。

    Matrix assembly
    53.
    发明授权
    Matrix assembly 失效
    MATRIX装配

    公开(公告)号:US3784878A

    公开(公告)日:1974-01-08

    申请号:US3784878D

    申请日:1972-07-06

    Inventor: NEU J

    Abstract: A matrix assembly comprised of a plurality of electrical components (diodes) having one lead or electrical connector thereof permanently or semi-permanently attached to a printed circuit board and in electrical contact with the printed circuit conductors on it. The electrical components are disposed and retained within openings extending through a spacer, in a fashion such that the other lead or electrical connector thereof functions as a plug to receive a contact pin receptacle. The openings in the spacer function to support the electrical components and to guide the contact pin receptacles into engagement with the electrical connectors of the electrical components. In this fashion, an electrical path may be readily made, or interrupted, to program or encode the matrix circuit, by simply affixing an electrical component into the appropriate ones of the openings in the spacer and electrically connecting the one lead thereof. Upon being plugged into the contact pin receptacles, the electrical interconnections are established. The contact pin receptacles can be affixed to another support member such as, for example, another printed circuit board.

    Abstract translation: 由多个电气部件(二极管)组成的矩阵组件,其具有一个引线或电连接器,其永久地或半永久性地附着到印刷电路板上,并与其上的印刷电路导体电接触。 电气部件被设置并保持在延伸穿过间隔件的开口中,使得其它引线或电连接器用作插头以接收接触针插座。 间隔件中的开口用于支撑电气部件并引导接触针插座与电气部件的电连接器接合。 以这种方式,通过简单地将电气部件附接到间隔件中的适当的开口中并电连接其一个引线,可以容易地或中断电路以编程或编码矩阵电路。 插入接触针插座时,建立电互连。 接触针插座可以固定到另一个支撑构件,例如另一个印刷电路板。

    HIGH-CURRENT CONNECTOR AND HIGH-CURRENT CONNECTION DEVICE

    公开(公告)号:US20180342824A1

    公开(公告)日:2018-11-29

    申请号:US15981515

    申请日:2018-05-16

    Applicant: Molex, LLC

    Inventor: Yi-Tse HO

    Abstract: A high-current connector and a high-current connection device, the high-current connection device comprises a circuit board and at least one group of (two) high-current connectors. Each high-current connector comprises a conductive mating member and a conductive combined shunt. The conductive mating member has a main body and an alignment soldering leg, the main body is formed as a columnar body and has a bottom surface and a top surface, the alignment soldering leg integrally extends from the bottom surface and protrudes from the bottom surface. The conductive combined shunt has a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins are positioned on both sides of the alignment soldering leg. The alignment soldering leg of the high-current connector is inserted into and electrically connected to the middle conductive holes of the circuit board, and the shunt pins of the high-current connector are respectively inserted into and electrically connected to the first conductive holes of the circuit board.

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