公开(公告)号：US3926360A

公开(公告)日：1975-12-16

申请号：US47369874

申请日：1974-05-28

Applicant: BURROUGHS CORP

Inventor： MOISTER JR DOUGLAS E

IPC: B23K1/005 ,  H05K3/34 ,  H05K3/36 ,  H01R43/00

CPC classification number: H01R12/62 ,  B23K1/0053 ,  B23K2201/42 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455

Abstract: An improved method for soldering the terminals of a rigid printed circuit board to those of a flexible printed circuit board, such method comprising the steps of focusing a radiant heating source upon each of a plurality of solder globules deposited in a like number of through holes in the terminals of the rigid printed circuit board for controlling of the capillary flow of the molten solder radially from the through holes to form solder points of controlled depth and pattern between the terminals of the boards.

公开(公告)号：US20240313525A1

公开(公告)日：2024-09-19

申请号：US18198137

申请日：2023-05-16

Applicant: CABLE VISION ELECTRONICS CO., LTD.

Inventor： Chien-Chung LEE ,  Min-Chi TSENG ,  Cheng-Wei PENG ,  Yu-An CHEN

IPC: H02H9/04 ,  H05K1/16

CPC classification number: H02H9/044 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/095 ,  H05K2201/10666

Abstract: An electronic apparatus includes a printed circuit board, a terminal and a surge voltage protection structure. The printed circuit board includes a first plated through hole, a second plated through hole and a ground terminal. The surge voltage protection structure includes the first plated through hole and the second plated through hole. The first plated through hole is electrically connected to the terminal. The second plated through hole is connected to the ground terminal. A gap is defined between the first plated through hole and the second plated through hole. The first plated through hole receives a surge voltage to generate an electric arc across the gap and transmit the electric arc through the gap to the second plated through hole, so that the second plated through hole receives the electric arc to transfer an energy of the electric arc to the ground terminal.

公开(公告)号：US12089328B2

公开(公告)日：2024-09-10

申请号：US18499009

申请日：2023-10-31

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Guy Nesher

IPC: H05K1/11 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

公开(公告)号：US20240064897A1

公开(公告)日：2024-02-22

申请号：US18499009

申请日：2023-10-31

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Guy Nesher

IPC: H05K1/11 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K13/046 ,  H05K3/341 ,  H05K2201/10666

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

公开(公告)号：US20150016082A1

公开(公告)日：2015-01-15

申请号：US14300795

申请日：2014-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Soo LEE

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/115 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1533 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0038 ,  H05K3/0097 ,  H05K3/025 ,  H05K3/428 ,  H05K3/4682 ,  H05K2201/042 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/10666 ,  H05K2203/1536 ,  H01L2924/013 ,  H01L2924/00014

Abstract: A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a second circuit layer formed at a second side of the insulating layer and electrically connected with the portion of the first circuit layer in the via.

Abstract translation: 印刷电路板包括绝缘层; 在所述绝缘层中的通孔，形成在所述绝缘层的第一侧并具有埋在所述通孔中的部分的第一电路层; 形成在所述绝缘层的第二侧并与所述通孔中的所述第一电路层的所述部分电连接的第二电路层。

公开(公告)号：US20100214741A1

公开(公告)日：2010-08-26

申请号：US12632398

申请日：2009-12-07

Applicant: Rie Takada ,  Kenichiro Tsubone

Inventor： Rie Takada ,  Kenichiro Tsubone

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/00 ,  H05K3/30

CPC classification number: H05K1/147 ,  H01L23/3672 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  Y10T29/4913 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component.

Abstract translation: 电子部件安装结构包括：第一基板，其上安装有第一部件;第二基板，连接到第一基板。 第二基板朝向第一部件弯曲。

公开(公告)号：US07732900B2

公开(公告)日：2010-06-08

申请号：US11236815

申请日：2005-09-28

Applicant: Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

Inventor： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC: H01L23/495

CPC classification number: H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

Abstract translation: 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部 连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19， 绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

公开(公告)号：US07615707B2

公开(公告)日：2009-11-10

申请号：US11163477

申请日：2005-10-20

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K3/0094 ,  H05K3/42 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/10666 ,  Y10T29/4913

Abstract: A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.

Abstract translation: 公开了一种用于形成印刷电路板的印刷电路板和形成方法。 印刷电路板包括基板和导电层。 基板包括通孔，其中基板的通孔的一侧对应于第一直径，并且基板的通孔的另一侧对应于第二直径。 第二直径大于第一直径。 导电层被放置在通孔的内表面上，用于电连接衬底的两侧。

公开(公告)号：US20090257209A1

公开(公告)日：2009-10-15

申请号：US12385575

申请日：2009-04-13

Applicant: Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

Inventor： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

IPC: H01R9/00 ,  H01R12/04

CPC classification number: H05K1/112 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

Abstract translation: 一种半导体封装和相关方法，所述半导体封装包括包括插座的衬底以及包括焊球和从所述焊球延伸到所述插座中的支撑部分的连接端子。

公开(公告)号：US20080179721A1

公开(公告)日：2008-07-31

申请号：US11669880

申请日：2007-01-31

Applicant: Cheng-Lien Chiang

Inventor： Cheng-Lien Chiang

IPC: H01L23/495 ,  H01L23/48

CPC classification number: H05K1/144 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/10666 ,  H05K2203/0455 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A transfer carrier comprising a transfer substrate, two aperture arrays, a contact pattern and a semiconductor device. The transfer substrate located on the opposed sides of the transfer substrate to define a cavity on the transfer substrate, the aperture arrays has a top surface and a bottom surface. The two aperture arrays have apertures extending from the top surface through to the bottom surface. The apertures have conductive layers formed on the inner surfaces of the apertures. The contact pattern is located with contacts lo electrically connected to the corresponding conductive layer of the apertures. The semiconductor device has pads arranged in identical pattern as the contact pattern, the semiconductor device being electrically connected to the contacts. The transfer carrier is also manufactured as an integrated circuit package. The transfer carriers and integrated circuit packages are stacked via solder connections.

Abstract translation: 一种转印载体，包括转印衬底，两个孔阵列，接触图案和半导体器件。 转印基板位于转印基板的相对侧上以限定转印基板上的空腔，孔阵列具有顶表面和底表面。 两个孔阵列具有从顶表面延伸到底表面的孔。 这些孔具有形成在孔的内表面上的导电层。 接触图案定位为具有电连接到孔的相应导电层的触点。 半导体器件具有以与接触图案相同的图案排列的衬垫，半导体器件电连接到触点。 转印载体也作为集成电路封装制造。 传输载体和集成电路封装通过焊料连接堆叠。