公开(公告)号：US20170256875A1

公开(公告)日：2017-09-07

申请号：US15060728

申请日：2016-03-04

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/11 ,  H01R12/71 ,  H01R43/04

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US08902603B2

公开(公告)日：2014-12-02

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20020047504A1

公开(公告)日：2002-04-25

申请号：US09920863

申请日：2001-08-03

Inventor： Hideyuki Takahashi

IPC: H02K011/00 ,  H02K005/22

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H02K3/50 ,  H02K11/33 ,  H05K3/4046 ,  H05K2201/09854 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10856

Abstract: A bonding portion of a connector terminal includes embossed portions and a slit. Each embossed portion is formed by embossing the bonding portion in a thicknesswise direction of the bonding portion to provide an embossed recess on one of opposed sides of the bonding portion. Each embossed recess communicates opposed open ends of an elongated hole provided in a circuit board with each other when the bonding portion is inserted to a predetermined position in the elongated hole. The slit penetrates through the bonding portion. The slit extends over at least one of the opposed open ends of the elongated hole in the thickensswise direction of the circuit board when the bonding portion is inserted to the predetermined position in the elongated hole.

Abstract translation: 连接器端子的接合部分包括压花部分和狭缝。 每个压花部分通过在接合部分的厚度方向上压接接合部分而形成，以在接合部分的相对侧之一上提供压花凹部。 当接合部分插入长孔中的预定位置时，每个压花凹槽将设置在电路板中的细长孔的相对开口端彼此连通。 狭缝穿过粘合部分。 当接合部分插入长孔中的预定位置时，狭缝在电路板的厚度方向上延伸到细长孔的相对开口端中的至少一个上。

公开(公告)号：US06326242B1

公开(公告)日：2001-12-04

申请号：US09430559

申请日：1999-10-29

Applicant: Mike Brooks ,  Walter L. Moden

Inventor： Mike Brooks ,  Walter L. Moden

IPC: H01L2144

CPC classification number: H01L23/36 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/341 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.

Abstract translation: 提供一种用于制造封装的半导体封装和方法。 封装包括半导体管芯和与管芯热连通的散热器。 散热器包括适于形成接合连接的一个或多个焊盘结构，以及衬底上的触点的热路径。 该方法包括在类似于引线框架的框架上形成多个散热器，以及蚀刻或冲压散热器上的焊盘结构。 然后可以将该框架连接到包含封装的骰子的引线框架上，并且该组件被单个化以形成单独的封装。 这些封装可用于形成诸如电路板组件和多芯片模块之类的电子组件。

公开(公告)号：US5102356A

公开(公告)日：1992-04-07

申请号：US705478

申请日：1991-05-24

Applicant: Barbara A. Adams ,  William H. Allman ,  Troy E. Conner ,  Donald L. Forker ,  Edward J. Knittle, Jr. ,  Douglas R. Sarver

Inventor： Barbara A. Adams ,  William H. Allman ,  Troy E. Conner ,  Donald L. Forker ,  Edward J. Knittle, Jr. ,  Douglas R. Sarver

IPC: H01R9/16 ,  H01R12/58 ,  H01R13/40 ,  H05K3/30

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49204

Abstract: An electrical connector includes a housing and an array of terminal members having posts extending from the housing and adapted for insertion into through-holes of a circuit board. At least one board retention means is formed on at least one of the posts and is axially located a selected distance from the lower surface of the housing to be within a corresponding through-hole after insertion. The retention means is a swage defining wall engaging surfaces for engaging sidewalls of a respective through-holes during mounting of the connector to board. The swage is formed such that the far side of the post remains coplanar with the axially adjacent surfaces and a swage embossment extends laterally outwardly from at least the second side, the embossment being formed by the work end of a tool striking the third side at an angle. In the preferred embodiment, there are at least two swaged posts with embossment of the first terminal extending outwardly in a first direction and the embossment of the second post extending in a second opposing direction. The retention means of the first and second posts engage wall surface within respective through-holes with spring bias applied in opposite directions thereby defining means for temporarily securing the connector to the board prior to soldering.

公开(公告)号：US4906209A

公开(公告)日：1990-03-06

申请号：US271339

申请日：1988-11-09

Applicant: Takeshi Tanabe ,  Takaaki Ooi ,  Shingo Okuyama

Inventor： Takeshi Tanabe ,  Takaaki Ooi ,  Shingo Okuyama

IPC: H01R12/58 ,  H01R13/7197 ,  H05K3/30

CPC classification number: H01R13/7197 ,  H05K3/308 ,  H01R12/585 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2201/10833 ,  H05K2201/10856

Abstract: A compliant pin terminal inserted into a through hole, such as a center hole of a feed-through capacitor or a through hole of a circuit substrate having an electrode at the inner periphery thereof, is mounted into the through hole for electrically connecting with the electrode therein. The pin terminal includes slits, by which linear divided portions and expanded elastic contact portions are formed so that when the body is inserted into the through hole of the capacitor the elastic contact portions come into press-contact with the electrode, thereby obtaining electrical connection with the electrode and mechanical locking by means of the elasticity of each elastic contact portion. A lengthwise pulling force acting on the terminal body is borne by the linear divided portions, but does not act on the elastic portions. Accordingly, an interval between the elastic contact portions opposite to each other resists change, thereby effectively preventing the pin terminal from escaping from the through hole.

Abstract translation: 插入通孔的柔性引脚端子，例如馈电电容器的中心孔或在其内周具有电极的电路基板的通孔安装在通孔中，以与电极电连接 其中。 销端子包括狭缝，线形分割部分和膨胀弹性接触部分形成为使得当主体插入电容器的通孔中时，弹性接触部分与电极压接，从而获得与 电极和通过每个弹性接触部分的弹性机械锁定。 作用在端子体上的纵向拉力由线状分割部分承受，但不作用在弹性部分上。 因此，彼此相反的弹性接触部之间的间隔抵抗变化，从而有效地防止销端子从通孔逸出。