公开(公告)号：US4480779A

公开(公告)日：1984-11-06

申请号：US417163

申请日：1982-09-13

Applicant: Penelope J. Luc

Inventor： Penelope J. Luc

IPC: H05K3/36 ,  H05K3/40 ,  B23K20/12

CPC classification number: H05K3/4046 ,  H01L2224/18 ,  H05K2201/1028 ,  H05K2201/10946 ,  H05K3/36 ,  H05K3/403 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A conductive connection between a metallized outer surface of a film of plastics material, such as a polyimide film and a metal or metallized surface of a substrate to which the film is attached. The connection comprises a flexible conductor secured to the substrate and a second film of plastics material which is bonded to the metallized surface of the first film material and to the flexible conductor to effect a conductive connection between the metallized surface of the first film and the substrate. The second film may be so arranged that it holds the flexible conductor in close contact with the metallized layer on the first film to effect an electrical connection but is preferably metallized whereby an additional electrical connection is effected by way of its metallized surface and the flexible conductor.

Abstract translation: 塑料材料膜的金属化外表面之间的导电连接，例如聚酰亚胺膜和附着有薄膜的基底的金属或金属化表面。 连接包括固定到基板的柔性导体和粘合到第一薄膜材料的金属化表面和柔性导体上的塑料材料的第二薄膜，以实现第一薄膜的金属化表面与基底之间的导电连接 。 第二膜可以被布置成使得其保持柔性导体与第一膜上的金属化层紧密接触以实现电连接，但是优选地被金属化，由此通过其金属化表面和柔性导体来实现额外的电连接 。

公开(公告)号：US4365284A

公开(公告)日：1982-12-21

申请号：US139167

申请日：1980-04-11

Applicant: Katsuo Tanaka

Inventor： Katsuo Tanaka

IPC: H01C1/14 ,  H01C1/04 ,  H01C1/16 ,  H01C13/02 ,  H01C17/00 ,  H01G4/40 ,  H01L27/01 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  H01C1/04 ,  H01C1/16 ,  H01C13/02 ,  H01C17/006 ,  H05K1/167 ,  H05K1/0263 ,  H05K2201/10015 ,  H05K2201/10045 ,  H05K2201/10272 ,  H05K2201/10386 ,  H05K2201/10477 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K3/222 ,  H05K3/3421 ,  H05K3/368 ,  Y02P70/611

Abstract: A resistor module which is small in size and easy to probe for measuring and in which a plurality of resistors are formed on the surface of an insulated substrate, an insulating layer is provided to extend over the resistors and conductor patterns for connection of the resistors, and a conductor bar to be connected with a power source pattern or grounding pattern of a printed circuit board is mounted on the insulating layer.

Abstract translation: 一种电阻器模块，其尺寸小且易于测量，并且在绝缘基板的表面上形成多个电阻器，提供绝缘层以延伸到用于连接电阻器的电阻器和导体图案上， 并且将与印刷电路板的电源图案或接地图形连接的导体条安装在绝缘层上。

公开(公告)号：US4158218A

公开(公告)日：1979-06-12

申请号：US834300

申请日：1977-09-19

Applicant: Eugene D. McLaurin ,  William E. Hucks ,  Gordon R. Love

Inventor： Eugene D. McLaurin ,  William E. Hucks ,  Gordon R. Love

IPC: H01G2/06 ,  H05K3/34 ,  H01G1/14

CPC classification number: H01G2/065 ,  H05K3/3426 ,  H01F2027/295 ,  H05K2201/10636 ,  H05K2201/10909 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613

Abstract: A ceramic capacitor having stress relieving silver-base metal foil terminal strips bonded to a ceramic chip by a silver-base fired on metallizing composition.

Abstract translation: 一种陶瓷电容器，其具有通过在金属组合物上燃烧的银基而与银陶瓷芯片接合的银基金属箔端子带。

公开(公告)号：US3275895A

公开(公告)日：1966-09-27

申请号：US38885964

申请日：1964-08-11

Applicant: GEN MOTORS CORP

Inventor： FLAHERTY JAMES H

IPC: H05K3/32

CPC classification number: H05K3/328 ,  H05K2201/10303 ,  H05K2201/10454 ,  H05K2201/10946 ,  H05K2201/10962

公开(公告)号：US2899608A

公开(公告)日：1959-08-11

申请号：US2899608D

IPC: H01G2/00 ,  H01L49/02 ,  H05K1/14

CPC classification number: H01G2/00 ,  H01L49/02 ,  H05K1/142 ,  H05K2201/09963 ,  H05K2201/10946

公开(公告)号：US20190122823A1

公开(公告)日：2019-04-25

申请号：US15995637

申请日：2018-06-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Beom Joon CHO ,  Ki Young KIM ,  Jae Young NA ,  Jin Mo AHN

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01G4/12 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/38 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10946

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

公开(公告)号：US09801277B1

公开(公告)日：2017-10-24

申请号：US14455772

申请日：2014-08-08

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed ,  David Geiger ,  Murad Kurwa

IPC: H05K1/14 ,  H05K3/24 ,  H05K1/02 ,  H01R12/52 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K1/0271 ,  H05K3/0085 ,  H05K3/241 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/04 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/10946 ,  H05K2201/10984 ,  H05K2201/2045 ,  H05K2203/0338 ,  H05K2203/0723

Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

公开(公告)号：US09646769B2

公开(公告)日：2017-05-09

申请号：US14877765

申请日：2015-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Seok Kyoon Woo ,  Soon Ju Lee ,  So Yeon Song

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.

公开(公告)号：US08902605B2

公开(公告)日：2014-12-02

申请号：US13495671

申请日：2012-06-13

Applicant: Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

Inventor： Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

IPC: H01R9/00

CPC classification number: H01R12/58 ,  H01R12/718 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/049 ,  H05K2201/1059 ,  H05K2201/10946

Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract translation: 用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。 表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。 表面安装部件保持器构造成接合表面安装部件的电触点。 表面贴装组件将表面安装适配器与表面贴装组件相结合。 在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

公开(公告)号：US20140240941A1

公开(公告)日：2014-08-28

申请号：US14190249

申请日：2014-02-26

Applicant: Murata Manufacturing Co., Ltd. ,  DENSO CORPORATION

Inventor： Yuki MIKAMI ,  Toru ITABASHI ,  Ryoichi SHIRAISHI ,  Shigeki NISHIYAMA

IPC: H01H85/02 ,  H05K1/18

CPC classification number: H01H85/0241 ,  H01H85/10 ,  H01H2085/0275 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10181 ,  H05K2201/10946

Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The normal terminal holds the main body at the position above and separated from the board surface even in a case of melt-down of the cut-off portion.

Abstract translation: 电子部件的主体具有连接有多个端子的多个电极。 端子包括正常端子和熔丝端子，每个端子从熔接板形成的焊盘延伸出来，以将主体保持在印刷电路板的板表面上方和与其分离的位置。 熔丝端子具有比熔丝端子的其它部分更小的宽度的截止部分，使得当过剩电流在熔丝端子中流动时，截止部分熔化。 正常端子即使在切断部分熔化的情况下也将主体保持在板表面上方和与板表面分离的位置。