公开(公告)号：US20170313578A1

公开(公告)日：2017-11-02

申请号：US15647107

申请日：2017-07-11

Applicant: mCube, Inc.

Inventor： Chien Chen LEE ,  Tzu Feng CHANG

IPC: B81B7/00 ,  B81C1/00 ,  G01L1/00 ,  G01C19/5783 ,  G01R33/02 ,  G01P15/08

CPC classification number: B81B7/0074 ,  B81B3/0035 ,  B81B3/0062 ,  B81B3/0072 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/0048 ,  B81B7/0051 ,  B81B7/0054 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/0023 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/0792 ,  G01C19/5719 ,  G01C19/5783 ,  G01L1/00 ,  G01L9/0042 ,  G01L19/0069 ,  G01L19/147 ,  G01P15/0802 ,  G01R33/02 ,  H04R2201/003

Abstract: A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

公开(公告)号：US09791470B2

公开(公告)日：2017-10-17

申请号：US14141759

申请日：2013-12-27

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Kyu Oh Lee ,  Sarah Haney

IPC: H01L27/22 ,  G01P1/04 ,  G01P15/097 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: G01P1/04 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792 ,  G01P15/097 ,  H01L27/22 ,  Y10T29/49075

Abstract: Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

公开(公告)号：US20170253477A1

公开(公告)日：2017-09-07

申请号：US15602760

申请日：2017-05-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Enri DUQI ,  Flavio Francesco VILLA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0045 ,  B81B3/0072 ,  B81B2201/0228 ,  B81B2201/025 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00182 ,  B81C1/00325 ,  B81C2201/0116 ,  B81C2201/0173 ,  B81C2203/0785 ,  G02B26/0858

Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.

公开(公告)号：US09751751B2

公开(公告)日：2017-09-05

申请号：US14734791

申请日：2015-06-09

Applicant: Robert Bosch GmbH

Inventor： Jochen Reinmuth ,  Johannes Classen

IPC: B81B7/00

CPC classification number: B81B7/0038 ,  B81B7/007 ,  B81B2201/025 ,  B81B2207/092

Abstract: A micromechanical component includes a sensor chip and a cap chip connected to the sensor chip. A cavity is formed between the sensor chip and the cap chip. The sensor chip has a movable element situated in the cavity. The cap chip has a wiring level containing an electrically conductive electrode. The cap chip has a getter element situated in the cavity.

公开(公告)号：US09696157B2

公开(公告)日：2017-07-04

申请号：US14750840

申请日：2015-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Luca Giuseppe Falorni ,  Carlo Valzasina ,  Roberto Carminati ,  Alessandro Tocchio

IPC: G01C19/00 ,  G01C19/5712 ,  B81B3/00 ,  G01C19/5733 ,  G01C19/5747

CPC classification number: G01C19/5712 ,  B81B3/0018 ,  B81B3/0086 ,  B81B2201/025 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747

Abstract: MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.

公开(公告)号：US09574959B2

公开(公告)日：2017-02-21

申请号：US14517387

申请日：2014-10-17

Applicant: Apple Inc.

Inventor： Caleb C. Han ,  Tongbi Jiang ,  Jun Zhai

IPC: H01L29/84 ,  H01L21/50 ,  G01P15/12 ,  G01P15/08 ,  B81B7/00 ,  G01L7/08 ,  H01L41/113 ,  H01L41/09

CPC classification number: G01L7/08 ,  B81B7/0048 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C2203/0792 ,  G01L9/0045 ,  G01L9/0048 ,  G01L19/0618 ,  G01L19/146 ,  G01L19/148 ,  H01L41/094 ,  H01L41/1136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48095 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16195

Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.

Abstract translation: 描述传感器封装和形成方式。 在一个实施例中，传感器封装包括支撑模具，其特征在于凹部区域和在凹部区域上方突出的支撑锚固件。 传感器模具结合到支撑锚定件，使得在传感器模具和凹部区域之间存在气隙。 传感器模具包括位于空气间隙正上方的传感器。

公开(公告)号：US20170011972A9

公开(公告)日：2017-01-12

申请号：US14218633

申请日：2014-03-18

Applicant: MCube, Inc.

Inventor： XIAO (CHARLES) YANG

IPC: H01L21/8238 ,  H01L29/04

CPC classification number: H01L21/823878 ,  A61B5/14514 ,  B81B2201/025 ,  B81B2201/055 ,  B81C1/00246 ,  G01L9/0042 ,  G01L9/0054 ,  G01P15/0802 ,  G01P15/125 ,  H01L21/76254 ,  H01L21/8221 ,  H01L25/0657 ,  H01L27/0688 ,  H01L29/045 ,  H01L2924/0002 ,  H03H3/0073 ,  H01L2924/00

Abstract: A method for fabricating a three-dimensional integrated circuit device includes providing a first substrate having a first crystal orientation, forming at least one or more PMOS devices overlying the first substrate, and forming a first dielectric layer overlying the one or more PMOS devices. The method also includes providing a second substrate having a second crystal orientation, forming at least one or more NMOS devices overlying the second substrate, and forming a second dielectric layer overlying the one or more NMOS devices. The method further includes coupling the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate.

Abstract translation: 一种制造三维集成电路器件的方法包括提供具有第一晶体取向的第一衬底，形成覆盖在第一衬底上的至少一个或多个PMOS器件，以及形成覆盖该一个或多个PMOS器件的第一介电层。 该方法还包括提供具有第二晶体取向的第二衬底，形成覆盖第二衬底的至少一个或多个NMOS器件，以及形成覆盖该一个或多个NMOS器件的第二电介质层。 该方法还包括将第一电介质层耦合到第二电介质层以形成包括覆盖在第二衬底上的第一衬底的混合结构。

公开(公告)号：US20160340174A1

公开(公告)日：2016-11-24

申请号：US14806201

申请日：2015-07-22

Applicant: Honeywell International Inc.

Inventor： John R. Reinke ,  Grant H. Lodden

IPC: B81B7/00 ,  B81C1/00 ,  H02N1/00

CPC classification number: B81B7/0019 ,  B81B3/0081 ,  B81B7/0087 ,  B81B2201/0228 ,  B81B2201/025 ,  B81C1/0069 ,  H02N1/00

Abstract: A method for fabricating a thermally isolated microelectromechanical system (MEMS) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a MEMS device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the MEMS device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure. The MEMS device is thermally isolated on a thermal isolation stage by the at least one thermally isolating glass flexure. The at least one temperature sensing element in on a respective at least one of: the thermal isolation stage; and the MEMS device.

Abstract translation: 提供了一种用于制造热隔离微机电系统（MEMS）结构的方法。 该方法包括用玻璃晶片处理第一材料的第一晶片以形成包括第一材料和玻璃的至少一个牺牲结构的复合衬底; 在第二材料中形成MEMS装置; 在所述复合衬底中的至少一个上形成至少一个温度感测元件; 和MEMS器件; 以及蚀刻所述复合衬底中的所述第一材料的所述至少一个牺牲结构以形成至少一个热隔离玻璃弯曲部。 MEMS器件通过至少一个热隔离玻璃弯曲件在热隔离台上热隔离。 所述至少一个温度感测元件位于以下各自中的至少一个中：热隔离级; 和MEMS器件。

公开(公告)号：US20160214853A1

公开(公告)日：2016-07-28

申请号：US14608038

申请日：2015-01-28

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Joseph SEEGER

IPC: B81B3/00 ,  G01P15/125

CPC classification number: B81B3/0016 ,  B81B3/0037 ,  B81B2201/025 ,  B81B2203/0109 ,  B81B2203/0145 ,  B81B2203/053 ,  G01P15/125 ,  G01P2015/0837 ,  G01P2015/0854 ,  G01P2015/086

Abstract: A system and method for providing a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a substrate, an anchor region coupled to the substrate, at least one support arm coupled to the anchor region, at least two guiding arms coupled to and moving relative to the at least one support arm, a plurality of sensing elements disposed on the at least two guiding arms to measure motion of the at least two guiding arms relative to the substrate, and a proof mass system comprising at least one mass coupled to each of the at least two guiding arms by a set of springs. The proof mass system is disposed outside the anchor region, the at least one support arm, the at least two guiding arms, the set of springs, and the plurality of sensing elements.

Abstract translation: 公开了一种用于提供MEMS传感器的系统和方法。 在第一方面，该系统是MEMS传感器，其包括衬底，耦合到衬底的锚定区域，耦合到锚定区域的至少一个支撑臂，耦合到并相对于至少一个 支撑臂，设置在所述至少两个引导臂上的多个感测元件，以测量所述至少两个引导臂相对于所述基底的运动;以及证明质量系统，其包括耦合到所述至少两个引导件 武器由一套弹簧。 检测质量系统设置在锚定区域外部，至少一个支撑臂，至少两个引导臂，该组弹簧和多个感测元件。

公开(公告)号：US20160200566A1

公开(公告)日：2016-07-14

申请号：US14403571

申请日：2013-06-28

Applicant: INTEL IP CORPORATION

Inventor： Gerald Ofner ,  Thorsten Meyer ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00238 ,  B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/10 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

Abstract translation: 在实施例中，封装组件可以包括专用集成电路（ASIC）和具有有源侧和无源侧的微机电系统（MEMS）。 在实施例中，MEMS可以通过一个或多个互连直接耦合到ASIC。 MEMS，ASIC和一个或多个互连可以限定或形成空腔，使得MEMS的有源部分在空腔内。 在一些实施例中，封装组件可以包括通过多个一个或多个互连件直接耦合到ASIC的多个MEMS。 可以描述和/或要求保护其他实施例。