MEMS loudspeaker having an actuator structure and a diaphragm spaced apart therefrom

    公开(公告)号:US09980051B2

    公开(公告)日:2018-05-22

    申请号:US15311127

    申请日:2015-05-13

    Applicant: USound GmbH

    Abstract: The invention relates to a MEMS loudspeaker (1) for generating sound waves in the audible wavelength spectrum, with a carrier substrate (2) that features a substrate cavity (6) with two substrate openings (7, 8), which are formed on two opposite sides of the carrier substrate (2), an actuator structure (3), in particular a piezoelectric actuator structure, which is arranged in the area of one of the two substrate openings (7, 8) and is connected to the carrier substrate (2) in its edge area, and a membrane (4) anchored in its edge area, which, by means of the actuator structure (3), can be set into vibration for generating sound waves. In accordance with the invention, in a cross-sectional view of the MEMS loudspeaker (1), the membrane (4) is spaced at a distance from the actuator structure (3), such that an intermediate cavity (13) is formed between these two. Furthermore, the MEMS loudspeaker (1) features a coupling element (13) arranged in the intermediate cavity (13), which connects the actuator structure (3) to the membrane (4) and may vibrate with this with respect to the carrier substrate (2).

    MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE

    公开(公告)号:US20180063616A1

    公开(公告)日:2018-03-01

    申请号:US15335697

    申请日:2016-10-27

    Abstract: A microelectromechanical microphone package structure includes a substrate, sidewall, lid, sound wave transducer and processing module. The substrate has a plate, sound aperture penetrating the plate, and conduction portion disposed on the plate. The sidewall has one end disposed on the plate and has a conduction circuit electrically connected to the conduction portion. A chamber is defined between the lid, sidewall and plate. The lid has at least one solder pad and a third contact in electrical conduction with each other. The third contact is electrically connected to the conduction circuit. The sound wave transducer is disposed on the plate and in the chamber and aligned with the sound aperture. The processing module, which is disposed on the plate and in the chamber and electrically connected to the sound wave transducer and conduction portion, includes a processing chip and electronic component which are stacked and disposed on the plate.

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