公开(公告)号：US20170260044A1

公开(公告)日：2017-09-14

申请号：US15608011

申请日：2017-05-30

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Scott Lyall Cargill ,  Marek Sebastian Piechocinski

IPC: B81B7/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R19/005 ,  H04R19/04

Abstract: This application relates to MEMS transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole. The vent cover is moveable from its equilibrium position in response to a pressure differential across the vent cover so as to vary the size of a flow path through the vent hole. In various embodiments the vent cover comprises at least a first flap section (302a) and a second flap section (302b), the first flap section being hingedly coupled to the side of the vent hole and the second flap section being hingedly coupled to the first flap section so as to be moveable with respect to the first flap section. In some embodiments the second flap section (302b) may be configured so that it deflects away from the first section (302a) more readily than the first section deflects away from its equilibrium position.

公开(公告)号：US09758369B2

公开(公告)日：2017-09-12

申请号：US15098462

申请日：2016-04-14

Applicant: Robert Bosch GmbH

Inventor： Florian Schoen ,  Bernhard Gehl

IPC: H01L33/02 ,  B81B7/02 ,  G01L9/12 ,  H04R19/04 ,  B81C1/00 ,  G01L1/14 ,  H04R19/00 ,  H04R31/00

CPC classification number: B81B7/02 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00214 ,  B81C2201/0109 ,  B81C2201/013 ,  G01L1/148 ,  G01L9/12 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A manufacturing method for a MEMS element, by which both a microphone including a microphone capacitor and a pressure sensor including a measuring capacitor are implemented in the MEMS structure. The components of the microphone and pressure sensor are formed in parallel but independently in the layers of the MEMS structure. The pressure sensor diaphragm is structured from a first layer, which functions as a base layer for the microphone diaphragm. The fixed counter-electrode of the measuring capacitor is structured from an electrically conductive second layer which functions as a diaphragm layer of the microphone. The fixed pressure sensor counter-element is structured from third and fourth layers. The third layer functions in the area of the microphone structure as a sacrificial layer, the thickness of which in the area of the microphone structure determines the electrode distance of the microphone capacitor. The microphone counter-element is structured from the fourth layer.

公开(公告)号：US20170247246A1

公开(公告)日：2017-08-31

申请号：US15506068

申请日：2015-06-23

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Benedikt Stein ,  Michael Stumber

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/01 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81C1/00801

Abstract: A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si1-x-yCxNy)-based layer.

公开(公告)号：US20170233248A1

公开(公告)日：2017-08-17

申请号：US15132239

申请日：2016-04-19

Applicant: GlobalMEMS Co., Ltd.

Inventor： Hsi-Wen Tung ,  Ming-Ching Wu

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81C1/00182 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2203/0127 ,  B81B2207/07

Abstract: A micro sensor including a first substrate and a second substrate is provided. The first substrate has a surface with a cavity. The second substrate has a sensing structure. The surface of the first substrate with the cavity is bonded to the second substrate to seal the cavity, such that a pressure value in the cavity is a constant value. A manufacturing method thereof is also provided.

公开(公告)号：US20170225947A1

公开(公告)日：2017-08-10

申请号：US15088130

申请日：2016-04-01

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHIH-MING CHEN ,  YUAN-CHIH HSIEH ,  CHUNG-YI YU

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00269 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/093 ,  B81C1/00 ,  B81C1/00238 ,  B81C2201/0132 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/036 ,  H01L23/488 ,  H01L25/50

Abstract: The present disclosure provides a packaging method, including: providing a first semiconductor substrate; forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate includes a first bonding metal layer and a second bonding metal layer; providing a second semiconductor substrate having a bonding region, wherein the bonding region of the second semiconductor substrate includes a third bonding layer; and bonding the first semiconductor substrate to the second semiconductor substrate by bringing the bonding region of the first semiconductor substrate in contact with the bonding region of the second semiconductor substrate; wherein the first and third bonding metal layers include copper (Cu), and the second bonding metal layer includes Tin (Sn). An associated packaging structure is also disclosed.

公开(公告)号：US20170219448A1

公开(公告)日：2017-08-03

申请号：US15500542

申请日：2015-07-23

Applicant: Carl Freudenberg KG ,  EDC Electronic Design Chemnitz GmbH

Inventor： Thomas CAESAR ,  Renate TAPPER ,  Steffen HEINZ ,  Marco NEUBERT

IPC: G01L9/00 ,  H01L23/00 ,  B81B7/00

CPC classification number: B81B7/0061 ,  B81B7/008 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  G01L9/0042 ,  G01L9/0051 ,  G01L9/0073 ,  G01L2009/0069 ,  H01L24/16 ,  H01L24/45 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and the maximum height is 0.5-0.8 mm, thereby potentially providing a compact sensor.

公开(公告)号：US20170210618A1

公开(公告)日：2017-07-27

申请号：US15003332

申请日：2016-01-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kai-Fung Chang ,  Len-Yi Leu ,  Lien-Yao Tsai

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/09 ,  B81C2203/0109 ,  B81C2203/0172 ,  G01L9/0042 ,  G01L9/0073 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/80805 ,  H01L2224/81805

Abstract: A MEMS device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer is bonded to the second substrate, where bonding the cap wafer to the second substrate forms a first sealed cavity comprising the movable element and a second sealed cavity that is partially bounded by the membrane. Portions of the cap wafer are removed to expose the second sealed cavity to ambient pressure.

公开(公告)号：US20170203958A1

公开(公告)日：2017-07-20

申请号：US15119917

申请日：2015-02-05

Applicant: Robert Bosch GmbH

Inventor： Johannes CLASSEN ,  Torsten KRAMER ,  Hubert BENZEL ,  Jens FREY ,  Daniel Christoph MEISEL ,  Christoph SCHELLING

IPC: B81B7/00 ,  B81C3/00

CPC classification number: B81B7/0048 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/017 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2201/019 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.

公开(公告)号：US09676618B2

公开(公告)日：2017-06-13

申请号：US14931437

申请日：2015-11-03

Applicant: Continental Automotive Systems, Inc.

Inventor： Xiaoyi Ding ,  James Nowicki

IPC: H04R23/00 ,  H01L29/84 ,  H01L23/48 ,  H01L23/52 ,  B81C1/00 ,  G01L13/02

CPC classification number: B81C1/00888 ,  B81B7/0019 ,  B81B2201/0264 ,  B81C1/00182 ,  B81C2201/019 ,  B81C2203/031 ,  B81C2203/032 ,  G01L13/025 ,  G01L19/0654

Abstract: A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

公开(公告)号：US09638596B2

公开(公告)日：2017-05-02

申请号：US14248324

申请日：2014-04-08

Applicant: Wai Yew Lo

Inventor： Wai Yew Lo

IPC: G01L9/00 ,  H01L23/495 ,  H01L25/04 ,  G01L19/00 ,  G01L19/06

CPC classification number: G01L9/0052 ,  B81B2201/0228 ,  B81B2201/0264 ,  G01L19/0069 ,  G01L19/06 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L25/041 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.