公开(公告)号：US20190161340A1

公开(公告)日：2019-05-30

申请号：US16098230

申请日：2017-05-05

Applicant: ams AG

Inventor： Harald Etschmaier ,  Anderson Singulani

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0048 ,  B81B3/0021 ,  B81B7/0058 ,  B81B2201/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/051

Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.

公开(公告)号：US20190104616A1

公开(公告)日：2019-04-04

申请号：US16143677

申请日：2018-09-27

Applicant: Stephen A. Marsh

Inventor： Stephen A. Marsh

IPC: H05K1/18 ,  B81C1/00 ,  B81B3/00 ,  H05K1/03

CPC classification number: H05K1/189 ,  B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/0015 ,  B81C1/00166 ,  B81C99/0095 ,  B81C2201/019 ,  B81C2203/038 ,  B81C2203/051 ,  G01P15/125 ,  H05K1/0393

Abstract: Disclosed is a flexible electronic circuit substrate that includes a device that is fabricated from layers of the flexible electronic circuit substrate as part of construction of the flexible electronic circuit substrate. Such devices could be functional units such as micro electro mechanical devices (MEMS) devices such as micro-accelerometer sensor elements, micro flow sensors, micro pressure sensors, etc.

公开(公告)号：US20190077671A1

公开(公告)日：2019-03-14

申请号：US16183192

申请日：2018-11-07

Applicant: Infineon Technologies AG

Inventor： Guenther Ruhl ,  Matthias Koenig

IPC: C01B32/194 ,  G01R33/07 ,  B81C1/00 ,  H04R19/01

CPC classification number: C01B32/194 ,  B81B2201/0292 ,  B81C1/00158 ,  B81C1/00658 ,  C01B2204/02 ,  C01B2204/22 ,  G01R33/07 ,  H04R19/016

Abstract: A process for the formation of a graphene membrane component includes arranging a graphene membrane in a relaxed condition of the graphene membrane on a surface of a supportive substrate. The graphene membrane extends across a cut-out with an opening at the surface of the supportive substrate. The graphene membrane is moreover arranged so that a first portion of the graphene membrane is arranged on the surface of the supportive substrate and a second portion of the graphene membrane is arranged over the opening of the cut-out. The process further includes tensioning of the second portion of the graphene membrane, in order to convert the second portion of the graphene membrane to a tensioned condition, so that the second portion of the graphene membrane is permanently in the tensioned condition in an operating temperature range of the graphene membrane component.

公开(公告)号：US20180178393A1

公开(公告)日：2018-06-28

申请号：US15577097

申请日：2016-05-19

Applicant: TTY-SÄÄTIÖ SR

Inventor： Pooya Saketi ,  Pasi Kallio

IPC: B25J13/08 ,  B25J7/00 ,  B25J15/00 ,  B81C99/00

CPC classification number: B25J13/082 ,  B25J7/00 ,  B25J15/00 ,  B25J15/0028 ,  B81B2201/0292 ,  B81C99/002 ,  B81C2201/032

Abstract: A micro handling device for handling micro objects and measuring forces exerted on the micro objects. The micro handling device can include a micro gripper and a micro spring configured as a force sensor connected to the micro gripper.

公开(公告)号：US09869598B1

公开(公告)日：2018-01-16

申请号：US15192311

申请日：2016-06-24

Applicant: Honeywell International Inc.

Inventor： Richard Wade ,  Alistair David Bradley

IPC: G01L9/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: G01L9/0055 ,  B81B3/0021 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C2201/013 ,  B81C2203/0109 ,  G01L1/16 ,  G01L1/18

Abstract: Disclosed herein are force sensors which include a sense die assembly and methods for manufacturing the sense die assembly and the force sensor. The disclosed sense die assembly, force sensor, and methods utilize wafer-level retention to hold an actuation element in a cavity of the sense die.

公开(公告)号：US20170231518A1

公开(公告)日：2017-08-17

申请号：US15501426

申请日：2015-08-07

Applicant: The Regents of the University of California

Inventor： Shadi A. DAYEH ,  Farid AZZAZY ,  Sang Heon LEE

IPC: A61B5/0478 ,  B81C1/00 ,  B81B1/00

CPC classification number: A61B5/0478 ,  B81B1/00 ,  B81B2201/0292 ,  B81B2203/0361 ,  B81B2203/04 ,  B81C1/00111 ,  B81C2201/013

Abstract: A preferred conformal penetrating multi electrode array includes a plastic substrate that is flexible enough to conform to cortical tissue. A plurality of penetrating semiconductor micro electrodes extend away from a surface of the flexible substrate and are stiff enough to penetrate cortical tissue. Electrode lines are encapsulated at least partially within the flexible substrate and electrically connected to the plurality of penetrating semiconductor microelectrodes. The penetrating semiconductor electrodes preferably include pointed metal tips. A preferred method of fabrication permits forming stiff penetrating electrodes on a substrate that is very flexible, and providing electrical connection to electrode lines within the substrate.

公开(公告)号：US09725304B2

公开(公告)日：2017-08-08

申请号：US14887631

申请日：2015-10-20

Applicant: mCube Inc.

Inventor： Wenhua Zhang ,  Shingo Yoneoka

IPC: B81B7/02 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L41/113

CPC classification number: B81B7/02 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L41/1132

Abstract: A semiconductor device having multiple MEMS (micro-electro mechanical system) devices includes a semiconductor substrate having a first MEMS device and a second MEMS device, and an encapsulation substrate having a top portion and sidewalls forming a first cavity and a second cavity. The encapsulation substrate is bonded to the semiconductor substrate at the sidewalls to encapsulate the first MEMS device in the first cavity and to encapsulate the second MEMS device in the second cavity. The second cavity includes at least one access channel at a recessed region in a sidewall of the encapsulation substrate adjacent to an interface between the encapsulation substrate and the semiconductor substrate. The access channel is covered by a thin film. The first cavity is at a first atmospheric pressure and the second cavity is at a second atmospheric pressure. The second air pressure is different from the first air pressure.

公开(公告)号：US20170190571A1

公开(公告)日：2017-07-06

申请号：US15468066

申请日：2017-03-23

Applicant: INVENSENSE, Inc.

Inventor： Julius Ming-Lin Tsai ,  Baris Cagdaser ,  Martin Lim ,  Aleksey S. Khenkin

IPC: B81B7/02 ,  H04R1/04 ,  H04R29/00 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

公开(公告)号：US20170165715A1

公开(公告)日：2017-06-15

申请号：US15325492

申请日：2015-07-13

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： WOJTEK SUDOL ,  PETER DIRKSEN ,  VINCENT ADRIANUS HENNEKEN ,  RONALD DEKKER ,  MARCUS CORNELIS LOUWERSE

IPC: B06B1/02 ,  G01N29/24 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B2201/0292 ,  B81C1/00214 ,  G01N29/2406 ,  G01N29/262 ,  G01N2291/02475 ,  G01N2291/106 ,  H04R19/00

Abstract: A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.

公开(公告)号：US09658087B1

公开(公告)日：2017-05-23

申请号：US14705944

申请日：2015-05-06

Applicant: The United States of America, as Represented by the Secretary of the Air Force

Inventor： Jeffrey W. Baur ,  Matthew R. Maschmann ,  Gregory J. Ehlert ,  Benjamin T. Dickinson ,  David M. Phillips

IPC: G01F1/56

CPC classification number: G01F1/56 ,  B81B2201/0285 ,  B81B2201/0292 ,  B81C1/00206

Abstract: A method for making an artificial hair sensor, comprising the steps of: (a) depositing an electrode at each end of a microcapillary having an inside surface; (b) coating a structural fiber with alumina; (c) placing the alumina coated structural fiber inside the microcapillary, wherein part of the alumina coated structural fiber is in a spaced annular relationship with the microcapillary inside surface and part of the fiber extends outside the microcapillary; (d) placing the microcapillary and alumina coated structural fiber inside a heated furnace chamber; and, (e) injecting a vaporized catalyst into the heated furnace chamber. The vaporized catalyst may be a solution of ferrocene in xylene. The microcapillary may be made of glass.