公开(公告)号：US20180076113A1

公开(公告)日：2018-03-15

申请号：US15266786

申请日：2016-09-15

Applicant: International Business Machines Corporation

Inventor： Thomas J. Brunschwiler ,  Timothy Joseph Chainer ,  Evan George Colgan ,  Michael Anthony Gaynes ,  Jeffrey Donald Gelorme ,  Gerard McVicker ,  Ozgur Ozsun ,  Pritish Ranjan Parida ,  Mark Delorman Schultz ,  Bucknell C. Webb

IPC: H01L23/427 ,  H01L23/433 ,  H01L23/10 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L25/0655 ,  H01L21/4803 ,  H01L23/433 ,  H01L23/473 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83201

Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.

公开(公告)号：US09902880B2

公开(公告)日：2018-02-27

申请号：US14997130

申请日：2016-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji Motomura

IPC: H01L23/00 ,  C09J9/02 ,  H05K3/32 ,  C09J163/00 ,  H05K1/14

CPC classification number: C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2481/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2924/351 ,  H05K1/141 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10727 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

公开(公告)号：US20170352716A1

公开(公告)日：2017-12-07

申请号：US15382077

申请日：2016-12-16

Applicant: Samsung Display Co., Ltd

Inventor： Chungseok LEE ,  Donghee PARK ,  Cheolgeun AN ,  Jihoon OH ,  Euiyun JANG ,  Jeongho HWANG

IPC: H01L27/32 ,  H01L51/00 ,  H01L23/00

CPC classification number: H01L27/3276 ,  H01L24/29 ,  H01L24/32 ,  H01L51/0096 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/271 ,  H01L2224/29005 ,  H01L2224/29028 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/294 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/743 ,  H01L2224/81191 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2251/5369 ,  H01L2924/07811 ,  H01L2924/1426 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

公开(公告)号：US09837381B2

公开(公告)日：2017-12-05

申请号：US14870064

申请日：2015-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Alexander Heinrich

IPC: H01L21/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/00 ,  H01L25/00 ,  H01L23/495 ,  H01L21/683 ,  H01L23/482 ,  H01L23/544

CPC classification number: H01L25/0655 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4827 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/544 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68354 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06183 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2908 ,  H01L2224/291 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/29166 ,  H01L2224/29171 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75265 ,  H01L2224/75303 ,  H01L2224/75753 ,  H01L2224/7598 ,  H01L2224/83002 ,  H01L2224/83005 ,  H01L2224/83007 ,  H01L2224/83024 ,  H01L2224/83055 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/83092 ,  H01L2224/83101 ,  H01L2224/83127 ,  H01L2224/83132 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83208 ,  H01L2224/83222 ,  H01L2224/83385 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/83469 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/04941 ,  H01L2924/0496 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15157 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01074 ,  H01L2924/01024 ,  H01L2924/01023 ,  H01L2924/01027

Abstract: A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

公开(公告)号：US09640455B2

公开(公告)日：2017-05-02

申请号：US15096792

申请日：2016-04-12

Applicant: ROHM CO., LTD.

Inventor： Kenji Fujii ,  Yasumasa Kasuya ,  Mamoru Yamagami ,  Naoki Kinoshita ,  Motoharu Haga

IPC: H01L23/495 ,  H01L23/52 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/433 ,  H01L23/482 ,  H01L23/367 ,  H01L23/525

CPC classification number: H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20170098597A1

公开(公告)日：2017-04-06

申请号：US15383521

申请日：2016-12-19

Applicant: NXP USA, Inc.

Inventor： AKHILESH K. SINGH ,  RAMA I. HEGDE ,  NISHANT LAKHERA

IPC: H01L23/495 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49575 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/11334 ,  H01L2224/11436 ,  H01L2224/1161 ,  H01L2224/119 ,  H01L2224/13005 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16245 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2761 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/30131 ,  H01L2224/3201 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/32258 ,  H01L2224/3301 ,  H01L2224/33505 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83385 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83907 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/9205 ,  H01L2224/9222 ,  H01L2224/92227 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/1715 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/0782 ,  H01L2224/81 ,  H01L2224/114 ,  H01L2924/0781 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for forming a packaged semiconductor device includes attaching a first major surface of a semiconductor die to a plurality of protrusions extending from a package substrate. A top surface of each protrusion has a die attach material, and the plurality of protrusions define an open region between the first major surface of the semiconductor die and the package substrate. Interconnects are formed between a second major surface of the semiconductor die and the package substrate in which the second major surface opposite the first major surface. An encapsulant material is formed over the semiconductor die and the interconnects.

公开(公告)号：US20170025373A1

公开(公告)日：2017-01-26

申请号：US15217199

申请日：2016-07-22

Applicant: Infineon Technologies AG

Inventor： Niels Oeschler

IPC: H01L23/00

CPC classification number: H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27848 ,  H01L2224/83201 ,  H01L2224/83801

Abstract: A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The semiconductor chip is positioned on the carrier by picking the semiconductor chip and placing the semiconductor chip on the carrier, and pressing the semiconductor chip onto the carrier by a pressing force in a pressing direction, such that the pressing force acts on the semiconductor chip only above one or more continuous chip metallization sections arranged on the top side. Each of the one or more continuous chip metallization sections includes an annularly closed edge section which has a minimum width of more than zero in each direction perpendicular to the pressing direction. The pressing force does not act on the semiconductor chip above any of the edge sections.

Abstract translation: 半导体芯片包括具有底侧和与底侧相对的顶侧的半导体本体，以及设置在顶侧的钝化。 半导体芯片通过拾取半导体芯片并将半导体芯片放置在载体上而将载体上的位置定位在载体上，并且通过按压方向上的挤压力将半导体芯片按压到载体上，使得按压力仅作用在半导体芯片上 位于布置在顶侧上方的一个或多个连续芯片金属化部分上方。 所述一个或多个连续芯片金属化部分中的每一个包括在垂直于按压方向的每个方向上具有大于零的最小宽度的环形封闭边缘部分。 按压力不会作用在任何边缘部分上方的半导体芯片上。

公开(公告)号：US09502327B2

公开(公告)日：2016-11-22

申请号：US14913719

申请日：2015-01-09

Applicant: DENSO CORPORATION

Inventor： Shun Sugiura ,  Yasushi Ookura

IPC: H01L23/367 ,  B23K3/08 ,  H01L23/00 ,  B23K1/00 ,  B23K1/008 ,  H01L23/433 ,  H01L23/495

CPC classification number: H01L23/3675 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/087 ,  B23K2101/40 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/05554 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/83986 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/38 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: A semiconductor device includes: a semiconductor element having a solder region and a non-solder region on a first face; a first metal member disposed on the first face of the semiconductor element; a second metal member disposed on a rear face of the semiconductor element; a first solder that connects the solder region of the semiconductor element and the first metal member; and a second solder that connects the rear face of the semiconductor element and the second metal member. At least the second solder provides a melt-bond. A gravity center position of the first metal member coincides with a center position of the semiconductor element in a projection view from a stacking direction.

Abstract translation: 半导体器件包括：在第一面上具有焊料区域和非焊接区域的半导体元件; 设置在所述半导体元件的第一面上的第一金属构件; 设置在所述半导体元件的背面上的第二金属构件; 连接半导体元件的焊料区域和第一金属部件的第一焊料; 以及连接半导体元件的后表面和第二金属构件的第二焊料。 至少第二焊料提供熔融粘合。 第一金属构件的重心位置与半导体元件的从堆叠方向的投影视图的中心位置重合。

公开(公告)号：US09401315B1

公开(公告)日：2016-07-26

申请号：US14669775

申请日：2015-03-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Paul F. Bodenweber ,  Taryn J. Davis ,  Marcus E. Interrante ,  Chenzhou Lian ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Hilton T. Toy

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/10 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/492 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83201 ,  H01L2224/83447 ,  H01L2224/83493 ,  H01L2224/839 ,  H01L2224/83901 ,  H01L2924/16747 ,  H01L2924/16793 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/00014

Abstract: A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.

Abstract translation: 一种半导体器件封装，其包括半导体封装，与半导体封装相连接的半导体器件; 以及放置在半导体器件上并连接到半导体封装的盖子。 所述盖包括：第一材料的块，具有第一表面和第二表面，所述第二表面面向所述半导体器件，所述块具有在所述第一表面和所述第二表面之间延伸的穿孔; 用于填充穿孔的插入件，每个插入件由第二材料制成，至少一个插入件朝向半导体器件突出超过第二表面; 以及接合材料，以将所述插入件结合到所述块，使得所述插入件中的所述至少一个插入件朝向所述半导体器件突出超过所述第二表面。 还包括组装半导体器件封装的方法。

公开(公告)号：US20160155721A1

公开(公告)日：2016-06-02

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji SUGAKAWA ,  Yuji MIMURA ,  Shuhei MATSUMOTO ,  Takahiro MASUNAGA ,  Makoto TSUKISHIMA

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

Abstract translation: 提供了将基板彼此接合的方法，其包括：将第一基板保持在第一保持部的下表面上; 通过温度调节部分调节第二基板的温度以变得高于第一基板的温度; 将第二基板保持在第二保持部的上表面上; 通过用第一成像部分对第二基板的多个参考点进行成像来检查第二基板的状态，测量参考点的位置，并将测量结果与预定的允许范围进行比较; 并且用按压部件按压所述第一基板的中央部，使所述第一基板的中央部与所述第二基板的中央部接触，并顺序地接合所述第一基板和所述第二基板。