公开(公告)号：US09066446B1

公开(公告)日：2015-06-23

申请号：US13775066

申请日：2013-02-22

Applicant: Mark S. Olsson ,  Eric M. Chapman ,  Nicolas A. Smith

Inventor： Mark S. Olsson ,  Eric M. Chapman ,  Nicolas A. Smith

IPC: H04N5/225 ,  H05K7/20 ,  H01L27/146 ,  H05K1/02

CPC classification number: H04N5/2252 ,  H04N5/2256 ,  H04N5/2257 ,  H04N5/23203 ,  H04N2005/2255 ,  H05K1/0201 ,  H05K1/0207 ,  H05K1/0209 ,  H05K2201/09027 ,  H05K2201/10151

Abstract: Thermal extraction architectures for heat-generating electronic devices such as cameras or lights are disclosed. An electronic device such as a camera head may include a housing, a printed circuit board (PCB) within the housing, and a thermal extraction element positioned between the housing and PCB to transfer heat from the PCB to the housing and external environment.

Abstract translation: 公开了用于发热电子装置如照相机或灯的热提取结构。 诸如相机头的电子设备可以包括壳体，壳体内的印刷电路板（PCB），以及定位在壳体和PCB之间的热提取元件，以将热量从PCB传递到壳体和外部环境。

公开(公告)号：US09054101B2

公开(公告)日：2015-06-09

申请号：US14169799

申请日：2014-01-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Mark Semmelmeyer ,  Sandeep Kumar Goel

IPC: H01L21/44 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  H01L23/538

CPC classification number: H05K1/0201 ,  H01L21/561 ,  H01L22/22 ,  H01L23/3128 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H05K1/11 ,  H05K1/144 ,  H05K3/46 ,  H05K2201/10734 ,  Y10T29/49124 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.

Abstract translation: 实施例是一种方法，包括使用耦合到第一管芯和第二管芯的相应第一表面的相应的第一导电连接器将第一管芯和第二管芯附接到第一插入件的第一表面; 使用相应的第二导电连接器将第三管芯和第四管芯附接到第一插入件的第二表面，第一插入件的第二表面与插入件的第一表面相对; 以及使用耦合到所述第一管芯和所述第二管芯的相应第二表面的相应的第三导电连接器将所述第一管芯和所述第二管芯附接到衬底。

公开(公告)号：US20150075200A1

公开(公告)日：2015-03-19

申请号：US14551499

申请日：2014-11-24

Applicant: HITACHI, LTD.

Inventor： Kazuaki SUZUKI ,  Shigemasa SATO ,  Akio IDEI

IPC: H05K1/02 ,  F25B39/04 ,  H05K7/20

CPC classification number: H05K1/0201 ,  F25B39/04 ,  F28D15/0266 ,  F28D15/046 ,  F28F13/187 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20318 ,  H01L2924/00

Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

Abstract translation: 沸腾的制冷剂型冷却系统，在发热开始时抑制过冲，实现稳定的沸腾开始。 在沸腾制冷剂型冷却系统中，金属沸腾传热单元具有与发热体热接触的基部。 沸腾传热单元与液体制冷剂接触。 沸腾传热单元具有多个平行的隧道，其与其外表面上的通孔或间隙连通，比通过所有隧道在与隧道正交的方向上形成的隧道直径更深的沟槽以及沟槽上的盖板。

公开(公告)号：US08955983B2

公开(公告)日：2015-02-17

申请号：US13581006

申请日：2011-02-28

Applicant: Bradley E. Reis ,  Robert A. Reynolds, III ,  Yin Xiong ,  Greg P. Kramer ,  Robert J. Umpleby

Inventor： Bradley E. Reis ,  Robert A. Reynolds, III ,  Yin Xiong ,  Greg P. Kramer ,  Robert J. Umpleby

IPC: G03B21/16 ,  H05K7/20 ,  H01L23/34 ,  F21V29/00 ,  H05K1/02 ,  H04N9/31

CPC classification number: G03B21/16 ,  F21V29/00 ,  F21V29/85 ,  F21V29/86 ,  F21V29/89 ,  H04N9/31 ,  H04N9/3144 ,  H05K1/02 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20445

Abstract: A handheld device (10), including a projector module (20) which includes a light source having a laser or at least one light emitting diode; a thermal management system which includes a heat collector (30) formed of a material having a thermo-mechanical design constant of at least 10 mm-W/m*K and having a non-planar shape, the heat collector in thermal contact with the light source; a heat spreader (40) having a surface area at least 1.5 times that of the surface area of the heat collector and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader positioned in thermal contact with the heat collector, wherein thermo-mechanical design constant of a material is defined by thermal conductivity of the material multiplied by its average thickness.

Abstract translation: 一种手持式设备（10），包括投影仪模块（20），其包括具有激光或至少一个发光二极管的光源; 一种热管理系统，其包括由具有至少10mm-W / m×K的热机械设计常数且具有非平面形状的材料形成的集热器（30），所述集热器与所述热收集器 光源; 具有至少1.5倍于热收集器表面面积的表面积的散热器（40）和热机械设计常数至少为10mm-W / m×K，散热器定位成与 热收集器，其中材料的热机械设计常数由材料的热导率乘以其平均厚度限定。

公开(公告)号：US08929073B2

公开(公告)日：2015-01-06

申请号：US13494461

申请日：2012-06-12

Applicant: Kazuaki Suzuki ,  Shigemasa Sato ,  Akio Idei

Inventor： Kazuaki Suzuki ,  Shigemasa Sato ,  Akio Idei

IPC: H05K7/20 ,  H01L23/427

CPC classification number: H05K1/0201 ,  F25B39/04 ,  F28D15/0266 ,  F28D15/046 ,  F28F13/187 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20318 ,  H01L2924/00

Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

Abstract translation: 沸腾的制冷剂型冷却系统，在发热开始时抑制过冲，实现稳定的沸腾开始。 在沸腾制冷剂型冷却系统中，金属沸腾传热单元具有与发热体热接触的基部。 沸腾传热单元与液体制冷剂接触。 沸腾传热单元具有多个平行的隧道，其与其外表面上的通孔或间隙连通，比通过所有隧道在与隧道正交的方向上形成的隧道直径更深的沟槽以及沟槽上的盖板。

公开(公告)号：US08895863B2

公开(公告)日：2014-11-25

申请号：US13726827

申请日：2012-12-26

Applicant: Denso Corporation

Inventor： Masashi Inaba ,  Akito Itou

IPC: H05K1/00 ,  H05K1/16 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10166 ,  H05K2201/10969

Abstract: A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed from a surface of the insulating substrate and including a soldered portion at which a terminal of the electronic component is soldered, an internal layer conductor disposed on the circuit layer located inside the insulating substrate and defining through holes in a radial manner centering on the soldered portion, a heat releasing conductor disposed on the circuit layer next to the circuit layer on which the internal layer conductor is disposed, and connection vias inserted in the through holes and coupling the electrode and the heat releasing conductor so as to enable a heat transfer between the electrode and the heat releasing conductor. The internal layer conductor and the heat releasing conductor overlap a whole area of the soldered portion.

Abstract translation: 多层印刷电路板包括绝缘基板，布置在绝缘基板中的电路层，电子部件，设置在从绝缘基板的表面露出的电路层上的电极，并且包括焊接部分，电极部件的端子 焊接，设置在位于绝缘基板内部的电路层上的内部层导体，以以焊接部分为中心的径向方式限定通孔;布置在电路层旁边的放热导体，其中内层 布置导体，并且连接通孔插入到通孔中并联接电极和散热导体，以便能够在电极和放热导体之间传热。 内层导体和散热导体与焊接部分的整个区域重叠。

公开(公告)号：US08859907B2

公开(公告)日：2014-10-14

申请号：US13599984

申请日：2012-08-30

Applicant: Jan Hendrik Berkel

Inventor： Jan Hendrik Berkel

IPC: H05K1/02 ,  F28F21/00 ,  H05K3/30 ,  H01L23/367 ,  H01L23/36 ,  H05K3/00 ,  H01L23/00 ,  H01L25/065

CPC classification number: H05K1/0201 ,  F28F21/00 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K3/30 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.

Abstract translation: 本文公开了一种用于组装电路板的方法，该电路板在一个或两个侧面上具有至少一层铜包层或设置有导体轨道，其中在一个组装步骤中，至少一个刚性凸缘插入件插入到相关联的凹部中 电路板或与电路板相关联的部件，并且其中半导体部件的至少一个半导体管芯在随后的施加步骤中被施加到插入的法兰插入件上。

公开(公告)号：US20140251659A1

公开(公告)日：2014-09-11

申请号：US14129408

申请日：2012-07-02

Applicant: Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  H05K1/0201 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/30 ,  H05K3/341 ,  H05K3/38 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y10T29/4913

Abstract: A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.

Abstract translation: 安装有电子部件的电路板设置有绝缘芯基板和图案化的金属板。 金属板结合到绝缘芯基板的至少一侧。 绝缘芯基板和金属板形成层压体，其中设有排气孔。 排气孔形成为使得当安装电子部件时，存在于绝缘芯基板和金属板之间的气体膨胀并且经由排气孔被释放到大气开放的一侧。

公开(公告)号：US20140226283A1

公开(公告)日：2014-08-14

申请号：US13928380

申请日：2013-06-27

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/09663

Abstract: Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon. The substrate comprises an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate. The electrically-conductive layer is configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices.

Abstract translation: 对衬底上的多个发热装置的热隔离机理的实施例进行了说明。 在一个方面，衬底被配置用于要放置在其上的多个发热装置。 衬底包括当发热器件设置在衬底上时电耦合到发热器件的导电层。 导电层被配置为热分离发热器件，使得在发热器件中不存在通过导电层的热耦合。

公开(公告)号：US20140212147A1

公开(公告)日：2014-07-31

申请号：US13753949

申请日：2013-01-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： MICHAEL RENNE TY TAN ,  GLENN C. COCHRAN ,  SAGI VARGHESE MATHAI

IPC: H01S5/024

CPC classification number: H05K3/00 ,  H04B10/40 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/10121

Abstract: A system includes an optical transmitter package comprising an optical transmitter to generate optical transmission signals based on electrical transmission signals. The system also includes an optical receiver package comprising an optical receiver to generate electrical reception signals based on optical reception signals. The system further includes a printed circuit board (PCB) on which the optical transmitter package and the optical receiver package are mounted. The PCB includes a heat generating circuit component. The optical transmitter package can be mounted to the PCB to subjected to less heat from the heat generating circuit component than the optical receiver package.

Abstract translation: 一种系统包括光发射器组件，其包括基于电传输信号产生光传输信号的光发射器。 该系统还包括光接收器封装，其包括基于光接收信号产生电接收信号的光接收器。 该系统还包括印刷电路板（PCB），其上安装有光发射器封装和光接收器封装。 PCB包括发热电路部件。 光发射器封装可以安装到PCB，以承受来自发热电路部件的热量少于光接收器封装。