公开(公告)号：US07393771B2

公开(公告)日：2008-07-01

申请号：US10996038

申请日：2004-11-24

Applicant: Hiroshi Hozoji ,  Toshiaki Morita ,  Hiroshi Sasaki

Inventor： Hiroshi Hozoji ,  Toshiaki Morita ,  Hiroshi Sasaki

IPC: H01L21/44

CPC classification number: H05K3/328 ,  H01L23/24 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/16 ,  H01L2223/6644 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29344 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/183 ,  H05K3/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1131 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/2076 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.

Abstract translation: 电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。 在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，所述方法包括通过由至少一种类型的聚集粒子构成的金属层将两个电极接合的步骤 的金属。 然后，金属粒子的平均粒径为1〜50nm。 优选地，金属颗粒形成厚度为5至100μm的金属层。

公开(公告)号：US20080144319A1

公开(公告)日：2008-06-19

申请号：US11627601

申请日：2007-01-26

Applicant: CHANG-SHEN CHANG ,  JUEI-KHAI LIU ,  CHAO-HAO WANG ,  HSIEN-SHENG PEI

Inventor： CHANG-SHEN CHANG ,  JUEI-KHAI LIU ,  CHAO-HAO WANG ,  HSIEN-SHENG PEI

IPC: F21V29/02

CPC classification number: F21V29/51 ,  B82Y10/00 ,  F21V29/004 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/767 ,  F21V29/773 ,  F21V29/777 ,  F21V29/89 ,  F21Y2115/10 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Abstract translation: 发光二极管（LED）组件包括电路板（10），至少一个LED（20）与电路板的一侧电连接并布置在电路板的一侧;散热装置（40） 电路板的相对侧。 电路板限定对应于至少一个LED的位置的至少一个通孔（102）。 热界面材料（140）填充在电路板的至少一个孔中，以热连接至少一个LED和散热装置。 热界面材料是纳米材料和大分子材料的组成。

公开(公告)号：US20080085410A1

公开(公告)日：2008-04-10

申请号：US11539411

申请日：2006-10-06

Applicant: Davide Louis Simone ,  David Alexander Gibson ,  Eric James Crane Olson

Inventor： Davide Louis Simone ,  David Alexander Gibson ,  Eric James Crane Olson

IPC: B32B7/12 ,  B05D5/12 ,  H01B1/22

CPC classification number: H05K3/105 ,  B22F1/0018 ,  B22F1/0025 ,  B22F9/24 ,  B22F2001/0033 ,  B22F2001/0037 ,  B22F2998/00 ,  B22F2999/00 ,  B82Y30/00 ,  C23C18/08 ,  C23C18/14 ,  H01B1/22 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T428/2865 ,  B22F9/30 ,  B22F2202/05 ,  B22F2202/06

Abstract: A composition includes a decomposition product of a metal precursor. The metal precursor may include a carbamate and one or more metal selected from the group consisting of silver, gold, copper, and zinc. The decomposition product may include a metal nanoparticle. The metal nanoparticle may be present in an amount that is sufficient to render the composition electrically conductive, thermally conductive, or both electrically and thermally conductive. An associated article and method are provided.

Abstract translation: 组合物包括金属前体的分解产物。 金属前体可以包括氨基甲酸酯和一种或多种选自银，金，铜和锌的金属。 分解产物可以包括金属纳米颗粒。 金属纳米颗粒可以以足以使组合物导电，导热或电导电或导热两者的量存在。 提供了相关的文章和方法。

公开(公告)号：US20080044684A1

公开(公告)日：2008-02-21

申请号：US11758807

申请日：2007-06-06

Applicant: Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

Inventor： Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

IPC: B32B15/088 ,  B32B17/10 ,  B32B25/08 ,  C08G69/28 ,  C08K3/34

CPC classification number: H05K1/0346 ,  B29B17/0042 ,  B29B17/0404 ,  B29K2079/08 ,  B29L2007/008 ,  B32B15/08 ,  C08G73/1007 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068 ,  Y02W30/62 ,  Y02W30/625 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/2938 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31765

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract translation: 溶剂流延膜包括聚酰亚胺，其包含衍生自二酐组分的聚合的结构单元，所述二酐组分包含二酐，其选自3,4'-氧二邻苯二甲酸二酐，3,3'-氧联二邻苯二甲酸二酐，4,4'-氧联二邻苯二甲酸二酐， 和其组合与二胺组分包含4,4'-二氨基二苯砜; 其中所述聚酰亚胺的玻璃化转变温度为190℃至400℃; 并且其中所述膜具有小于60ppm /℃的热膨胀系数，0.1至250微米的厚度，不超过5重量％的残留溶剂。

公开(公告)号：US20070281099A1

公开(公告)日：2007-12-06

申请号：US11443265

申请日：2006-05-31

Applicant: James J. Howarth ,  Anthony R. James ,  Karel Vanheusden

Inventor： James J. Howarth ,  Anthony R. James ,  Karel Vanheusden

IPC: B05D1/12 ,  B05D3/02 ,  B05D7/00 ,  B05C5/00 ,  B41J2/01

CPC classification number: H05K3/247 ,  H05K1/095 ,  H05K3/125 ,  H05K2201/0257 ,  H05K2201/035 ,  H05K2203/013 ,  H05K2203/1476

Abstract: A system and a method are provided for ink-jet printing a solderable conductive pad onto a substrate. The system comprises at least one print head and a curing station for curing an ink deposited onto the substrate. The system is configured to: deposit at least a first layer of a first ink onto the substrate; cure the first layer of the first ink; deposit at least an intermediate layer of a second ink on top of the cured first layer of the first ink; cure the intermediate layer of the second ink; deposit at least a last layer of the first ink on top of the cured intermediate layer of the second ink; and cure the last layer of the first ink. The first ink has a relatively high conductivity. The second ink has a relatively low conductivity. The first layer, the intermediate layer, and the last layer may be arranged such that when solder is applied to the last layer, the solder is prevented from leaching through to the first layer.

Abstract translation: 提供了一种系统和方法，用于将可焊接导电垫喷墨印刷到基底上。 该系统包括至少一个打印头和固化站，用于固化沉积到基底上的油墨。 该系统被配置为：将至少第一层第一油墨沉积到基底上; 固化第一层油墨的第一层; 在第一墨水的固化的第一层的顶部上沉积至少第二墨水的中间层; 固化第二墨水的中间层; 在第二墨水的固化中间层的顶部上沉积至少最后一层第一墨; 并固化第一个墨水的最后一层。 第一种墨水具有较高的导电性。 第二墨水具有较低的导电性。 可以将第一层，中间层和最后一层布置成使得当将焊料施加到最后一层时，防止焊料浸入第一层。

公开(公告)号：US07276185B2

公开(公告)日：2007-10-02

申请号：US10969320

申请日：2004-10-21

Applicant: Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

Inventor： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC: H01B1/22 ,  B32B15/01 ,  B32B27/14

CPC classification number: H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

Abstract: A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

Abstract translation: 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。

公开(公告)号：US20070191556A1

公开(公告)日：2007-08-16

申请号：US10548919

申请日：2004-02-25

Applicant: Christian Eger

Inventor： Christian Eger

IPC: C08L63/00 ,  B32B27/38

CPC classification number: C08J5/005 ,  B82Y30/00 ,  C08G59/186 ,  C08G59/4021 ,  C08G59/58 ,  C08J2363/00 ,  C08K3/36 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0257

Abstract: The invention relates to a polymeric composition containing: a) at least one epoxy resin; b) at least one copolymer with groups, which react with epoxy resins, and with a glass transition temperature Tg of −20° C. or lower, c) nanoparticles having a mean particle size dmax ranging from 5 to 150 nm that is measured by means of a small-angle neutron scattering (SANS). The inventive composition enables the production of adhesives, composite materials, coatings and casting compounds exhibiting improved mechanical properties, particularly improve impact strength.

Abstract translation: 本发明涉及一种聚合物组合物，其含有：a）至少一种环氧树脂; b）至少一种具有与环氧树脂反应并具有-20℃或更低的玻璃化转变温度T g的基团的共聚物，c）具有平均粒度d max 范围为5到150nm，这是通过小角度中子散射（SANS）测量的。 本发明的组合物使得能够生产表现出改进的机械性能的粘合剂，复合材料，涂料和浇铸化合物，特别是改善冲击强度。

公开(公告)号：US20070177331A1

公开(公告)日：2007-08-02

申请号：US11730761

申请日：2007-04-04

Applicant: Rabindra Das ,  John Lauffer ,  Voya Markovich ,  Kostas Papathomas

Inventor： Rabindra Das ,  John Lauffer ,  Voya Markovich ,  Kostas Papathomas

IPC: H01G4/228

CPC classification number: H01G4/206 ,  H01G4/232 ,  H01G4/33 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/09309 ,  Y10T29/43

Abstract: A capacitor material including a thermosetting resin (e.g., epoxy resin), a high molecular mass flexibilizer (e.g., phenoxy resin), and a quantity of nano-particles of a ferroelectric ceramic material (e.g., barium titanate), the capacitor material not including continuous or semi-continuous fibers (e.g., fiberglass) as part thereof. The material is adapted for being positioned in layer form on a first conductor member and heated to a predetermined temperature whereupon the material will not possess any substantial flaking characteristics. A second conductor member may then be positioned on the material to form a capacitor member, which then may be incorporated within a substrate to form a capacitive substrate. Electrical components may be positioned on the substrate and capacitively coupled to the internal capacitor.

Abstract translation: 包含热固性树脂（例如环氧树脂），高分子量增韧剂（例如苯氧基树脂）和一定量的铁电陶瓷材料（例如钛酸钡）的纳米颗粒的电容器材料，电容器材料不包括 连续或半连续纤维（如玻璃纤维）作为其一部分。 该材料适于在第一导体构件上以层的形式定位并加热到预定温度，因此材料将不具有任何显着的剥落特性。 然后可以将第二导体构件定位在材料上以形成电容器构件，然后其可以结合在衬底内以形成电容衬底。 电气部件可以位于衬底上并电容耦合到内部电容器。

公开(公告)号：US20070148560A1

公开(公告)日：2007-06-28

申请号：US11592255

申请日：2006-11-03

Applicant: Chang-Bok Lee ,  Jung-Woong Son

Inventor： Chang-Bok Lee ,  Jung-Woong Son

IPC: G03F1/00

CPC classification number: H05K3/12 ,  G03F7/0047 ,  G03F7/2049 ,  H05K3/02 ,  H05K3/1266 ,  H05K3/227 ,  H05K2201/0257 ,  H05K2203/0117 ,  H05K2203/0517 ,  H05K2203/105 ,  Y10S977/72 ,  Y10S977/777 ,  Y10S977/787 ,  Y10S977/858

Abstract: A thin film pattern forming device includes a chamber having an inner space communicated with the outside, a first fixing unit provided in the chamber case, a pattern electrode plate having a protrusion electrode protruded with a certain shape, and fixed to the first fixing unit, a second fixing unit provided in the chamber case and spaced apart with a certain gap from the pattern electrode plate, for fixing a substrate on which an inked metallic nano-material is deposited, a power supply unit for supplying power to the first fixing unit and the second fixing unit so as to form electrodes thereat, and a drying unit for drying the inked metallic nano-material patterned on the substrate. A metal thin film line such as a gate line can be simply formed on the substrate, and a processing time can be shortened. Furthermore, required equipment is simplified thus to reduce an installation cost and to enhance a productivity.

Abstract translation: 一种薄膜图案形成装置，包括具有与外部连通的内部空间的室，设置在室壳体中的第一固定单元，具有突出的一定形状的突起电极的图案电极板，并固定到第一固定单元， 第二固定单元，设置在所述室壳体中并且与所述图案电极板间隔开一定间隙，用于固定其上沉积有着色金属纳米材料的基板;电源单元，用于向所述第一定影单元供电;以及 第二固定单元以在其上形成电极;以及干燥单元，用于干燥在基板上图案化的着色的金属纳米材料。 可以简单地在基板上形成诸如栅极线的金属薄膜线，并且可以缩短处理时间。 此外，所需的设备被简化，从而降低安装成本并提高生产率。

公开(公告)号：US07235745B2

公开(公告)日：2007-06-26

申请号：US11172786

申请日：2005-07-05

Applicant: Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

IPC: H05K1/16

CPC classification number: H05K1/167 ,  H01G4/206 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/095 ,  H05K1/162 ,  H05K3/0023 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/1453 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/49089 ,  Y10T29/49091 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A material for use as part of an internal resistor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. A circuitized substrate adapted for using such a material and resistor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

Abstract translation: 用作电路化衬底内的内部电阻器的一部分的材料包括聚合物树脂和一定量的纳米粉末，其包括至少一种金属组分和至少一种陶瓷组分的混合物。 陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。 或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。 还提供了适于在其中使用这种材料和电阻器的电路化基板和制造这种基板的方法。 还提供电气组件（基板和至少一个电气部件）和信息处理系统（例如，个人计算机）。