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    Method of fabricating a circuit board structure having an embedded electronic element
    63.
    发明授权
    Method of fabricating a circuit board structure having an embedded electronic element 有权
    制造具有嵌入式电子元件的电路板结构的方法

    公开(公告)号：US09433108B2

    公开(公告)日：2016-08-30

    申请号：US14097597

    申请日：2013-12-05

    Applicant: Unimicron Technology Corporation

    Inventor： Yung-Ching Lin ,  Chih-Kuie Yang ,  Ta-Han Lin

    IPC: H05K3/46 ,  H05K1/18

    CPC classification number: H05K3/4647 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2203/1189 ,  Y10T29/49155

    Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.

    Abstract translation: 公开了一种用于制造具有至少嵌入式电子元件的电路板结构的方法，其包括以下步骤：提供基板并且将基板中的至少一个电子元件嵌入到所述基板中，所述基板具有活性表面和所述电子元件的多个电极焊盘 元件从所述基板的表面露出; 在所述电子元件的电极焊盘上形成多个导电凸块; 并且用电介质层和层叠在电介质层上的金属层覆盖基板的表面和电子元件的有源面，其中，导体凸块穿透电介质层以与金属层接触，从而简化 制造工艺，降低制造成本，节省制造时间。

    Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby
    64.
    发明授权
    Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby 有权
    低介电树脂组合物，树脂膜，预浸料，由此制成的印刷电路板

    公开(公告)号：US09403981B2

    公开(公告)日：2016-08-02

    申请号：US14732121

    申请日：2015-06-05

    Applicant: ELITE MATERIAL CO., LTD.

    Inventor： Chen Yu Hsieh

    IPC: C08L7/02 ,  C08L77/06 ,  H05K1/03 ,  C08G73/10 ,  C08L79/08

    CPC classification number: C08L77/06 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1082 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5399 ,  C08L23/00 ,  C08L63/00 ,  C08L79/04 ,  C08L79/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358

    Abstract: A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

    Abstract translation: 一种树脂组合物，其包含（A）聚酰亚胺树脂; （B）预聚合的马来酰亚胺树脂; （C）热固性树脂; 和（D）阻燃剂。 用于合成聚酰亚胺树脂的反应物包括酸酐和二胺，二胺包括4,4'-二氨基二苯基甲烷及其类似化合物和聚醚二胺。 树脂组合物具有以下优点：由树脂组合物制成的树脂膜或预浸料包含由特定结构的二胺和预聚合的马来酰亚胺树脂合成的聚酰亚胺树脂，以获得令人满意的电路层压材料的特性， 例如低介电常数，低损耗因数，高耐热性和高粘合性，以用于制造金属包覆层压板和印刷电路板。

    Manufacturing method of printed wiring board and printed wiring board
    66.
    发明授权
    Manufacturing method of printed wiring board and printed wiring board 有权
    印刷电路板和印刷电路板的制造方法

    公开(公告)号：US09144157B2

    公开(公告)日：2015-09-22

    申请号：US13813678

    申请日：2011-07-28

    Applicant: Hiroto Iida

    Inventor： Hiroto Iida

    IPC: H05K1/09 ,  H05K3/06 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42 ,  H05K3/38

    CPC classification number: H05K3/06 ,  H05K1/0298 ,  H05K3/386 ,  H05K3/421 ,  H05K3/425 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09563

    Abstract: Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method. To achieve the object, a method for forming the wiring pattern adopted includes steps; for forming a laminate having a structure in which a copper foil layer formed using copper foil without roughening treatment having surface roughness (Rzjis) at a bonding surface of 2 μm or less and thickness of 5 μm or less is laminated to a conductive layer via an insulating layer; for providing a blind-hole composed of a hole perforating the copper foil layer and the insulating layer; and a bottom composed of the conductive layer in the laminate; for filling-up the blind-hole by a electro-plated copper in the time for depositing an electro-plated copper layer on a surface of the electroless-plated copper layer to make the total thickness of a copper layer provided on the insulating layer 15 μm or less, for providing of an etching resist layer having thickness of 15 μm or less and for etching of the copper layer.

    Abstract translation: 本发明的目的在于提供一种制造印刷电路板的方法，该印刷电路板能够以低成本和高产率进行精细的布线形成而不引入任何专用设备，以及通过该方法制造的印刷线路板。 为了实现该目的，用于形成布线图案的方法包括步骤： 为了形成具有这样的结构的层压体，其中使用铜箔形成的铜箔层，在不具有表面粗糙度（Rzjis）的2μm以下且厚度为5μm以下的表面粗糙度（Rzjis）的情况下，通过经由 绝缘层; 用于提供由穿孔铜箔层和绝缘层的孔构成的盲孔; 以及由层叠体中的导电层构成的底部; 在电镀铜层的表面上沉积电镀铜层的时间，通过电镀铜填充盲孔，使得设置在绝缘层15上的铜层的总厚度 μm以下，用于提供厚度为15μm以下的蚀刻抗蚀剂层和蚀刻铜层。

    FLUORORESIN SUBSTRATE
    67.
    发明申请
    FLUORORESIN SUBSTRATE 审中-公开
    氟菊酯底物

    公开(公告)号：US20150079343A1

    公开(公告)日：2015-03-19

    申请号：US14387272

    申请日：2013-03-25

    Applicant: Sumitomo Electric Fine Polymer, Inc.

    Inventor： Makoto Nakabayashi ,  Kazuaki Ikeda

    IPC: H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/0271 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0306 ,  H05K1/0373 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/092 ,  Y10T428/24355 ,  Y10T428/249974

    Abstract: The invention offers a fluororesin substrate that has a dielectric layer being mainly composed of fluororesin and being formed on a metal conductor, that sufficiently suppresses the occurrence of warpage at the time of the reflow, and that enables the exhibiting of sufficiently outstanding high-frequency characteristics, the dielectric layer including hollow glass beads; a fluororesin substrate that has a metal conductor having a surface roughness, Rz, of 2.0 μm or less; a fluororesin substrate that has fluororesin irradiated with an ionizing radiation at an exposure dose of 0.01 to 500 kGy; and a fluororesin substrate that has fluororesin being one or two or more of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).

    Abstract translation: 本发明提供一种氟树脂基材，其具有主要由氟树脂组成的介电层，并形成在金属导体上，充分抑制了回流时的翘曲发生，并且能够表现出足够突出的高频特性 介电层包括中空玻璃珠; 具有2.0μm以下的表面粗糙度Rz的金属导体的氟树脂基板; 以0.01〜500kGy的曝光剂量照射电离辐射的氟树脂的氟树脂基材; 以及具有氟树脂为聚四氟乙烯（PTFE），四氟乙烯 - 全氟烷基乙烯基醚共聚物（PFA），四氟乙烯 - 六氟丙烯共聚物（FEP）和四氟乙烯 - 乙烯共聚物（ETFE）中的一种或两种以上的氟树脂基材。

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