公开(公告)号：US06299456B1

公开(公告)日：2001-10-09

申请号：US09058586

申请日：1998-04-10

Applicant: James M. Wark ,  Salman Akram

Inventor： James M. Wark ,  Salman Akram

IPC: H01R1200

CPC classification number: H01R12/57 ,  G01R1/0408 ,  G01R1/0466 ,  H01L2924/0002 ,  H01R43/205 ,  H05K1/119 ,  H05K3/325 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49123 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49222 ,  Y10T29/49453 ,  H01L2924/00

Abstract: An interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract translation: 具有用于与芯片封装的引线暂时电接触的接触结构阵列的插入器。 接触结构可以与引线基本上接近于芯片封装体的所需位置。 此外，接触结构可以适于与具有非常细的间距的引线接触。 在第一实施例中，接触结构包括形成在插入件的主体上的凸起部件。 在每个凸起构件上形成导电层，以提供用于接合芯片封装引线的接触表面。 在另一个实施例中，凸起构件被形成在插入件中的凹陷所代替。 在每个凹陷的内表面上形成导电层，以提供用于接合芯片封装的引线的接触表面。 此外，可以使用凸起构件和凹陷的任何组合。

公开(公告)号：US06291897B1

公开(公告)日：2001-09-18

申请号：US09305493

申请日：1999-05-05

Applicant: James M. Wark ,  Salman Akram

Inventor： James M. Wark ,  Salman Akram

IPC: H05K300

CPC classification number: H01L24/10 ,  G01R1/06738 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.

Abstract translation: 公开了凸起的半导体器件接触结构，其包括至少一个非平面接触焊盘，其具有从其延伸的多个突起，用于接触凸起的集成电路（IC）器件的至少一个焊球，例如凸起的裸片和凸起的封装 IC设备。 突起被布置成与凸起的IC器件的焊球电接触，而不会使焊球基本上变形。 因此，本发明的接触焊盘不需要焊球的回流以重新形成焊球。 这样的接触垫可以设置在诸如探针等的各种测试设备上，并且可以用于临时和永久连接。 还公开了通过蚀刻和沉积形成接触焊盘的改进方法。

公开(公告)号：US20010011777A1

公开(公告)日：2001-08-09

申请号：US09779762

申请日：2001-02-08

Inventor： Hideki Kano

IPC: H01L023/48 ,  H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/10126 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A BGA type semiconductor device includes a base member 1, a land portion 2 formed on the base member 1, and a plurality of protrusions 4 formed on the land portion 2 by plating. Through the protrusions 4, the land portion 2 is connected to a solder ball 6. Each of the land portion 2 and the protrusions 4 has a surface coated with a metal plating layer 5.

Abstract translation: BGA型半导体器件包括基底部件1，形成在基底部件1上的接合部分2，以及通过电镀形成在接合部分2上的多个突出部分4。 通过突起4，接地部2与焊球6连接。接地部2和突起4的表面均具有金属镀层5的表面。

公开(公告)号：US06246587B1

公开(公告)日：2001-06-12

申请号：US09204531

申请日：1998-12-03

Applicant: Philip H. Chen

Inventor： Philip H. Chen

IPC: H05K332

CPC classification number: H01R4/04 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or “dam” over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.

Abstract translation: 具有更高安装强度的表面贴装器件封装及其方法。 在一个实施例中，电子设备由设备封装和一个或多个导电端子组成。 对于表面安装，器件端子各自设置有使用导电粘合剂粘合到电路板上的相应接触焊盘的安装表面。 端子还设置有跨过安装表面的至少一个凹槽。 当使用导电粘合剂将装置安装在电路板上时，该槽用于将导电粘合剂形成在接触垫上的脊或“阻挡”。 这提供了增加的安装强度，这可以消除额外的粘合剂材料对装置的侧面加强的需要，从而允许电路板上的装置的堆积密度的增加。

公开(公告)号：US6007349A

公开(公告)日：1999-12-28

申请号：US775945

申请日：1997-01-03

Applicant: Thomas H. Distefano ,  Joseph Fjelstad

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H05K3/3436 ,  H05K3/4092 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/0373 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T29/49147

Abstract: Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced by CTE mismatches between a chip and a substrate during thermal cycling of the chip. The connectors also accommodate deflections in the vertical direction (z direction--perpendicular to the plane of the connectors) which may be caused by connection to a substrate. Such substantially vertical leg features are formed using projection lithography, such as projected x-ray or ultra-violet ("UV") radiation, to selectively expose a photoresist layer such that the substantially vertical metal features may be formed by plating or etching. The sacrificial layer may be in the form of an array of posts, such that "stool-like" post connectors are created, or may be in the form of an array of apertures, such that "basket-like" receptacles or sockets are created. Such a flexible connector may be used in different applications resulting in superior device characteristics, such as: 1) a replacement for flip chip (C4) solder connections or for BGA solder connections; 2) a flexible socket element; or 3) a flexible thermal coupling element.

Abstract translation: 柔性连接器具有基本垂直的导电腿，允许连接器在芯片的热循环期间适应芯片和衬底之间的CTE错配引起的横向（连接器平面中的x-y方向）的偏转。 连接器还可以通过连接到基板而引起垂直方向（z方向 - 垂直于连接器的平面）的偏转。 这种基本上垂直的腿部特征使用诸如投影的x射线或紫外线（“UV”）辐射的投影光刻来形成，以选择性地暴露光致抗蚀剂层，使得可以通过电镀或蚀刻形成基本垂直的金属特征。 牺牲层可以是柱的阵列的形式，使得形成“凳状”柱连接器，或者可以是孔阵列的形式，使得形成“篮状”插座或插座 。 这种柔性连接器可以用于不同的应用中，导致优异的器件特性，例如：1）替代倒装芯片（C4）焊料连接或用于BGA焊料连接; 2）柔性插座元件; 或3）柔性热耦合元件。

公开(公告)号：US5938452A

公开(公告)日：1999-08-17

申请号：US922018

申请日：1997-09-02

Applicant: Robert John Wojnarowski

Inventor： Robert John Wojnarowski

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/32 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K1/14 ,  H05K3/10

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917

Abstract: A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least one via extending therethrough to the surface metallization; and a floating pad structure including floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

公开(公告)号：US5746927A

公开(公告)日：1998-05-05

申请号：US762882

申请日：1996-12-12

Applicant: Kaoru Hashimoto ,  Tatuo Chiyonobu ,  Kyoichiro Kawano ,  Koji Watanabe ,  Masato Wakamura ,  Joe Yamaguchi

Inventor： Kaoru Hashimoto ,  Tatuo Chiyonobu ,  Kyoichiro Kawano ,  Koji Watanabe ,  Masato Wakamura ,  Joe Yamaguchi

IPC: H01L23/498 ,  H05K3/34 ,  B44C1/22

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L23/49866 ,  H05K3/3463 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025 ,  H05K2201/0373 ,  H05K2201/09863 ,  H05K2201/10984 ,  H05K2203/0594 ,  H05K2203/1105

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract translation: 一种电连接装置，包括在其上设置有输入/输出端子的第一电路板，每个端子具有涂覆有镓的尖端表面和在其上设置有接触端子的第二电路板，每个端子具有涂覆有铟的尖端表面 或锡。 当第一电路板的输入/输出端子与第二电路板的各个端子接触时，通过镓和铟或锡之间的相互作用形成低熔点合金层，并且端子电连接到 彼此。 第二金属层包括大致垂直于端子表面延伸的多个线状金属支撑体和由线状金属支撑体保持的低熔点金属。

公开(公告)号：US5705082A

公开(公告)日：1998-01-06

申请号：US378525

申请日：1995-01-26

Applicant: David Hinson

Inventor： David Hinson

IPC: C23F1/02 ,  C23F1/26 ,  H05K3/38 ,  C23F1/00

CPC classification number: H05K3/383 ,  C23F1/02 ,  C23F1/26 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2201/0373 ,  H05K2203/0769

Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

Abstract translation: 提供了一种使金属表面粗糙化的方法，包括将涂层涂覆到金属表面上，其中涂层是临时阻挡侵蚀金属表面的蚀刻剂，并且涂层易于蚀刻剂逐渐去除涂层，然后蚀刻涂覆的金属 具有含有蚀刻剂的水浴的表面有效地产生粗糙的金属表面。

公开(公告)号：US5610371A

公开(公告)日：1997-03-11

申请号：US403678

申请日：1995-03-14

Applicant: Kaoru Hashimoto ,  Tatuo Chiyonobu ,  Kyoichiro Kawano ,  Koji Watanabe ,  Masato Wakamura ,  Joe Yamaguchi

Inventor： Kaoru Hashimoto ,  Tatuo Chiyonobu ,  Kyoichiro Kawano ,  Koji Watanabe ,  Masato Wakamura ,  Joe Yamaguchi

IPC: H01L23/498 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L23/49866 ,  H05K3/3463 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025 ,  H05K2201/0373 ,  H05K2201/09863 ,  H05K2201/10984 ,  H05K2203/0594 ,  H05K2203/1105

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract translation: 一种电连接装置，包括在其上设置有输入/输出端子的第一电路板，每个端子具有涂覆有镓的尖端表面和在其上设置有接触端子的第二电路板，每个端子具有涂覆有铟的尖端表面 或锡。 当第一电路板的输入/输出端子与第二电路板的各个端子接触时，通过镓和铟或锡之间的相互作用形成低熔点合金层，并且端子电连接到 彼此。 第二金属层包括大致垂直于端子表面延伸的多个线状金属支撑体和由线状金属支撑体保持的低熔点金属。

公开(公告)号：US5526563A

公开(公告)日：1996-06-18

申请号：US401258

申请日：1995-03-09

Applicant: Tomohiro Tamaki ,  Kouichi Nagao ,  Hiroaki Fujimoto ,  Kazunari Nishihara

Inventor： Tomohiro Tamaki ,  Kouichi Nagao ,  Hiroaki Fujimoto ,  Kazunari Nishihara

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K2201/0108 ,  H05K2201/0373 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/281 ,  H05K3/305 ,  Y10T29/49126

Abstract: A flexible wiring board is constructed by placing, on a surface of a flexible ultraviolet-transmissive base member in the form of a layer, a conductive member in the form of a layer and a covering member in the form of a layer. The conductive member has an exposed leading area not covered with the covering member. A lead is aligned with an electrode and they are connected together with pressure exerted by a pressure applying jig which is ultraviolet-transmissive. A photosetting adhesive resin capable of shrinking in volume is injected between the flexible wiring board and a printed circuit board. The photosetting adhesive resin is irradiated with ultraviolet passing through the pressure applying jig and the base member. When irradiated with the ultraviolet rays, the photosetting adhesive resin hardens. Volume shrinkage force exerted by the photosetting adhesive resin enhances the connection between the lead and the electrode. Such a connecting procedure can be performed at room temperature thereby cutting down the cost of the flexible board and providing a wider range of applications thereof.

Abstract translation: 柔性布线板通过以层的形式将柔性紫外线透射性底座部件的表面设置为层状的导电部件和覆盖部件的形式构成。 导电构件具有未被覆盖构件覆盖的暴露的引导区域。 引线与电极对准，并且通过由紫外线透过的加压夹具施加的压力连接在一起。 能够在柔性布线板和印刷电路板之间注入能够收缩的光固化型粘合树脂。 照射通过加压夹具和基材的紫外线照射粘合树脂。 当用紫外线照射时，光固化粘合剂树脂变硬。 由光固化粘合剂树脂施加的体积收缩力增强了引线与电极之间的连接。 这种连接步骤可以在室温下进行，从而降低柔性板的成本并提供更广泛的应用范围。