Abstract:
Provided is a semiconductor device. The semiconductor device includes a first bump column on an active surface of the semiconductor device and including a plurality of first bumps spaced a first distance from an edge of the semiconductor device, a second bump column on the active surface and including a plurality of second bumps spaced a second distance that is greater than the first distance from the edge of the semiconductor device, and a third bump column on the active surface, and including a plurality of third bumps spaced a third distance that is greater than the second distance from the edge of the semiconductor device. The second bumps and the third bumps are sequentially alternated at least twice between the first bumps.
Abstract:
A wiring board of the present invention has a terminal section and a wiring section connected to the terminal section. The terminal section is configured so as to have a plurality of long connection terminals placed at predetermined intervals along a direction orthogonal to a direction in which the wiring board is to be inserted; and short connection terminals arranged between adjacent long connection terminals so as to be located behind the respective long connection terminals with respect to the direction of insertion. At least one adjacent pair consisting of a long connection terminal and a short connection terminal is short-circuited, and the length of the thus-short-circuited short connection terminal is made shorter than non-short-circuit short connection terminals.
Abstract:
A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.
Abstract:
Disclosed are electrical connectors and methods of assembling an electrical connector having “standard” (i.e., with electrical contacts having in-line tails), jogged (i.e., with electrical contacts having jogged tails but not connected orthogonally to another connector through a substrate), and/or “orthogonal” (i.e., with electrical contacts having jogged tails that are used in an orthogonal application) leadframe assemblies in the same connector. This provides the flexibility of using some of the available contacts in an orthogonal application and, at the same time, having remaining contacts available for routing on the midplane PCB. Though this could be done using only orthogonal leadframe assemblies, the combination of standard leadframe assemblies with orthogonal leadframe assemblies creates additional spacing between the PCB vias, so that signal traces can be more easily routed on the midplane PCB.
Abstract:
A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. Each connector has a strip connected to a bump pad. Each strip has a certain required strip width and each bump pad has a certain required pad width. Each bump pad on one electronic device is electrically connected to a corresponding bump pad on the other device by superimposition. The connectors are grouped into a group of three or more. Within each group, a strip is connected to a bump pad along one side edge thereof, and the bump pads are offset in two directions such that after the bump pads are superimposed, the pattern of the connected connectors in each group of connectors resembles a plurality of zigzag paths offset to maintain a constant gap between two strips. As such, the gap between two connectors can be minimized.
Abstract:
A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.
Abstract:
A flexible circuit sheet is electrically connected to an electric device. The electric device has a first row of electric terns and a second row of electric terminals. Both the first row of electric terminals and the second row of electric terminals extend along a first direction, the second row of electric terminals extends parallel to the first row of electric terminals. The flexible circuit comprises a base sheet, a first row of lands formed on the base sheet to be electrically connected to the first row of electric terminals, and a second row of lands formed on the base sheet to be electrically connected to the second row of electric terminals. A positional relationship between the first row of lands and the second row of lands is equal to a positional relationship between the first row of electric terminals and the second row of electric terminals. A surface area of each land of the first row of lands is greater than a surface area of each land of the second row of lands.
Abstract:
An electronic device is provided on which semiconductor packages can be mounted efficiently. The electronic device includes a board that can receive a plurality of first semiconductor packages each carrying a processor device and a plurality of second semiconductor packages each carrying a memory device. Mount regions where the packages are to be mounted and non-mount regions are alternately arranged in rows and columns on the board. This ensures approximately equal wiring distances between the packages, allowing processor devices to access associated memory devices at the same time.
Abstract:
A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.
Abstract:
The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to the controller, the module including a pair of memory devices oppositely positioned on respective surfaces of a substrate and interconnected by members extending through the substrate that couple terminals of the devices, the terminals being selected to include a group of terminals that are configured to communicate functionally compatible signals.