公开(公告)号：US07944320B2

公开(公告)日：2011-05-17

申请号：US12076650

申请日：2008-03-20

Applicant: Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

Inventor： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

IPC: H01P1/20 ,  H01P5/08

CPC classification number: H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

Abstract: An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

Abstract translation: 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。

公开(公告)号：US07916262B2

公开(公告)日：2011-03-29

申请号：US11650469

申请日：2007-01-08

Applicant: Po-Yuan Liu ,  Chuan-Mau Wei ,  Kuo-Chih Lee

Inventor： Po-Yuan Liu ,  Chuan-Mau Wei ,  Kuo-Chih Lee

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663 ,  H05K2201/0969

Abstract: A signal transmission assembly includes first and second substrates respectively having first and second electrodes, and a conductive layer disposed between the electrodes. The second electrode has a trench. The conductive layer includes an adhesive and conductive particles distributed therein. The second electrode is electrically connected to the first electrode through the conductive layer, and a portion of the adhesive is filled into the trench. When the assembly is applied to a display device, the first electrode electrically connects a non-display area to a display area of a display panel. When the second electrode and a third electrode at two ends of the second substrate are electrically connected to the first electrode and a third substrate (e.g., a PCB), respectively, a signal may be transmitted from the third substrate to the display area through the second substrate, the second electrode and the first electrode to control the display.

Abstract translation: 信号传输组件包括分别具有第一和第二电极的第一和第二基板以及设置在电极之间的导电层。 第二电极具有沟槽。 导电层包括粘合剂和分布在其中的导电颗粒。 第二电极通过导电层电连接到第一电极，并且一部分粘合剂被填充到沟槽中。 当将组件应用于显示装置时，第一电极将非显示区域电连接到显示面板的显示区域。 当第二电极和第二基板的两端的第三电极分别电连接到第一电极和第三基板（例如，PCB）时，信号可以从第三基板传送到显示区域 第二基板，第二电极和第一电极以控制显示器。

公开(公告)号：US20110012134A1

公开(公告)日：2011-01-20

申请号：US12782355

申请日：2010-05-18

Applicant: Hideo TAKEUCHI

Inventor： Hideo TAKEUCHI

IPC: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L31/0224

CPC classification number: H05K1/0206 ,  H04N1/0083 ,  H04N1/00978 ,  H04N1/00989 ,  H04N1/02815 ,  H04N1/02855 ,  H04N1/02865 ,  H04N1/02895 ,  H04N1/1017 ,  H04N1/12 ,  H05K1/0207 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: An image reading apparatus includes a light source that irradiates a document with light, the light source including a multilayer substrate and light emitting elements linearly arranged on a first surface of the multilayer substrate; and a light receiver that receives reflected light reflected from the document. The multilayer substrate has at least a pair of through holes each having an inner surface on which a reinforcement member is formed, the at least a pair of through holes being formed so that one of the light emitting elements is interposed therebetween. The reinforcement members contact wiring formed on the first surface of the multilayer substrate and wiring formed on a second surface of the multilayer substrate opposite the first surface.

Abstract translation: 图像读取装置包括：用光照射原稿的光源，所述光源包括多层基板和直线状配置在所述多层基板的第一面上的发光元件; 以及接收从文件反射的反射光的光接收器。 多层基板具有至少一对贯通孔，每个通孔具有形成有加强构件的内表面，所述至少一对通孔形成为使得一个发光元件插入其间。 加强构件接触形成在多层基板的第一表面上的布线和形成在多层基板的与第一表面相对的第二表面上的布线。

公开(公告)号：US20100321858A1

公开(公告)日：2010-12-23

申请号：US12488780

申请日：2009-06-22

Applicant: Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

IPC: H01G4/30 ,  H01G7/00

CPC classification number: H05K1/162 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/30 ,  H01G4/35 ,  H01L28/86 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09718 ,  Y10T29/43

Abstract: A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.

Abstract translation: 电容器装置可以包括第一电极，第二电极，第三电极，第一电介质层和第二电介质层。 第一电极可以与电容器装置的第一端子耦合。 第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。 第二电极可以与第一电极电隔离。 第三电极在第一电极和第二电极之下，并且可以与第二电极电隔离并与第一电极电耦合。 第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。 第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。 在一个实施例中，第二介电常数比第一介电常数大至少五倍。

公开(公告)号：US20100315684A1

公开(公告)日：2010-12-16

申请号：US12801361

申请日：2010-06-04

Applicant: Hiromasa Koike

Inventor： Hiromasa Koike

IPC: G06F15/00 ,  H04N1/38

CPC classification number: H05K1/0231 ,  H04N2201/0094 ,  H05K1/0227 ,  H05K1/0234 ,  H05K2201/09254 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: An information processing device including a printed circuit board, to access a detachable storage medium, including a control device, provided on the printed circuit board, to control access to the storage medium; a slot connector, provided on the printed circuit board to accept the storage medium; a junction portion between the storage medium and the printed circuit board, to receive a signal from the storage medium; a signal line connected between the junction portion and the control device, to transmit a signal from the storage medium to the control device; a noise line connected between the junction portion and a ground terminal, to transmit noise from the junction portion to the ground terminal; and a noise absorption element, provided in the noise line between the junction portion and the ground terminal.

Abstract translation: 一种信息处理装置，包括印刷电路板，用于访问设置在印刷电路板上的包括控制装置的可拆卸存储介质，以控制对存储介质的访问; 插槽连接器，设置在印刷电路板上以接受存储介质; 存储介质和印刷电路板之间的接合部分，用于接收来自存储介质的信号; 连接在所述接合部和所述控制装置之间的信号线，用于将信号从所述存储介质发送到所述控制装置; 连接在接合部和接地端子之间的噪声线，用于将噪声从接合部分传输到接地端子; 以及设置在接合部和接地端子之间的噪声线路中的噪声吸收元件。

公开(公告)号：US20100283159A1

公开(公告)日：2010-11-11

申请号：US12843251

申请日：2010-07-26

Applicant: Yao-Sheng LIN ,  Tai-Hong CHEN

Inventor： Yao-Sheng LIN ,  Tai-Hong CHEN

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13016 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/225 ,  H05K3/323 ,  H05K3/4092 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2203/175 ,  H01L2924/00

Abstract: A circuit substrate and the method for fabricating a packaging of the circuit substrate are provided. A plurality of electrodes are formed on the surface of the circuit substrate, the electrodes are formed with fork structures over an connection section of the circuit substrate, so that when the circuit substrate expands/contracts due to thermal processes, the probability of alignment with electrodes of an external circuit board is increased by easily detaching the fork structure overlapping an electrode of the external circuit board which is not corresponding to the fork structure of the electrode of the circuit substrate, so as to avoid short circuit. Thus, electrode misalignment due to electrode pitch variation of the traditional circuit substrate as a result of thermal deformation can be effectively eliminated.

Abstract translation: 提供电路基板和制造电路基板的封装的方法。 多个电极形成在电路基板的表面上，电极在电路基板的连接部分上形成有叉结构，使得当电路基板由于热处理而膨胀/收缩时，与电极对准的概率 通过容易地分离与外部电路板的与电路基板的电极的叉结构不相对应的电极重叠的叉结构来增加外部电路板，以避免短路。 因此，可以有效地消除由于热变形导致的传统电路基板的电极间距变化引起的电极未对准。

公开(公告)号：US20100252315A1

公开(公告)日：2010-10-07

申请号：US12819840

申请日：2010-06-21

Applicant: Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Ken Jian Ming Wang ,  Cheeman Yu ,  Hem Takiar

Inventor： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Ken Jian Ming Wang ,  Cheeman Yu ,  Hem Takiar

IPC: H05K1/18

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.

Abstract translation: 公开了具有共同的电连接器和接触焊盘区域的印刷电路板。 迹线和/或通孔所在接触焊盘区域可被蚀刻掉，以确保迹线，通孔和接触焊盘之间的电气隔离。

公开(公告)号：US20100224601A1

公开(公告)日：2010-09-09

申请号：US12429209

申请日：2009-04-24

Applicant: Yujiro Sugaya ,  Tomomitsu Saito

Inventor： Yujiro Sugaya ,  Tomomitsu Saito

IPC: B23K26/20

CPC classification number: H01R43/0221 ,  H01R13/6585 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/328 ,  H05K2201/0112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2203/107 ,  H05K2203/1136

Abstract: When a laser beam is incident on a thin film, carbide generated by the heat of the beam is not ejected between respective metallic thin plates. In each of second conductive sections of a metallic thin plate, a slit extends from a welding position to the end of the second conductive section. The second conductive sections are respectively welded to terminals by making the laser beam incident on the respective welding positions of a substrate for the thin film. Thereby, when the beam is incident on a resin, the resin is carbonized by the thermal energy of the laser beam and the resin carbide is ejected from the welded portion, and the carbide is discharged to the outside from the lower end of the second conductive section via the slit of the second conductive section. Thereby, the carbide is not ejected between the adjacent second conductive sections. Consequently, lowering of the insulation resistance between the respective second conductive sections due to the carbide is prevented.

Abstract translation: 当激光束入射到薄膜上时，由光束的热量产生的碳化物不会在相应的金属薄板之间喷射。 在金属薄板的每个第二导电部分中，狭缝从焊接位置延伸到第二导电部分的端部。 通过使激光束入射到用于薄膜的基板的各个焊接位置上，将第二导电部分分别焊接到端子。 因此，当光束入射到树脂上时，树脂被激光束的热能碳化，并且树脂碳化物从焊接部分喷出，碳化物从第二导电体的下端排出到外部 通过第二导电部分的狭缝。 因此，碳化物不会在相邻的第二导电部分之间喷射。 因此，防止了由于碳化物导致的各个第二导电部分之间的绝缘电阻的降低。

公开(公告)号：US20100200281A1

公开(公告)日：2010-08-12

申请号：US12414659

申请日：2009-03-30

Applicant: Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

Inventor： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC: H05K1/09

CPC classification number: H05K1/0233 ,  H05K1/0225 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09663

Abstract: A circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a first metallic neck connecting the first circuit and the second circuit areas. The second metal layer is disposed on a lower surface of the dielectric layer and has a third circuit area, a fourth circuit area and at least a second metallic neck connecting the third circuit and the fourth circuit areas. The orthogonal projections of the first and the second metallic necks on the upper surface are not overlapped. The first ferrite element is disposed on the upper surface and overlays at least one of the orthogonal projections of the first and the second metallic necks on the upper surface.

Abstract translation: 电路板结构包括电介质层，第一金属层，第二金属层和第一铁氧体元件。 第一金属层设置在电介质层的上表面上，并且具有第一电路区域，第二电路区域和连接第一电路和第二电路区域的第一金属颈部。 第二金属层设置在电介质层的下表面上，并且具有第三电路区域，第四电路区域和连接第三电路和第四电路区域的至少第二金属颈。 第一和第二金属颈部在上表面上的正交突起不重叠。 第一铁氧体元件设置在上表面上并且覆盖在上表面上的第一和第二金属颈部的至少一个正交突起。

公开(公告)号：US20100181089A1

公开(公告)日：2010-07-22

申请号：US12602979

申请日：2008-03-07

Applicant: Takahiro Hayashi ,  Makoto Hora ,  Keiichi Miyajima

Inventor： Takahiro Hayashi ,  Makoto Hora ,  Keiichi Miyajima

IPC: H05K5/06

CPC classification number: H05K1/028 ,  H05K2201/09663 ,  H05K2203/1147

Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.

Abstract translation: 为了在将密封构件整体形成在柔性布线板上时的热影响最小化，密封结构包括壳体，插入其中的柔性布线板以及与柔性布线板一体形成的密封构件，以密封地密封壳体和 柔性布线板，柔性布线板包括由弹性材料制成的基底基板，形成在基底基板的表面上的导电印刷布线层和覆盖印刷布线层的表面的覆盖膜，并且印刷 与密封构件交叉的布线层仅在与密封构件及其附近的交叉区域形成为多个分割印刷布线层。