公开(公告)号：US20090163147A1

公开(公告)日：2009-06-25

申请号：US12256467

申请日：2008-10-22

Applicant: Todd Steigerwald ,  Tom Bentley ,  Jerry Mayfield ,  Brad Vier

Inventor： Todd Steigerwald ,  Tom Bentley ,  Jerry Mayfield ,  Brad Vier

IPC: H04B1/38

CPC classification number: H05K1/0219 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/09809 ,  H05K2201/09981 ,  H05K2201/10189

Abstract: The present invention is a mobile device capable of transmitting or receiving wireless signals and incorporating an FPC shielded RF signal conductor for connecting transmitter and/or receiver circuitry to an associated RF antenna or antennas. In some embodiments FCP may incorporate the antenna in an unshielded section of the FPC. In some embodiments a single FPC may provide for multiple RF carrier conductors each with their own associated shielding.

Abstract translation: 本发明是能够发送或接收无线信号并结合FPC屏蔽的RF信号导体的移动设备，用于将发射机和/或接收机电路连接到相关联的RF天线或天线。 在一些实施例中，FCP可以将天线结合到FPC的非屏蔽部分中。 在一些实施例中，单个FPC可以为每个具有它们自己的相关屏蔽的多个RF载体导体提供。

公开(公告)号：US20090151993A1

公开(公告)日：2009-06-18

申请号：US11963704

申请日：2007-12-21

Applicant: Roya Yaghmai ,  Frank B. Parrish ,  Steven Hauptman

Inventor： Roya Yaghmai ,  Frank B. Parrish ,  Steven Hauptman

IPC: H01R12/04 ,  H05K3/10

CPC classification number: H05K1/0243 ,  G01R31/2889 ,  H05K3/3405 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/09845 ,  H05K2201/10356 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A shielded cable interface module having cable receiving grooves extending laterally to an edge of the board, each including a center conductor groove, an insulator groove, and a shield groove. A center conductor via and a shield via extend through the board. A conductor plane on the cable termination side surrounds the cable receiving grooves. The conductor plane includes a non-conductor region within the conductor plane adjacent to each of the conductor center conductor grooves. Ground vias associated with the cable receiving grooves are spaced apart from and partially surround the center conductor via outside and adjacent to the non-conductor region, the ground vias extend through the printed circuit board from the cable termination side to the system interface side.

Abstract translation: 屏蔽电缆接口模块，其具有横向延伸到板的边缘的电缆接收槽，每个包括中心导体槽，绝缘体槽和屏蔽槽。 中心导体通孔和屏蔽通孔延伸穿过电路板。 电缆终端侧的导体平面围绕电缆接收槽。 导体平面包括在导体平面内与导电体中心导体槽相邻的非导体区域。 与电缆接收槽相关联的接地通孔与中心导体间隔开并且经由外部并且与非导体区域相邻并且部分地围绕着中心导体，接地通孔从电缆终端侧延伸到系统接口侧。

公开(公告)号：US20090091406A1

公开(公告)日：2009-04-09

申请号：US12249273

申请日：2008-10-10

Applicant: Taras KUSHTA ,  Kaoru Narita ,  Takanori Saeki ,  Tomoyuki Kaneko ,  Hirokazu Tohya

Inventor： Taras KUSHTA ,  Kaoru Narita ,  Takanori Saeki ,  Tomoyuki Kaneko ,  Hirokazu Tohya

IPC: H01P1/00

CPC classification number: H05K1/0222 ,  H01P3/06 ,  H05K1/024 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract translation: 一种用于具有优选特性阻抗并能够使包括多层印刷电路板的印刷电路板小型化并且扩展安装在印刷电路板上的通孔传输线的频率范围的印刷电路板的紧凑型通路传输线，以及设计方法 一样的。 传输线具有形成内导体层边界的中心导体，构成信号通孔，围绕中心导体布置的多个通孔形成外导体层边界，以及由印刷电路板导体形成的多个导体板 通过传输线在压缩体的内部和外部导体层边界之间进一步设置本构参数调整间隙孔，并且电隔离以防止通过信号通孔传播的信号与其他信号在高电平中的串扰 频率信号频带。

公开(公告)号：US07507913B2

公开(公告)日：2009-03-24

申请号：US10522335

申请日：2003-03-24

Applicant: Yasushi Inagaki ,  Katsuyuki Sano

Inventor： Yasushi Inagaki ,  Katsuyuki Sano

IPC: H05K1/16

CPC classification number: H05K1/09 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0237 ,  H05K1/056 ,  H05K1/183 ,  H05K1/185 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09809 ,  H01L2224/05599

Abstract: A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 μm and a conductor circuit 58 on an interlayer resin insulating layer 50 is formed to have a thickness of 15 μm. By making the conductor layer 34P thick, it is possible to increase a volume of the conductor itself and decrease resistance. Further, by employing the conductor layer 34 as a power supply layer, it is possible to improve a capability of supplying power to the IC chip.

Abstract translation: 即使IC芯片处于高频范围，特别是具有频率超过3GHz的IC芯片，也不会出现故障或误差的封装基板。 芯基板30上的导体层34P形成为具有30μm的厚度，层间树脂绝缘层50上的导体电路58形成为15μm的厚度。 通过使导体层34P变厚，可以增加导体本身的体积并降低电阻。 此外，通过使用导体层34作为电源层，可以提高向IC芯片供电的能力。

公开(公告)号：US07500855B2

公开(公告)日：2009-03-10

申请号：US11554406

申请日：2006-10-30

Applicant: Thomas Andrew Kari

Inventor： Thomas Andrew Kari

IPC: H01R12/00

CPC classification number: H05K1/0243 ,  H01R12/725 ,  H01R24/50 ,  H01R2103/00 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059

Abstract: A self-fixturing, self-aligning coaxial connector assembly is provided. The coaxial connector assembly comprises a coaxial connector, a coaxial housing and a printed circuit board. The printed circuit board is aligned properly with the electrical end of the coaxial connector when mounted on the coaxial housing and is held in place while the printed circuit board is coupled to the coaxial housing.

Abstract translation: 提供自固定，自对准的同轴连接器组件。 同轴连接器组件包括同轴连接器，同轴壳体和印刷电路板。 当安装在同轴壳体上时，印刷电路板与同轴连接器的电端正确地对准，并且当印刷电路板耦合到同轴壳体时被固定就位。

公开(公告)号：US20090056998A1

公开(公告)日：2009-03-05

申请号：US11848330

申请日：2007-08-31

Applicant: Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse Hefner ,  Thomas W. Liang ,  Ankur K. Patel ,  Paul Rudrud

Inventor： Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse Hefner ,  Thomas W. Liang ,  Ankur K. Patel ,  Paul Rudrud

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/429 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09536 ,  H05K2201/09809 ,  H05K2203/061 ,  Y10T29/49165

Abstract: Disclosed herein is a method comprising drilling a first hole in a multilayered device; the multilayered device comprising a fill layer disposed between and in intimate contact with two layers of a first electrically conducting material; the fill layer being electrically insulating; plating the first hole with a slurry; the slurry comprising a magnetic material, an electrically conducting material, or a combination comprising at least one of the foregoing materials; filling the first hole with a fill material; the fill material being electrically insulating; laminating a first layer and a second layer on opposing faces of the multilayered device to form a laminate; the opposing faces being the faces through which the first hole is drilled; the first layer and the second layer each comprising a second electrically conducting material; drilling a second hole through the laminate; the second hole having a circumference that is encompassed by a circumference of the first hole; and plating the surface of the second hole with a third electrically conducting material.

Abstract translation: 本文公开了一种方法，包括在多层装置中钻出第一孔; 所述多层器件包括设置在两层第一导电材料之间并与之紧密接触的填充层; 填充层电绝缘; 用浆料电镀第一个孔; 所述浆料包括磁性材料，导电材料或包含至少一种前述材料的组合; 用填充材料填充第一个孔; 填充材料电绝缘; 在所述多层器件的相对面上层叠第一层和第二层以形成层压体; 相对的面是钻出第一孔的面; 所述第一层和所述第二层各自包括第二导电材料; 穿过层压板钻出第二个孔; 所述第二孔具有由所述第一孔的圆周包围的圆周; 以及用第三导电材料电镀所述第二孔的表面。

公开(公告)号：US07443272B2

公开(公告)日：2008-10-28

申请号：US11301382

申请日：2005-12-12

Applicant: Shin-Shing Jiang ,  Sheng-Yuan Lee

Inventor： Shin-Shing Jiang ,  Sheng-Yuan Lee

IPC: H03H7/38 ,  H01P1/04

CPC classification number: H01P5/085 ,  H01R24/50 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/3405 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2201/10356

Abstract: A signal transmission structure is at the edge of a circuit board, and the circuit board is connected with a coaxial cable connector through the signal transmission structure. The coaxial cable connector has a signal pin and a plurality of supporting pins for clipping the circuit board. The signal transmission structure includes a reference plane and a conductive layer. The reference plane with a non-conductive area is inside the circuit board. The conductive layer is disposed on the surface of the circuit board and above one side of the reference plane. The conductive layer includes a signal pad and a signal line. The signal line is connected with the signal pad, and the signal pad is further connected with the signal pin of the coaxial connector. The projections of the signal pad and the portion of the signal line on the reference plane are in the non-conductive area.

Abstract translation: 信号传输结构位于电路板的边缘，并且电路板通过信号传输结构与同轴电缆连接器连接。 同轴电缆连接器具有用于限制电路板的信号引脚和多个支撑引脚。 信号传输结构包括参考平面和导电层。 具有不导电区域的参考平面位于电路板的内部。 导电层设置在电路板的表面上并在基准平面的一侧上方。 导电层包括信号焊盘和信号线。 信号线与信号焊盘连接，信号焊盘进一步与同轴连接器的信号引脚连接。 信号焊盘和参考平面上的信号线部分的投影在非导电区域中。

公开(公告)号：US20080185180A1

公开(公告)日：2008-08-07

申请号：US12101426

申请日：2008-04-11

Applicant: Wheling Cheng ,  Roger Karam ,  Sergio Camerlo

Inventor： Wheling Cheng ,  Roger Karam ,  Sergio Camerlo

IPC: H05K1/11

CPC classification number: H05K1/0222 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/09309 ,  H05K2201/09809 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49162 ,  Y10T29/49165

Abstract: A method of fabricating a printed circuit board having a coaxial via is disclosed. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through the plurality of layers to connect GND layers in the printed circuit board, forming or inserting into the hollow via a conductor coated with non-conductive material, covering the top layer and bottom layer with dielectric and patterned signal layers, covering the top layer and bottom layer with a masking agent, plating the top layer and bottom layer with a conductive material that connects signal traces within via, and removing the masking agent from the top layer and bottom layer.

Abstract translation: 公开了一种制造具有同轴通孔的印刷电路板的方法。 该方法包括组装多个配置在堆叠中的层，使得多个层具有顶层信号层和底层信号层; 通过多个层形成中空通孔以连接印刷电路板中的GND层，通过涂覆有非导电材料的导体形成或插入中空，用介电和图案化的信号层覆盖顶层和底层，覆盖 顶层和底层具有掩蔽剂，用连接通孔内的信号迹线的导电材料电镀顶层和底层，以及从顶层和底层除去掩蔽剂。

公开(公告)号：US07404250B2

公开(公告)日：2008-07-29

申请号：US11292536

申请日：2005-12-02

Applicant: Wheling Cheng ,  Roger Karam ,  Sergio Camerlo

Inventor： Wheling Cheng ,  Roger Karam ,  Sergio Camerlo

IPC: H01K3/10

CPC classification number: H05K1/0222 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/09309 ,  H05K2201/09809 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49162 ,  Y10T29/49165

Abstract: A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through the plurality of layers to connect GND layers in the printed circuit board, forming or inserting into the hollow via a conductor coated with non-conductive material, covering the top layer and bottom layer with dielectric and patterned signal layers, covering the top layer and bottom layer with a masking agent, plating the top layer and bottom layer with a conductive material that connects signal traces within via, and removing the masking agent from the top layer and bottom layer.

Abstract translation: 一种制造具有同轴通孔的印刷电路板的方法包括。 该方法包括组装多个配置在堆叠中的层，使得多个层具有顶层信号层和底层信号层; 通过多个层形成中空通孔以连接印刷电路板中的GND层，通过涂覆有非导电材料的导体形成或插入中空，用介电和图案化的信号层覆盖顶层和底层，覆盖 顶层和底层具有掩蔽剂，用连接通孔内的信号迹线的导电材料电镀顶层和底层，以及从顶层和底层除去掩蔽剂。

公开(公告)号：US20080173472A1

公开(公告)日：2008-07-24

申请号：US11829029

申请日：2007-07-26

Applicant: Minoru Takizawa ,  Kazuhiko Nagao ,  Kiyokazu Ishizaki ,  Kuniyasu Hosoda

Inventor： Minoru Takizawa ,  Kazuhiko Nagao ,  Kiyokazu Ishizaki ,  Kuniyasu Hosoda

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/2036 ,  Y10T29/49144

Abstract: According to one embodiment, a printed circuit board includes a printed wiring board including a through hole part, an electronic component including a component body and a lead member inserted into the through hole part to be electrically connected thereto, a metal member disposed around and separated from the through hole part, and a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist

Abstract translation: 根据一个实施例，印刷电路板包括印刷线路板，其包括通孔部分，包括部件主体的电子部件和插入到要与其电连接的通孔部分中的引线部件，设置在其周围并分离的金属部件 从通孔部分和至少设置在金属构件周围的阻焊剂，至少部分组件安装在阻焊层上