公开(公告)号：US20080000078A1

公开(公告)日：2008-01-03

申请号：US11819380

申请日：2007-06-27

Applicant: Joachim Borst

Inventor： Joachim Borst

IPC: B23P19/00

CPC classification number: H05K13/06 ,  H05K3/306 ,  H05K13/0478 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/0195 ,  H05K2203/082 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53213

Abstract: For purposes of assembling contact pins (12) disposed in a row onto a circuit board (16), the pins (12) are grasped via a force fit in an insulating body (20) at their ends facing away from the circuit board (16)and are supported to prevent tilting. The body (20) has a suction surface (26) for an automated assembly device. After insertion of the pins (12) into the circuit board (16) and after the soldering process, the body (20) is pulled off the pins (12), so that they sit freely in the circuit board (16).

Abstract translation: 为了将配置成一行的接触销（12）组装到电路板（16）上，销（12）通过在其远离电路板（16）的端部处的力配合在绝缘体（20）中的力来抓握 ）并被支撑以防止倾斜。 主体（20）具有用于自动装配装置的抽吸表面（26）。 在将引脚（12）插入电路板（16）中并且在焊接过程之后，主体（20）被拉出销（12），使得它们自由地坐在电路板（16）中。

公开(公告)号：US20070249188A1

公开(公告)日：2007-10-25

申请号：US10588142

申请日：2004-11-30

Applicant: Wolfgang Mueller ,  Thomas Uhland ,  Dirk Schmidt ,  Ibrahim Degirmenci ,  Frank Distler

Inventor： Wolfgang Mueller ,  Thomas Uhland ,  Dirk Schmidt ,  Ibrahim Degirmenci ,  Frank Distler

IPC: H05K1/18 ,  H01R13/46

CPC classification number: H05K3/301 ,  H05K1/18 ,  H05K3/0061 ,  H05K5/0056 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/2045

Abstract: A device for the shakeproof accommodation of electrical special components and/or electrical circuits, particularly in a development as a second component set in a control unit, is made up of a carrier, onto which a circuit substrate, having special components fastened to it, is mounted in an electrically insulated manner over a partial surface, preferably by adhesion

Abstract translation: 用于特殊组件和/或电路的防震容纳装置，特别是作为设置在控制单元中的第二组件的开发中的装置由载体组成，其上具有紧固到其上的特殊部件的电路基板， 优选通过粘附而以部分表面以电绝缘方式安装

公开(公告)号：US07242084B2

公开(公告)日：2007-07-10

申请号：US11139223

申请日：2005-05-27

Applicant: Chee Wai Wong ,  Cheng Siew Tay

Inventor： Chee Wai Wong ,  Cheng Siew Tay

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10598 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613

Abstract: Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.

Abstract translation: 通常描述用于改进集成电路封装的装置和相关方法。 更具体地，描述了提高焊点可靠性的装置和相关方法。 在这方面，根据一个示例实施例，一个或多个加强销耦合到封装基板的周边，加强销能够耦合到电路板。

公开(公告)号：US20070138883A1

公开(公告)日：2007-06-21

申请号：US11641834

申请日：2006-12-20

Applicant: Gyu-Hong Cho

Inventor： Gyu-Hong Cho

IPC: H02K11/00

CPC classification number: H02K3/522 ,  H02K11/33 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/119 ,  H05K3/306 ,  H05K3/3405 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10863 ,  H05K2201/10962

Abstract: A coupling mechanism for coupling a coil wounded around a stator of a motor assembly to a circuit pattern of a printed circuit board, includes a plurality of connecting pins for electrically connecting the coil to the circuit pattern of the printed circuit board. The coil is indirectly connected to the circuit pattern through said one or more connecting pins. Further, the connecting pins are fixed at the PCB to be protruded outward.

Abstract translation: 用于将缠绕在电机组件的定子上的线圈耦合到印刷电路板的电路图案的耦合机构包括用于将线圈电连接到印刷电路板的电路图案的多个连接引脚。 线圈通过所述一个或多个连接引脚间接连接到电路图案。 此外，连接销固定在PCB上以向外突出。

公开(公告)号：US20070091659A1

公开(公告)日：2007-04-26

申请号：US11258509

申请日：2005-10-25

Applicant: Richard Lin ,  Monji Jabori ,  Thomas Sawyers

Inventor： Richard Lin ,  Monji Jabori ,  Thomas Sawyers

IPC: H02M7/217

CPC classification number: H05K1/141 ,  G06F1/184 ,  H02M3/155 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10689

Abstract: In at least some embodiments, a power converter comprises control logic adapted to be mounted on a first circuit board and a power component adapted to be electrically coupled to the control logic and adapted to be mounted on a second circuit board. The first circuit board mechanically attaches to the second circuit board. In other embodiments, a system comprises a system board, a module attached to the system board, and a power converter comprising a controller electrically coupled to a power component. The controller is mounted on the module and the power component is mounted on the system board.

Abstract translation: 在至少一些实施例中，功率转换器包括适于安装在第一电路板上的控制逻辑和适于电耦合到控制逻辑并适于安装在第二电路板上的功率部件。 第一电路板机械地连接到第二电路板。 在其他实施例中，系统包括系统板，连接到系统板的模块，以及包括电耦合到功率组件的控制器的功率转换器。 控制器安装在模块上，电源组件安装在系统板上。

公开(公告)号：US20070068700A1

公开(公告)日：2007-03-29

申请号：US11527852

申请日：2006-09-26

Applicant: Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

Inventor： Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

IPC: H05K1/11 ,  B23K26/16 ,  H01K3/10 ,  H05K1/00 ,  C25D5/02

CPC classification number: C25D5/022 ,  B23K26/0661 ,  C25D5/10 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/061 ,  H05K3/321 ,  H05K3/326 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/0554 ,  H05K2203/0557 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/49165 ,  Y10T29/49224 ,  H01L2924/00012

Abstract: A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the copper foils on the other side and through-holes simultaneously, and copper foils and insides of the blind holes and the through-holes are plated with copper. A metal ball plated with a noble metal is fixed on the copper foil by solidification of a metal paste to form an electric contact. Two superimposed plastic sheets are formed with holes each having a projection on inner wall of the hole, thereby vertically holding conductors by the projections of the holes of the superimposed plastic sheets. A laser beam machining method fabricates grooves or slits in a workpiece.

Abstract translation: 由聚酰亚胺层和铜箔构成的板通过蚀刻从一个方向加工形成通孔，铜箔和通孔内部镀有铜，或者通过蚀刻或激光加工对板进行加工 形成盲孔以同时露出另一侧的铜箔和通孔，盲孔和铜箔的铜箔和通孔用铜电镀。 镀有贵金属的金属球通过金属糊固化形成电接触而固定在铜箔上。 两个叠加的塑料片形成有孔，每个孔在孔的内壁上具有突起，由此通过叠加的塑料片的孔的突起垂直地保持导体。 激光束加工方法在工件中制造槽或狭缝。

公开(公告)号：US07193307B2

公开(公告)日：2007-03-20

申请号：US10863153

申请日：2004-06-07

Applicant: Michael R. Duggan ,  Nazario Lopes

Inventor： Michael R. Duggan ,  Nazario Lopes

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10303

Abstract: A power array includes a plurality of FET power assemblies and each FET power assembly has at least one field effect transistor mounted to a ciruit board. The circuit boards are arranged atop each other. A power supply pin extends through the circuit boards and is connected to a power input of each field effect transistor. A power output of each FET power assembly is connected to a power output pin which extends through each of the circuit boards. A heat sink is mounted to the power array beneath the lowest FET power assembly and is thermally connected to the field effect transistors of each FET power assembly. A method of assembling a power array including a plurality of FET power assemblies with at least one field effect transistor.

Abstract translation: 功率阵列包括多个FET功率组件，并且每个FET功率组件具有安装到电路板的至少一个场效应晶体管。 电路板彼此顶置。 电源引脚延伸穿过电路板，并连接到每个场效应晶体管的电源输入。 每个FET功率组件的功率输出连接到延伸穿过每个电路板的功率输出引脚。 散热器安装在最低FET功率组件下方的功率阵列上，并且热连接到每个FET功率组件的场效应晶体管。 一种组装包括具有至少一个场效应晶体管的多个FET功率组件的功率阵列的方法。

公开(公告)号：US07172439B1

公开(公告)日：2007-02-06

申请号：US11528177

申请日：2006-09-26

Applicant: Masayuki Yokobatake ,  Hiroyuki Arai ,  Yuzen Chin ,  Shigeru Yokota ,  Yoshikazu Kawai

Inventor： Masayuki Yokobatake ,  Hiroyuki Arai ,  Yuzen Chin ,  Shigeru Yokota ,  Yoshikazu Kawai

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H01R43/205 ,  H04N5/64 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1081 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49798

Abstract: The present invention makes it possible to fix connector pins at low cost. Connector pins penetrate both a holding substrate and a main substrate. The connecter pins can be restrained from an outward radial direction by both wall surfaces of pin holes of the holding substrate, and wall surfaces of through-holes of the main substrate, thus improving upright-standability of the connector pins. The holding substrate is formed of a same raw substrate as the main substrate is formed of, and permanent resists which are laminated on the holding substrate, and ink used for silk screen printing to which the holding substrate is subjected, are made of a same material of the main substrate, so that fire resistance of the holding substrate and fire resistance of the main substrate are same. Therefore, if the main substrate clears a predetermined fire-resistance standard, the holding substrate also inevitably clears the predetermined fire-resistance standard.

Abstract translation: 本发明使得可以以低成本固定连接器引脚。 连接器引脚穿过保持基板和主基板。 连接器销可以通过保持基板的销孔的两个壁面和主基板的通孔的壁面从外径向限制，从而提高连接器销的直立性。 保持基板由与主基板相同的原料基板形成，并且层压在保持基板上的永久性抗蚀剂和用于丝网印刷的用于保持基板的油墨由相同的材料制成 使得保持基板的耐火性和主基板的耐火性相同。 因此，如果主基板清除预定的耐火标准，则保持基板也不可避免地清除预定的耐火标准。

公开(公告)号：US20060267217A1

公开(公告)日：2006-11-30

申请号：US11139223

申请日：2005-05-27

Applicant: Chee Wong ,  Cheng Tay

Inventor： Chee Wong ,  Cheng Tay

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10598 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613

Abstract: Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.

Abstract translation: 通常描述用于改进集成电路封装的装置和相关方法。 更具体地，描述了提高焊点可靠性的装置和相关方法。 在这方面，根据一个示例实施例，一个或多个加强销耦合到封装基板的周边，加强销能够耦合到电路板。

公开(公告)号：US07122745B2

公开(公告)日：2006-10-17

申请号：US10934455

申请日：2004-09-07

Applicant: Kiyoshi Nakakuki

Inventor： Kiyoshi Nakakuki

IPC: H01R12/04

CPC classification number: H05K1/147 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2201/10878

Abstract: A circuit board includes: a metallic plate having an opening; a flexible circuit board disposed on a first surface of the metallic plate; and a printed circuit board disposed in the opening of the metallic plate. The flexible circuit board is protruded to the opening of the metallic plate so that a part of the flexible circuit board is bonded to the printed circuit board. The printed circuit board includes a first land disposed on a first surface of the printed circuit board, which is disposed on the first surface of the metallic plate. The flexible circuit board includes a second land disposed on a first surface of the flexible circuit board, which is opposite to the metallic plate. The first and second lands are electrically connected each other with a connecting member.

Abstract translation: 电路板包括：具有开口的金属板; 设置在所述金属板的第一表面上的柔性电路板; 以及布置在金属板的开口中的印刷电路板。 柔性电路板突出到金属板的开口，使得柔性电路板的一部分结合到印刷电路板。 印刷电路板包括设置在印刷电路板的第一表面上的第一焊盘，该第一焊盘设置在金属板的第一表面上。 柔性电路板包括设置在柔性电路板的与金属板相对的第一表面上的第二焊盘。 第一和第二平台通过连接构件彼此电连接。