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公开(公告)号:US20220333988A1
公开(公告)日:2022-10-20
申请号:US17847881
申请日:2022-06-23
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masaki HIROSE , Katsumi SHIBAYAMA , Takashi KASAHARA , Toshimitsu KAWAI , Hiroki OYAMA
Abstract: A light detection device includes a Fabry-Perot interference filter provided with a light transmitting region on a predetermined line, a light detector disposed on one side with respect to the Fabry-Perot interference filter on the line, a package having an opening positioned on the other side with respect to the Fabry-Perot interference filter on the line, a light transmitting member provided in the package such that the opening is blocked, and a temperature control element having an endothermic region thermally connected to the Fabry-Perot interference filter and the light detector. The endothermic region is positioned on one side with respect to the light detector on the line.
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公开(公告)号:US20210387852A1
公开(公告)日:2021-12-16
申请号:US17288250
申请日:2019-10-30
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Daiki SUZUKI , Nao INOUE , Katsumi SHIBAYAMA
Abstract: The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion, an end portion of the metal layer, and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface. The end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.
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公开(公告)号:US20210159351A1
公开(公告)日:2021-05-27
申请号:US17046864
申请日:2019-04-11
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomoya TAGUCHI , Yuki YOSHIDA , Katsumi SHIBAYAMA
IPC: H01L31/0352 , H01L31/102 , H01L31/12
Abstract: A semiconductor substrate includes first and second main surfaces opposing each other. The semiconductor substrate includes second semiconductor regions in a side of the second main surface. Each of the second semiconductor regions includes a first region including a textured surface, and a second region where a bump electrode is disposed. The second semiconductor regions are two-dimensionally distributed in a first direction and a second direction orthogonal to each other when viewed in a direction orthogonal to the semiconductor substrate. The first region and the second region are adjacent to each other in a direction crossing the first direction and the second direction. The textured surface of the first region is located toward the first main surface in comparison to the surface of the second region in a thickness direction of the semiconductor substrate. The first main surface is a light incident surface of the semiconductor substrate.
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公开(公告)号:US20210131870A1
公开(公告)日:2021-05-06
申请号:US17126297
申请日:2020-12-18
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Takashi KASAHARA , Katsumi SHIBAYAMA , Masaki HIROSE , Toshimitsu KAWAI , Hiroki OYAMA , Yumi KURAMOTO
IPC: G01J3/26 , B23K26/53 , B23K26/00 , B23K26/064 , B81B3/00 , B81C1/00 , G01J3/02 , G02B5/28 , G02B26/00 , B23K26/06
Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.
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75.
公开(公告)号:US20200310112A1
公开(公告)日:2020-10-01
申请号:US16765577
申请日:2018-11-09
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masaki HIROSE , Katsumi SHIBAYAMA , Takashi KASAHARA , Toshimitsu KAWAI , Hiroki OYAMA , Yumi KURAMOTO
IPC: G02B27/00 , H01L27/144 , H01L31/0203 , H01L31/0216 , H01L31/18 , B08B5/02 , B08B13/00
Abstract: A method for removing a foreign substance according to an embodiment includes: a step of preparing a Fabry-Perot interference filter in which a gap is formed between a portion of a first laminate at least including a first mirror portion and a portion of a second laminate at least including a second mirror portion facing each other so that a distance between the first mirror portion and the second mirror portion facing each other varies by an electrostatic force; a step of detecting a foreign substance adhering to a surface of the second laminate; and a step of blowing air in which an airflow peak position is adjusted on the basis of a position of the detected foreign substance onto the surface of the second laminate and thereby removing the foreign substance from the surface of the second laminate.
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公开(公告)号:US20200309637A1
公开(公告)日:2020-10-01
申请号:US16765564
申请日:2018-11-09
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Takashi KASAHARA , Katsumi SHIBAYAMA , Masaki HIROSE , Toshimitsu KAWAI , Hiroki OYAMA , Yumi KURAMOTO
Abstract: An electrical inspection method includes: a step of preparing a wafer in which a plurality of Fabry-Perot interference filter portions is formed, each of the plurality of Fabry-Perot interference filter portions in which a distance between a first mirror portion and a second mirror portion facing each other varies by an electrostatic force; and a step of inspecting electrical characteristics of each of the plurality of Fabry-Perot interference filter portions.
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公开(公告)号:US20200292386A1
公开(公告)日:2020-09-17
申请号:US16765765
申请日:2018-11-09
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Hiroki OYAMA , Katsumi SHIBAYAMA , Takashi KASAHARA , Masaki HIROSE , Toshimitsu KAWAI , Yumi KURAMOTO
IPC: G01J3/26 , H01L21/673
Abstract: A transportation method for transporting an object including a plurality of Fabry-Perot interference filters, the transportation method including a first step of accommodating the object in an accommodating container, wherein the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second minor portion provided on the substrate to face each other via a gap and in which a distance from each other is variable, and in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged.
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公开(公告)号:US20200249094A1
公开(公告)日:2020-08-06
申请号:US16636539
申请日:2018-07-24
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masahiro YAMAZAKI , Katsumi SHIBAYAMA , Ryusuke KITAURA , Ryosuke KOIKE , Go TANAKA
IPC: G01J5/20 , G01J1/02 , G01J5/04 , G01J5/02 , H01L27/144 , H01L31/0248 , H01L31/09 , H01L31/0232
Abstract: A light detector includes a substrate, a membrane disposed on a surface of the substrate, a first and a second electrode post supporting the membrane. The first electrode post includes a first main body portion having a tubular shape spreading from a first electrode pad toward a side opposite to the substrate, and a first flange portion provided in an end portion at the side opposite to the substrate in the first main body portion. The first flange portion is provided with a first sloped surface inclined so as to approach the substrate as it goes away from the first main body portion. A first wiring layer reaches an inner surface of the first main body portion through the first sloped surface. The second electrode post and the second wiring layer are formed similarly to the first electrode post and the first wiring layer.
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公开(公告)号:US20200232852A1
公开(公告)日:2020-07-23
申请号:US16843244
申请日:2020-04-08
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masaki HIROSE , Katsumi SHIBAYAMA , Takashi KASAHARA , Toshimitsu KAWAI , Hiroki OYAMA , Yumi TERAMACHI
IPC: G01J5/08 , G02B26/00 , G01J3/26 , G01J3/02 , G01J5/20 , G02F1/21 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/0304
Abstract: A light detection device includes: a Fabry-Perot interference filter provided with a light transmission region; a light detector configured to detect light transmitted through the light transmission region; a package having an opening and accommodating the Fabry-Perot interference filter and the light detector, and a light transmitting unit arranged on an inner surface of the package so as to close an opening, the light transmitting unit including a band pass filter configured to transmit light incident on the light transmission region. When viewed from a direction parallel to the line, an outer edge of the Fabry-Pert interference filter is positioned outside an outer edge of the opening, and an outer edge of the light transmitting unit is positioned outside the outer edge of the Fabry-Perot interference filter.
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公开(公告)号:US20200072676A1
公开(公告)日:2020-03-05
申请号:US16468046
申请日:2017-11-30
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masahiro YAMAZAKI , Katsumi SHIBAYAMA , Ryusuke KITAURA
IPC: G01J5/20
Abstract: A light detector includes: a substrate; and a membrane, in which the membrane includes a first wiring layer and a second wiring layer which are opposite each other with a gap extending along a line interposed therebetween, a resistance layer which is electrically connected to each of the first wiring layer and the second wiring layer and has an electric resistance depending on a temperature, a light absorption layer, and a separation layer which is disposed between each of the first wiring layer and the second wiring layer and the light absorption layer, and in which the light absorption layer includes a first region which spreads to the side opposite to the second wiring layer with respect to the first wiring layer and a second region which spreads to the side opposite to the first wiring layer with respect to the second wiring layer.
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