公开(公告)号：US20160159643A1

公开(公告)日：2016-06-09

申请号：US15041886

申请日：2016-02-11

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00182 ,  B81C1/00238 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L23/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/32145 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2224/3012 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00

Abstract: A method embodiment includes providing a MEMS wafer comprising an oxide layer, a MEMS substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the MEMS, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer. The MEMS substrate is patterned, and portions of the sacrificial oxide layer are removed to form a first and second MEMS structure. A cap wafer including a second cavity is bonded to the MEMS wafer, wherein the bonding creates a first sealed cavity including the second cavity aligned to the first MEMS structure, and wherein the second MEMS structure is disposed between a second portion of the polysilicon layer and the cap wafer. Portions of the carrier wafer are removed so that first cavity acts as a channel to ambient pressure for the first MEMS structure.

Abstract translation: 方法实施例包括提供包括氧化物层，MEMS衬底，多晶硅层的MEMS晶片。 包括使用各向同性蚀刻形成的第一空腔的载体晶片被结合到MEMS，其中第一空腔与多晶硅层的暴露的第一部分对准。 图案化MEMS衬底，并且去除牺牲氧化物层的部分以形成第一和第二MEMS结构。 包括第二腔的盖晶片被结合到MEMS晶片，其中所述接合产生包括与所述第一MEMS结构对准的所述第二腔的第一密封腔，并且其中所述第二MEMS结构设置在所述多晶硅层的第二部分和 盖晶圆。 去除载体晶片的部分，使得第一腔作为第一MEMS结构的环境压力的通道。

公开(公告)号：US20160138921A1

公开(公告)日：2016-05-19

申请号：US14938268

申请日：2015-11-11

Applicant: Seiko Epson Corporation

Inventor： Teruo TAKIZAWA ,  Atsuki NARUSE ,  Shigekazu TAKAGI

IPC: G01C19/5712 ,  G01P15/08 ,  B81C1/00 ,  G01P15/125

CPC classification number: G01C19/5769 ,  B81B2201/025 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0145 ,  G01C19/5712 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

Abstract: A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.

Abstract translation: 一种惯性传感器的制造方法，其包括设置在由基体和盖形成的空腔中的可移动体，并且其中形成有与空腔连通且与活动体电连接的布线的布线槽 包括形成第一开口部分，其不通过湿法蚀刻而穿过所述盖子; 通过粘合基体和盖子将可移动体容纳在空腔中; 形成第一密封材料，所述第一密封材料在所述可移动体的容纳之后与所述布线槽密封; 在形成所述第一密封材料之后，通过干蚀刻穿透所述第一开口部，形成与所述空腔连通的通孔; 以及形成密封所述通孔的第二密封材料。

公开(公告)号：US09322839B2

公开(公告)日：2016-04-26

申请号：US13854782

申请日：2013-04-01

Applicant: STMicroelectronics S.r.l.

Inventor： Giulio Ricotti ,  Alberto Pagani ,  Fulvio Vittorio Fontana ,  Ubaldo Mastromatteo

IPC: G01P15/11 ,  G01P15/105 ,  G01P15/08 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

Abstract translation: 惯性传感器，其具有带有激励线圈的主体和沿着第一轴线延伸的第一感测线圈。 悬挂质量体包括磁场集中器，位于对应于激励线圈的位置，并且构造成用于沿沿着第一轴线的平面中的惯性移位。 供电和感测电路电耦合到激励线圈和第一感测线圈，并且被配置为产生在励磁线圈中流动的时间流的电流，以便产生与磁场相互作用的磁场 感应线圈中的电压/电流。 集成电路被配置为测量在第一感测线圈中感应的电压/电流的值，以便检测与悬挂质量沿着第一轴的位移相关联的量。

公开(公告)号：US09260294B2

公开(公告)日：2016-02-16

申请号：US14141875

申请日：2013-12-27

Applicant: Kyu Oh Lee ,  Sasha N. Oster ,  Feras Eid ,  Sarah Haney

Inventor： Kyu Oh Lee ,  Sasha N. Oster ,  Feras Eid ,  Sarah Haney

IPC: B81B7/00 ,  B81C1/00

CPC classification number: G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.

Abstract translation: 描述了将压力或惯性传感器集成到集成电路制造和封装流程中。 在一个示例中，通过在第一介电层上沉积金属形成隔膜。 在隔膜上形成第二电介质层。 在第二电介质上形成金属网层。 第一介电层在隔膜下蚀刻形成空腔。 空腔内衬密封层。 空腔被覆盖以形成邻近隔膜的室，并且盖被密封抵靠空腔。

公开(公告)号：US09244093B2

公开(公告)日：2016-01-26

申请号：US13688099

申请日：2012-11-28

Applicant: Chih-Ming Sun ,  Ming-Han Tsai

Inventor： Chih-Ming Sun ,  Ming-Han Tsai

IPC: G01P15/08 ,  G01P15/09 ,  G01P15/00 ,  B81C1/00 ,  G01P15/125

CPC classification number: G01P15/0802 ,  B81B2201/025 ,  B81C1/0015 ,  G01P15/00 ,  G01P15/09 ,  G01P15/0922 ,  G01P15/125 ,  G01P2015/0837

Abstract: A micro-electro-mechanical sensing device including a substrate, a semiconductor layer, a supporting pillar, a first suspended arm, a connecting member, a second suspended arm, and a proof mass is provided. The semiconductor layer is disposed on or above the substrate. The supporting pillar is disposed on or above the semiconductor layer. The first suspended arm is disposed on the supporting pillar. The supporting connects a portion of the first suspended arm. The connecting member directly or indirectly connects another portion of the first suspended arm. The second suspended arm has a first surface and a second surface opposite to the first surface. The connecting member connects a portion of the first surface. The proof mass connects the second suspended arm and it includes a portion of the second suspended arm as a portion of the proof mass. A method for manufacturing the device is also provided.

Abstract translation: 提供了一种包括衬底，半导体层，支撑柱，第一悬臂，连接构件，第二悬臂和校验块的微机电感测装置。 半导体层设置在基板上或上方。 支撑柱设置在半导体层上或上方。 第一悬挂臂设置在支撑柱上。 支撑件连接第一悬臂的一部分。 连接构件直接或间接连接第一悬臂的另一部分。 第二悬臂具有与第一表面相对的第一表面和第二表面。 连接构件连接第一表面的一部分。 检验质量块连接第二悬臂，并且其包括第二悬臂的一部分作为证明块的一部分。 还提供了一种用于制造该装置的方法。

公开(公告)号：US09227840B2

公开(公告)日：2016-01-05

申请号：US14487104

申请日：2014-09-16

Applicant: Industrial Technology Research Institute

Inventor： Chung-Yuan Su ,  Chin-Fu Kuo ,  Chih-Yuan Chen ,  Chao-Ta Huang

IPC: H01L43/06 ,  B81B7/00 ,  G01P15/00 ,  G01R33/00 ,  G01R33/028

CPC classification number: B81B7/008 ,  B81B2201/0228 ,  B81B2201/025 ,  B81B2203/0109 ,  G01P15/00 ,  G01P15/124 ,  G01P15/125 ,  G01P2015/0831 ,  G01P2015/0834 ,  G01R33/00 ,  G01R33/0286

Abstract: A micro-electro mechanical apparatus having a PN-junction is provided. The micro-electro mechanical apparatus includes a movable mass, a conductive layer, and an electrode. The movable mass includes a P-type semiconductor layer and an N-type semiconductor layer. The PN-junction is formed between the P-type semiconductor layer and the N-type semiconductor layer. The micro-electro mechanical apparatus is capable of eliminating abnormal voltage signal when an alternating current passes through the conductive layer. The micro-electro mechanical apparatus is adapted to measure acceleration and magnetic field. The micro-electro mechanical apparatus can be other types of micro-electro mechanical apparatus such as micro-electro mechanical scanning micro-mirror.

Abstract translation: 提供具有PN结的微机电装置。 微机电装置包括可移动质量块，导电层和电极。 可移动块包括P型半导体层和N型半导体层。 在P型半导体层和N型半导体层之间形成PN结。 微电子机械装置能够在交流电流通过导电层时消除异常电压信号。 微机电装置适用于测量加速度和磁场。 微电机械装置可以是其他类型的微电机械装置，例如微机电扫描微镜。

公开(公告)号：US09206033B2

公开(公告)日：2015-12-08

申请号：US13479770

申请日：2012-05-24

Applicant: Christoph Gauger ,  Markus Heitz

Inventor： Christoph Gauger ,  Markus Heitz

IPC: F16F15/04 ,  B81B3/00 ,  G01P1/00 ,  G01P15/08

CPC classification number: B81B3/0078 ,  B81B2201/025 ,  B81B2203/0163 ,  G01P1/003 ,  G01P15/08 ,  G01P2015/084 ,  G01P2015/0857

Abstract: A micromechanical component including a mass structure which may be deflected with respect to a substrate with the aid of at least one spiral spring in a direction of deflection. The spiral spring includes at least one folding section, which is formed by two spring legs which are situated essentially in parallel to each other and are connected to each other with the aid of a connecting bar. A damping device for oscillating movements of the folding section in the direction of deflection is provided in the area of the connecting bar.

Abstract translation: 一种微机械部件，其包括质量结构，所述质量结构可以借助于沿偏转方向的至少一个螺旋弹簧而相对于基板偏转。 螺旋弹簧包括至少一个折叠部分，其由两个基本上彼此平行地定位并且通过连接杆彼此连接的弹簧腿形成。 在连接杆的区域中设置有用于使折叠部在偏转方向上摆动的阻尼装置。

公开(公告)号：US09097736B2

公开(公告)日：2015-08-04

申请号：US13658949

申请日：2012-10-24

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen ,  Arnd Kaelberer ,  Lars Tebje

IPC: G01P15/125 ,  G01P15/18 ,  B81B3/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0072 ,  B81B2201/025 ,  G01P15/18 ,  G01P2015/0805 ,  Y10T29/49155

Abstract: A micromechanical component includes: a substrate; a seismic weight joined to the substrate at a first suspension mount; at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount. The first electrode is mechanically connected to the second suspension mount with the aid of a support arm and set apart from the second suspension mount.

Abstract translation: 微机械部件包括：基板; 在第一悬挂安装座处接合到所述基板的地震重量; 至少一个第一电极，用于测量所述地震重量在第一方向上的运动，所述第一电极在第二悬架安装件处连接到所述基板; 以及至少一个第二电极，用于测量在与所述第一方向不同的第二方向上的所述地震重量的运动，所述第二电极在第三悬架安装件处连接到所述基板。 借助于支撑臂​​将第一电极机械地连接到第二悬架安装座，并与第二悬架安装件分离。

公开(公告)号：US09082882B2

公开(公告)日：2015-07-14

申请号：US14032649

申请日：2013-09-20

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Ando Feyh

IPC: H01L29/84 ,  H01L21/306 ,  B81B3/00 ,  H01L29/66 ,  B81C1/00 ,  G01P15/12

CPC classification number: H01L29/84 ,  B81B2201/025 ,  B81C1/00182 ,  G01P15/124 ,  H01L29/66477

Abstract: A microelectronic component includes a semiconductor substrate having a top side and a reverse side, an elastically movable mass device on the top side of the substrate, at least one source region provided in or on the mass device, at least one drain region provided in or on the mass device, and a gate region suspended on a conductor track arrangement above the at least one source region and at least one drain region and spaced apart from the mass device by a gap. The conductor track arrangement is anchored on the top side of the substrate in a periphery of the mass device such that the gate region remains fixed when the mass device has been moved.

Abstract translation: 微电子部件包括具有顶侧和反面的半导体衬底，在衬底的顶侧上的可弹性移动的质量装置，设置在质量装置中或其上的至少一个源极区，设置在或 以及悬挂在所述至少一个源极区域上方的导体轨道装置上的栅极区域和至少一个漏极区域，并且通过间隙与所述质量装置间隔开。 导体轨道布置在质量装置的周边中锚定在衬底的顶侧上，使得当质量装置已经移动时，栅极区域保持固定。

公开(公告)号：US20150185247A1

公开(公告)日：2015-07-02

申请号：US14141759

申请日：2013-12-27

Applicant: Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

Inventor： Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

IPC: G01P15/11 ,  G01P1/04

CPC classification number: G01P1/04 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792 ,  G01P15/097 ,  H01L27/22 ,  Y10T29/49075

Abstract: Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

Abstract translation: 集成电路封装描述了磁铁放置。 在一个示例中，端子被施加到磁体。 然后将磁体放置在衬底的顶层上，焊料在端子和顶层之间，并且焊料被回流以将磁体附着到衬底上。