公开(公告)号：US20170127516A1

公开(公告)日：2017-05-04

申请号：US15127165

申请日：2015-03-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Shigeyoshi NAKAYAMA ,  Jinjoo PARK ,  Sumito UEHARA ,  Kousuke MIURA ,  Hiroshi UEDA

IPC: H05K1/09 ,  H05K3/38 ,  H05K3/10 ,  H05K3/02 ,  H05K1/05

CPC classification number: H05K1/092 ,  H05K1/05 ,  H05K3/022 ,  H05K3/108 ,  H05K3/38 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0257 ,  H05K2203/0709 ,  H05K2203/072

Abstract: A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

公开(公告)号：US20170104143A1

公开(公告)日：2017-04-13

申请号：US15316028

申请日：2015-05-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US20170064841A1

公开(公告)日：2017-03-02

申请号：US15164191

申请日：2016-05-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Youn-gyu HAN

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H05K1/09 ,  H05K3/02

CPC classification number: H05K3/025 ,  B32B15/08 ,  H05K1/0373 ,  H05K3/0047 ,  H05K3/007 ,  H05K3/4682 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/0307 ,  H05K2203/107

Abstract: A resin-coated copper foil includes: a copper foil layer including a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer.

Abstract translation: 树脂被覆铜箔包括：铜箔层，包括第一表面和第二表面，其中铜箔层的第一表面的激光吸收率大于铜箔层的第二表面的激光吸收率， 并且其中肋形成在铜箔层的第二表面上; 载体膜，设置在铜箔层的第一表面上; 设置在铜箔层的第二表面上的底漆树脂层; 以及设置在底漆树脂层上的积层树脂层。

公开(公告)号：US20170064839A1

公开(公告)日：2017-03-02

申请号：US15065488

申请日：2016-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongyub LEE ,  Yunsung Woo ,  Changseung LEE ,  Eunhyoung CHO

IPC: H05K3/02 ,  B23K26/384 ,  B23K26/0622 ,  H05K3/18

CPC classification number: B23K26/0622 ,  B23K26/0624 ,  B23K26/082 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  H01L31/1884 ,  H05K3/0047 ,  H05K3/146 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/10128 ,  H05K2203/107

Abstract: A method of patterning holes includes placing a substrate on a stage of a laser system, the substrate having a graphene layer on a surface thereof, generating a pulse laser from the laser system, and forming a plurality of hole patterns spaced apart from each other on the graphene layer by irradiating the pulse laser while the graphene layer is in motion.

Abstract translation: 图案化孔的方法包括将基板放置在激光系统的台上，所述基板在其表面上具有石墨烯层，从激光系统产生脉冲激光，并且形成多个彼此间隔开的孔图案 石墨烯层通过在石墨烯层运动时照射脉冲激光器。

公开(公告)号：US20170044321A1

公开(公告)日：2017-02-16

申请号：US15306129

申请日：2015-04-20

Applicant: JFE CHEMICAL CORPORATION

Inventor： Youhei INOUE ,  Hiroaki MORI

IPC: C08G73/10

CPC classification number: C08G73/10 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2307/206 ,  B32B2307/734 ,  B32B2457/08 ,  C08G73/1042 ,  C08G73/1085 ,  C08L79/08 ,  C09J7/22 ,  C09J7/25 ,  C09J7/30 ,  C09J2203/326 ,  C09J2477/00 ,  C09J2479/086 ,  H05K1/0346 ,  H05K2201/0154

Abstract: There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

Abstract translation: 提供了可用于电子基板材料的聚酰亚胺组合物，保留了聚酰亚胺本身的高耐热性和机械强度，并且具有较低的介电常数和介电损耗角正切。 一种用于电子基板材料的聚酰亚胺组合物，其含有通过在含有5-（4-氨基苯氧基）-3- [4-（4-氨基苯氧基）苯基] -1,1,3-三甲基茚满的二胺成分和 含有3,3'，4,4'-联苯四羧酸二酐的酸组分。

公开(公告)号：US09560766B2

公开(公告)日：2017-01-31

申请号：US14621459

申请日：2015-02-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/10 ,  H05K1/02 ,  H05K1/03 ,  H05K3/36

CPC classification number: H05K1/183 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/181 ,  H05K1/185 ,  H05K3/10 ,  H05K3/366 ,  H05K3/4623 ,  H05K3/4635 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2203/06 ,  Y10T29/49155

Abstract: A circuit board includes a main portion obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and bonding the base sheets under pressure, and at least one planar conductor pattern provided in the main portion and including a concave portion and a convex portion. The concave portion and the convex portion extend in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in a direction parallel or substantially parallel to the predetermined direction. The convex portion protrudes in an opposite direction to the direction in which the concave portion is sunken. The at least one planar conductor pattern includes a first planar conductor pattern with a concave portion and a convex portion extending in a first direction. The circuit board further includes a plurality of first auxiliary members provided on one principal surface of the first planar conductor pattern and extending in the first direction, the first auxiliary members being spaced apart in a third direction different from the first direction.

Abstract translation: 电路板包括主要部分，其通过在预定方向上堆叠由柔性材料制成的多个基片并且在压力下粘合基片而获得，并且至少一个平面导体图案设置在主体部分中并且包括凹部和 凸部。 凹部和凸部沿与预定方向垂直或大致垂直的方向延伸。 凹部在与规定方向平行或大致平行的方向凹陷。 凸部沿与凹部凹陷的方向相反的方向突出。 所述至少一个平面导体图案包括具有凹部的第一平面导体图案和在第一方向上延伸的凸部。 电路板还包括设置在第一平面导体图案的一个主表面上并沿第一方向延伸的多个第一辅助构件，第一辅助构件在与第一方向不同的第三方向上间隔开。

公开(公告)号：US09549471B2

公开(公告)日：2017-01-17

申请号：US13579073

申请日：2011-06-16

Applicant: Kazuki Kammuri

Inventor： Kazuki Kammuri

IPC: H05K1/03 ,  H05K3/02 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1: (f3×t3)/(f2×t2)=>1 is satisfied when t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2: 1

Abstract translation: 包括铜箔和层压在其上的树脂层的铜箔复合体，其中当t2（mm）是铜箔的厚度，f2（mm）时，等式1：（f3×t3）/（f2×t2）=> 1 MPa）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，式2： 当f1（N / mm）在铜箔和树脂层之间的剥离强度为180°时，满足1 <= 33f1 /（F×T），F（MPa）是拉伸应变下的铜箔复合材料的强度为30％ ，T（mm）为铜箔复合体的厚度。

公开(公告)号：US20160381786A1

公开(公告)日：2016-12-29

申请号：US14858652

申请日：2015-09-18

Applicant: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  ZHEN DING TECHNOLOGY CO., LTD.

Inventor： XIAN-QIN HU ,  FU-YUN SHEN ,  MING-JAAN HO ,  YI-QIANG ZHUANG

IPC: H05K1/02 ,  H05K3/06 ,  H05K1/09

CPC classification number: H05K1/0216 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/09 ,  H05K3/06 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09618 ,  H05K2203/063

Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.

Abstract translation: 柔性电路板包括两个覆铜层压板，电路图案和两个接合层。 每个覆铜层压板包括绝缘基底和外部电路层。 电路图案位于两个覆铜层压板之间。 电路图案包括线性信号线，位于线性信号线的两个相对侧的两个接地线以及位于线性信号线和接地线之间的两个中空区域。 每个结合层位于电路图案和相应的覆铜层压板之间。 每个编码层限定了一个没有粘合剂的槽。 接合层通过槽与线性信号线隔开。 狭槽和中空区域协同地限定了包围线性信号线的空气介质层。 还提供了一种用于制造柔性电路板的方法。

公开(公告)号：US20160369053A1

公开(公告)日：2016-12-22

申请号：US15185895

申请日：2016-06-17

Applicant: ETERNAL MATERIALS CO., LTD.

Inventor： Shun-Jen CHIANG ,  Chung-Jen WU ,  Po-Yu HUANG ,  Meng-Yen CHOU ,  Chang-Hong HO ,  Chun-Kai CHENG

IPC: C08G73/10 ,  H05K1/02 ,  H05K1/03 ,  C09D179/08

CPC classification number: C08G73/1042 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B2250/40 ,  B32B2270/00 ,  C08G73/106 ,  C08G73/1082 ,  C09D179/08 ,  H05K1/0353 ,  H05K3/0097 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

Abstract translation: 本发明提供具有通过动态机械分析（DMA）测量的至少两个玻璃化转变温度的聚酰亚胺树脂。 而且，包括聚酰亚胺树脂的覆金属层压板。

公开(公告)号：US09521756B2

公开(公告)日：2016-12-13

申请号：US14339080

申请日：2014-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki Lee ,  Sun Woo Yun ,  Jun Woo Myung

IPC: H05K3/00 ,  H01L25/07 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K3/0014 ,  H01L23/4334 ,  H01L23/49575 ,  H01L25/07 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/0154 ,  H05K2201/066 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor chip mounted on a mounting surface of the heat radiating plate, an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards, a wire for electrical connection between the semiconductor chip and the external connection terminal; and a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate, and in particular, the molding portion does not intrude over an exposed surface of the lower portion of the heat radiating plate through the step difference portion. In addition, disclosed herein is a fabricating method for preventing flush of the molding portion on the exposed surface.

Abstract translation: 这里公开了一种功率模块封装，其包括散热板，该散热板包括围绕其边缘部分的台阶差部分，安装在散热板的安装表面上的半导体芯片，设置在散热板外周上的外部连接端子 板，电连接到半导体芯片，并向外突出，用于在半导体芯片和外部连接端子之间电连接的导线; 以及用于封装半导体芯片和散热板的一部分的模制部分，特别地，模制部分不会通过台阶差部分侵入散热板的下部的暴露表面。 此外，本文公开了一种用于防止模制部分在暴露表面上的冲洗的制造方法。