公开(公告)号：US09049808B2

公开(公告)日：2015-06-02

申请号：US13213199

申请日：2011-08-19

Applicant: Masaru Takada ,  Fusaji Nagaya

Inventor： Masaru Takada ,  Fusaji Nagaya

IPC: H05K1/16 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K3/4602 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate.[Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (50B) at 0.1 mm. In setting so, using thin core substrate 30 and interlayer insulation layers (50A, 50B) without core material, it is thought that warping does not occur in the printed wiring board.

Abstract translation: [主题]提供即使没有芯材的层间绝缘层层叠在芯基板上也不发生翘曲的印刷电路板。 [溶液]为了将热膨胀系数（CTE）降低到20〜40ppm，将无机颗粒加入到通过用玻璃 - 环氧树脂浸渍玻璃布芯材料而形成的芯基板30中。 此外，芯基板30的厚度（a）设定为0.2mm，上表面侧的第一层间绝缘层（50A）的厚度（b）为0.1mm，下表面侧的第二中间层的厚度（c） 绝缘层（50B）为0.1mm。 在这样设置时，使用没有芯材料的薄芯基板30和层间绝缘层（50A，50B），认为在印刷线路板上不发生翘曲。

公开(公告)号：US20150116964A1

公开(公告)日：2015-04-30

申请号：US14588614

申请日：2015-01-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoru Noda

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0347 ,  H05K2201/09136 ,  H05K2201/10636 ,  H05K2203/0126 ,  H05K2203/0465 ,  H05K2203/085 ,  H05K2203/1316 ,  H05K2203/1322 ,  Y02P70/611

Abstract: A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

Abstract translation: 嵌入部件的基板包括基板部分，嵌入式电子部件和树脂部分。 基板部分在内主表面上具有内电极。 嵌入式电子部件具有端子电极，并且通过粘附到各个端子电极和各个内部电极的焊接圆角安装到基板部分。 树脂部分堆叠在基板部分上，嵌入的电子部件被嵌入其中。 树脂部分包括无填料添加层和填料添加层。 无填料添加层从内主表面延伸至允许至少覆盖焊料圆角的高度。 填料添加层含有无机填料并且从与无填料添加层的界面延伸至至少允许嵌入式电子部件被覆盖的高度。

公开(公告)号：US09005761B2

公开(公告)日：2015-04-14

申请号：US13335658

申请日：2011-12-22

Applicant: Yu-Te Lin

Inventor： Yu-Te Lin

IPC: H05K1/03 ,  B32B15/092 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  C08L63/00 ,  C08G59/20 ,  C08G59/50 ,  C08G59/56 ,  B32B27/20 ,  C08G59/42 ,  C08L35/06 ,  C08L79/04 ,  C08G73/02 ,  C08L79/02 ,  C08K5/00 ,  C08K5/49

CPC classification number: C08G59/56 ,  B32B15/092 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  C08G59/4284 ,  C08G73/0233 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/49 ,  C08L25/04 ,  C08L35/06 ,  C08L63/00 ,  C08L79/02 ,  C08L79/04 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）每100重量份（A）1〜100重量份苯并恶嗪树脂; （C）每100重量份（A）1〜100重量份苯乙烯 - 马来酸酐; （D）每100重量份的（A）为0.5〜30重量份的胺固化剂; 和（E）每100重量份（A）5至150重量份的无卤阻燃剂。 该组合物通过特定组成和比例获得低介电常数，低耗散因子，高耐热性和阻燃性的性质。 因此，可以形成可应用于覆铜层压板和印刷电路板的预浸料坯或树脂膜。

公开(公告)号：US08985818B2

公开(公告)日：2015-03-24

申请号：US13508676

申请日：2010-11-26

Applicant: Daisuke Kitagawa ,  Yoshinari Takayama ,  Ichiro Suehiro ,  Hideyuki Usui ,  Takashi Oda

Inventor： Daisuke Kitagawa ,  Yoshinari Takayama ,  Ichiro Suehiro ,  Hideyuki Usui ,  Takashi Oda

IPC: H05K1/03 ,  C08L27/18 ,  H01L23/373 ,  H01L33/60 ,  H01L33/64 ,  H05K3/00

CPC classification number: H05K1/0373 ,  C08L27/18 ,  H01L23/3735 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

Abstract translation: 本发明的LED安装基板包括由含有氮化硼粉末和氟树脂的组合物构成的导热层（导热片（10）），氟树脂含有聚四氟乙烯。 导热层的导热率为2W /（m·K）以上。 导热层在380nm，470nm和650nm的波长处具有0.80以上的反射率。

公开(公告)号：US20150075852A1

公开(公告)日：2015-03-19

申请号：US14389525

申请日：2014-03-11

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino ,  Takashi Hoshi

IPC: C09D163/04 ,  H05K1/02 ,  H05K1/05 ,  C09D163/00 ,  H05K1/03

CPC classification number: C09D163/04 ,  C08J5/24 ,  C08J2333/06 ,  C09D163/00 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract translation: 根据本发明的预浸料由树脂组合物和浸渍有树脂组合物的织物基材形成。 树脂组合物含有：（A）热固性树脂组合物; （B）Tg不高于100℃的树脂; 和（C）无机填料。 Tg不大于100℃的树脂（B）具有：羰基或硅氧烷基; 和环氧基或酚羟基。 无机填料（C）用由通式YSiX 3表示的硅烷偶联剂进行表面处理，其中X表示甲氧基或乙氧基，Y表示碳原子数为6〜18的脂肪族烷基。

公开(公告)号：US08957321B2

公开(公告)日：2015-02-17

申请号：US13627813

申请日：2012-09-26

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Masaaki Harazono ,  Yoshihiro Hosoi

IPC: H05K1/16 ,  H05K1/03 ,  H05K3/10 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H01L2224/16225 ,  H05K1/0366 ,  H05K3/0044 ,  H05K3/107 ,  H05K3/427 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/025 ,  Y10T29/49126 ,  Y10T428/2481 ,  Y10T428/24917

Abstract: A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor.

Abstract translation: 本发明的印刷电路板包括基体，在厚度方向穿过基体的通孔和覆盖通孔的内壁的通孔导体。 基体具有包含多个玻璃纤维的纤维层和覆盖多个玻璃纤维的树脂。 玻璃纤维在暴露于通孔的内壁的表面上具有凹槽形凹部。 凹部填充有通孔导体的一部分。

公开(公告)号：US20150017449A1

公开(公告)日：2015-01-15

申请号：US14388506

申请日：2013-03-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Syouichi Itoh ,  Emi Fukasawa ,  Yoshitaka Ueno ,  Michio Yaginuma

IPC: C08L71/12 ,  H05K3/44 ,  H05K1/05

CPC classification number: C08L71/126 ,  B32B15/08 ,  B32B15/14 ,  B32B2260/046 ,  B32B2305/076 ,  C08J5/24 ,  C08J2371/12 ,  C08J2425/06 ,  C08J2463/04 ,  C08J2475/00 ,  C08J2485/02 ,  C08K3/36 ,  C08K5/315 ,  C08K5/5313 ,  C08K5/5399 ,  C08L25/06 ,  C08L63/00 ,  C08L63/04 ,  C08L71/12 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/035 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0209 ,  H05K2203/06 ,  Y10T156/10 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

Abstract translation: 树脂组合物具有高阻燃性和优异的耐热性，铜箔的剥离强度，热膨胀系数，吸湿后的耐热性，电性能，预浸料和单层或层压片，使用 预浸料坯等。 该树脂组合物具有数均分子量为500〜5000的聚苯醚（A），式（13）表示的含磷氰酸酯化合物（B），环磷腈化合物（C），无卤环氧树脂 （D），除含磷氰酸酯化合物（B）以外的氰酸酯化合物（E），苯乙烯和/或取代苯乙烯的低聚物（F）和填料（G），其中，磷 的含氰酸酯化合物（B）相对于（A）〜（F）成分的总计100质量份为1〜10质量份。 其中m表示1〜3的整数。

公开(公告)号：US20150014032A1

公开(公告)日：2015-01-15

申请号：US14375269

申请日：2013-01-24

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Keiichi Hasebe ,  Seiji Shika ,  Naoki Kashima ,  Yoshinori Mabuchi

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/05 ,  C08G59/24 ,  C08L63/00

CPC classification number: H05K1/0373 ,  C08G59/245 ,  C08G59/4014 ,  C08K3/00 ,  C08L63/00 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/115 ,  H05K2201/0209 ,  Y10T428/24355 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/31529

Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Abstract translation: 当用作印刷电路板的绝缘层时，树脂组合物在绝缘层上形成具有低粗糙度的粗糙表面，而不管粗糙条件如何，并且绝缘层和镀层导体层之间的粘附性优异，并且还具有低热 膨胀系数（线膨胀系数）和高玻璃化转变温度，并且耐湿热性也优异。 树脂组合物包括环氧化合物，氰酸酯化合物和无机填料，其中氰酸酯化合物至少选自萘酚芳烷基型氰酸酯化合物，芳族烃甲醛型氰酸酯化合物，联苯基芳烷基氰酸酯 化合物和酚醛清漆型氰酸酯化合物; 环氧化合物的含量相对于环氧化合物和氰酸酯化合物的总量为60〜75重量％。

公开(公告)号：US20150008379A1

公开(公告)日：2015-01-08

申请号：US14496709

申请日：2014-09-25

Applicant: PANASONIC CORPORATION

Inventor： Yuko KONNO ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA ,  Hiroaki FUJIWARA ,  Shingo YOSHIOKA

IPC: C08K5/3475 ,  H05K3/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US08921458B2

公开(公告)日：2014-12-30

申请号：US13816644

申请日：2010-08-26

Applicant: Kenji Miyata ,  Toshitaka Yamagata

Inventor： Kenji Miyata ,  Toshitaka Yamagata

IPC: C08K3/38 ,  C08G59/24 ,  C08L63/00 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08K3/38 ,  C08G59/245 ,  C08L63/00 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/09118

Abstract: To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc.

Abstract translation: 为了提供具有优异的导热性和优异的绝缘可靠性的树脂组合物，模制物体，基底材料和电路板。 [解决方案]提供一种树脂组合物，其包含环氧树脂，硬化剂和无机填料，其中环氧树脂和/或硬化剂具有萘结构，无机填料包括六方氮化硼，无机填料占 50-85卷 ％的整个树脂组合物。 由于赋予无机填料中包含的六方氮化硼润湿性良好的萘结构，因此已经引入到环氧树脂和/或硬化剂中以提高无机填料的负载特性，因此该树脂组合物具有优异的散热性 性能，耐热性，绝缘性能等