公开(公告)号：US07585049B2

公开(公告)日：2009-09-08

申请号：US11041990

申请日：2005-01-26

Applicant: Phil Keenan

Inventor： Phil Keenan

IPC: B41J2/15 ,  B41J2/045

CPC classification number: H05K3/423 ,  B41J2/162 ,  B41J2/1643 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2203/0733

Abstract: A method of making an inkjet printhead for surface mounting comprises providing a substrate 10 having a plurality of ink ejection elements and a plurality of electrical contacts 18 formed on a first surface, the contacts being connected to the ink ejection elements to allow selective energisation of the elements. A plurality of through-holes 26 are formed in the substrate each extending from the opposite surface of the substrate fully through the thickness of the substrate to meet the underside of a respective electrical contact 18 on the first surface. Each through-hole is substantially completely filled with a conductive material 36 by electroplating. Finally, a further plurality of electrical contacts (solder mounds) 38 are provided on the second surface of the substrate each in contact with the conductive material in a respective through-hole.

Abstract translation: 制造用于表面安装的喷墨打印头的方法包括提供具有多个喷墨元件的基板10和形成在第一表面上的多个电触点18，该触点连接到喷墨元件，以允许选择性地激励 元素。 多个通孔26形成在基板中，每个通孔从基板的相对表面完全延伸穿过基板的厚度，以与第一表面上的相应的电触头18的下侧相遇。 每个通孔通过电镀基本上完全填充有导电材料36。 最后，在基板的第二表面上设置多个电触头（焊锡块）38，每个与相应的通孔中的导电材料接触。

公开(公告)号：US20090217518A1

公开(公告)日：2009-09-03

申请号：US12435185

申请日：2009-05-04

Applicant: Asami Hiroshi ,  Orui Ken ,  Kusano Hidetoshi ,  Fumito Hiwatashi

Inventor： Asami Hiroshi ,  Orui Ken ,  Kusano Hidetoshi ,  Fumito Hiwatashi

IPC: H05K3/20 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/187 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/13 ,  H01L24/24 ,  H01L24/81 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/13 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/24227 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).

Abstract translation: 一种基于器件的衬底和一种制造器件结合衬底的方法，以及印刷电路板和制造印刷电路板的方法，其中可以在绝缘层上以高精度形成精细间距导体图案 同时确保导体图案的尺寸稳定性。 转印片（61）具有包括金属基材（62）和溶解金属层（64）的两层的结构，并且通过电镀在溶解金属层（64）上形成导体图案（55）。 然后，在其上形成有导体图案（55）的转印片（61）粘附到绝缘基材（51）上之后，通过分离金属基材（62）的步骤去除转印片（61） 从所述溶解金属层（64）和相对于所述导体图案（55）选择性地溶解和除去所述溶解金属层（64）的步骤。

公开(公告)号：US20090151994A1

公开(公告)日：2009-06-18

申请号：US12289437

申请日：2008-10-28

Applicant: Tetsuya Ohsawa ,  Katsutoshi Kamei

Inventor： Tetsuya Ohsawa ,  Katsutoshi Kamei

IPC: H05K1/11

CPC classification number: H05K1/112 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/056 ,  H05K2201/0394 ,  H05K2201/09672 ,  H05K2201/0969

Abstract: A wired circuit board includes a wiring formation portion, a terminal formation portion, and a middle portion formed therebetween. The wiring formation portion includes a first conductive layer formed on a first insulating layer, and a second conductive layer formed on a second insulating layer so as to overlap the first conductive layer in a thickness direction. The terminal formation portion includes the first and second conductive layers formed in parallel in the same plane. The middle portion includes the first conductive layer formed on the first insulating layer, and the second conductive layer formed on a portion of the second insulating layer extending from the wiring formation portion to a mid-point between the wiring formation portion and the terminal formation portion, and formed on a portion of the first insulating layer extending from the mid-point to the terminal formation portion.

Abstract translation: 布线电路板包括布线形成部分，端子形成部分和形成在其间的中间部分。 布线形成部分包括形成在第一绝缘层上的第一导电层和形成在第二绝缘层上以在厚度方向上与第一导电层重叠的第二导电层。 端子形成部分包括在同一平面内平行形成的第一和第二导电层。 中间部分包括形成在第一绝缘层上的第一导电层，以及形成在第二绝缘层的从布线形成部分延伸到布线形成部分和端子形成部分之间的中点的第二导电层 并且形成在从中点延伸到端子形成部分的第一绝缘层的一部分上。

公开(公告)号：US20090133253A1

公开(公告)日：2009-05-28

申请号：US12213365

申请日：2008-06-18

Applicant: Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

Inventor： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

IPC: H05K3/12 ,  H01B13/00

CPC classification number: H05K3/107 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1152 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层，对于包含层叠在绝缘层一侧的铜箔的覆铜层压板， 通过去除第二覆盖层，第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。

公开(公告)号：US07528470B2

公开(公告)日：2009-05-05

申请号：US11292656

申请日：2005-12-02

Applicant: Jurgen Schulz-Harder ,  Andreas Meyer

Inventor： Jurgen Schulz-Harder ,  Andreas Meyer

IPC: H01L23/02

CPC classification number: H05K3/4084 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3484 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49218

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract translation: 导体板具有至少一层电介质，它们设置在两个相互相对的两个面上，每个上至少有一个金属化。 在孔的区域中至少有一个通过接触。 施加金属化以覆盖至少一个孔并且通过孔彼此电连接。

公开(公告)号：US20090019693A1

公开(公告)日：2009-01-22

申请号：US12237955

申请日：2008-09-25

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: H05K3/10

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US20080296253A1

公开(公告)日：2008-12-04

申请号：US11806598

申请日：2007-06-01

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H01B13/00

CPC classification number: H05K3/4007 ,  H01L21/486 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/113 ,  H05K2201/0394 ,  H05K2201/09881 ,  H05K2201/10378 ,  H05K2203/0733 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper layer, filling the holes with copper and extending the copper above the polyimide layer to define caps, removing portions of the copper layer to form conductive pads, and filling gaps between the conductive pads with an insulator, wherein individual conductive pads are in electrical contact with corresponding individual caps.

Abstract translation: 提供一种制造插入件的方法，包括以下步骤：提供具有铜层和聚酰亚胺层的片材，在聚酰亚胺层中的铜层下方的激光钻孔，用铜填充孔并将铜延伸到聚酰亚胺层上方 以限定帽，去除铜层的部分以形成导电焊盘，以及用绝缘体填充导电焊盘之间的间隙，其中各个导电焊盘与相应的单独盖电接触。

公开(公告)号：US20080277142A1

公开(公告)日：2008-11-13

申请号：US12081835

申请日：2008-04-22

Applicant: Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

Inventor： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC: H05K1/00

CPC classification number: H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

Abstract translation: 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子 如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。 此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。 这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

公开(公告)号：US07443035B2

公开(公告)日：2008-10-28

申请号：US11447257

申请日：2006-06-06

Applicant: Satoshi Yamamoto ,  Takashi Takizawa

Inventor： Satoshi Yamamoto ,  Takashi Takizawa

IPC: H01L23/34

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/128 ,  H01L2924/00

Abstract: A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film. After a protective member that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.

Abstract translation: 一种形成穿透电极的方法，其中将导电物质插入到仅通过布线封闭的一端的微孔和由导电物质形成的焊盘而不会损坏布线和焊盘。 在这种形成穿透电极的方法中，将导电物质插入到穿透基底的微孔中，并且其一个孔被导电薄膜阻挡。 在保持导电薄膜的保护部件设置在基板的导电薄膜侧的表面上之后，从微孔的另一个孔插入导电物质。

公开(公告)号：US07432451B2

公开(公告)日：2008-10-07

申请号：US11337470

申请日：2006-01-24

Applicant: Kazuyuki Yamada

Inventor： Kazuyuki Yamada

IPC: H05K1/16

CPC classification number: G02F1/13452 ,  G02F2001/13456 ,  H05K1/113 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/10674

Abstract: An electro-optical device including an electro-optical panel, a flexible base member connected to the electro-optical panel, and an electronic component mounted on the flexible base member. The electronic component having conductive terminals electrically connected to a plurality of terminals disposed on the flexible base member, the plurality of terminals are disposed on one surface of the flexible base member, and the conductive terminals and the plurality of terminals two-dimensionally overlap each other. The flexible base member has first wires which are connected to the plurality of terminals and disposed on the one surface, hole portions formed in the flexible base member to correspond to at least one terminal, and second wires connected to the at least one terminal through connection members disposed in the hole portions and disposed on the other surface of the flexible base member opposite to the one surface.

Abstract translation: 一种电光学装置，包括电光面板，连接到电光面板的柔性基底构件和安装在柔性基底构件上的电子部件。 所述电子部件具有导电端子，电连接到设置在所述柔性基底部件上的多个端子，所述多个端子设置在所述柔性基底部件的一个表面上，并且所述导电端子和所述多个端子彼此二维重叠 。 柔性基体具有连接到多个端子并设置在一个表面上的第一导线，形成在柔性基底构件中的孔部分对应于至少一个端子，以及通过连接连接到至少一个端子的第二导线 设置在所述孔部分中并且设置在所述柔性基底构件的与所述一个表面相对的另一表面上的构件。