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    Display device
    71.
    发明授权
    Display device 有权
    显示设备

    公开(公告)号：US07692372B2

    公开(公告)日：2010-04-06

    申请号：US11755412

    申请日：2007-05-30

    Applicant: Si-Duk Sung ,  Byung-Sik Koh

    Inventor： Si-Duk Sung ,  Byung-Sik Koh

    IPC: H01J1/62

    CPC classification number: H05B33/22 ,  H01L27/3276 ,  H05B33/10 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10128

    Abstract: A display device includes an insulating substrate having an upper surface and a lower surface opposing the upper surface, a display element including a first electrode, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer, a first film connected to a first side of the upper surface, and a first circuit substrate connected to the first film and including a first surface facing the display element, a second surface opposing the first surface, and an electric element protruding from the second surface.

    Abstract translation: 显示装置包括具有上表面和与上表面相对的下表面的绝缘基板，显示元件包括第一电极，第一电极上的有机发光层和有机发光层上的第二电极， 第一膜连接到上表面的第一侧，第一电路基板连接到第一膜并且包括面向显示元件的第一表面，与第一表面相对的第二表面和从第二表面突出的电元件。

    Module thermal management system and method
    75.
    发明授权
    Module thermal management system and method 有权
    模块热管理系统及方法

    公开(公告)号：US07606049B2

    公开(公告)日：2009-10-20

    申请号：US11125018

    申请日：2005-05-09

    Applicant: Paul Goodwin ,  James W. Cady

    Inventor： Paul Goodwin ,  James W. Cady

    IPC: H05K7/00

    CPC classification number: G11C5/00 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  G11C5/143 ,  H01L23/367 ,  H01L25/105 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs which are, preferably, array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit typically between the two ranks of ICs along the first side of the IC. A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped and an extension at the other extremity of the substrate that is thermally connected to a chassis component of the application, either directly or, preferably, through a thermal conduit such as a thermally conductive compliant material.

    Abstract translation: 电路模块将热能分流到使用模块的计算应用的机箱组件或一部分盒子中。 在一个优选的模式中，柔性电路沿其每个第一和第二主要侧面都具有两个等级的IC，最好是阵列型（CSP）装置。 插入触点通常沿着IC的第一侧在两个IC级之间在柔性电路的第一侧上设置成两组。 具有第一和第二侧面的基底提供了用于模块的形式。 该基底优选由金属材料构成，并且表现出边缘，柔性电路围绕该边缘被包裹，并且在基底的另一端延伸，其与基底部件热连接，直接或优选通过热 导管，例如导热柔性材料。

    Memory module system and method
    76.
    发明授权
    Memory module system and method 有权
    内存模块系统和方法

    公开(公告)号：US07606040B2

    公开(公告)日：2009-10-20

    申请号：US11077952

    申请日：2005-03-11

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K7/02

    CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

    Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

    Abstract translation: 存储器模块柔性电路被设计为适应不同高度或厚度的封装集成电路器件（IC）。 本发明可以用于采用柔性电路的各种模块，包括但不限于完全缓冲的，注册的或更简单的存储器模块。 许多这样的模块可以替代传统构造的DIMM而不改变使用模块的系统。 设计用于为IC提供一个或多个安装区域的柔性电路的区域部分地从柔性电路的主体描绘。 描述可以在优选实施例中通过从柔性电路的主体分离指定的IC安装区域或半岛，或者具有隔离区域或间隔，或者与柔性电路的主周边延伸的突出部分分离。

    Thin multi-chip flex module
    77.
    发明申请
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：US20090168363A1

    公开(公告)日：2009-07-02

    申请号：US12317892

    申请日：2008-12-30

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K7/20 ,  H05K3/34

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

    High capacity thin module system
    78.
    发明授权
    High capacity thin module system 有权
    大容量薄模块系统

    公开(公告)号：US07443023B2

    公开(公告)日：2008-10-28

    申请号：US11231418

    申请日：2005-09-21

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    PRINTED CIRCUIT BOARD AND FUEL CELL
    79.
    发明申请
    PRINTED CIRCUIT BOARD AND FUEL CELL 有权
    印刷电路板和燃料电池

    公开(公告)号：US20080261086A1

    公开(公告)日：2008-10-23

    申请号：US12104597

    申请日：2008-04-17

    Applicant: Taiki SUEYOSHI ,  Hiroshi YAMAZAKI

    Inventor： Taiki SUEYOSHI ,  Hiroshi YAMAZAKI

    IPC: H01M8/02 ,  H05K1/18

    CPC classification number: H05K1/0272 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/16 ,  H05K2201/056 ,  H05K2201/09063 ,  Y02E60/523

    Abstract: A base insulating layer of an FPC board includes a rectangular first insulating portion and a second insulating portion that outwardly extends from one side of the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer includes a pair of rectangular collector portions and a pair of extraction conductor portions that extend in a long-sized shape from the collector portions. One collector portion is formed in a first region of the first insulating portion of the base insulating layer, and the other collector portion is formed in a second region of the first insulating portion. One extraction conductor portion extends from the one collector portion to the second insulating portion, and the other extraction conductor portion extends from the other collector portion to the second insulating portion.

    Abstract translation: FPC基板的基底绝缘层包括矩形的第一绝缘部分和从第一绝缘部分的一侧向外延伸的第二绝缘部分。 在基底绝缘层的一个表面上形成导体层。 导体层包括一对矩形集电器部分和从集电部分延伸成长形状的一对提取导体部分。 一个集电部分形成在基底绝缘层的第一绝缘部分的第一区域中，另一个集电部分形成在第一绝缘部分的第二区域中。 一个提取导体部分从一个集电器部分延伸到第二绝缘部分，另一个引出部分从另一个集电部分延伸到第二绝缘部分。

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