公开(公告)号：US08030661B2

公开(公告)日：2011-10-04

申请号：US12439451

申请日：2007-08-22

Applicant: Morimitsu Sekimoto ,  Hitoshi Haga ,  Kenichi Sakakibara ,  Reiji Kawashima ,  Abdallah Mechi ,  Toshiyuki Maeda

Inventor： Morimitsu Sekimoto ,  Hitoshi Haga ,  Kenichi Sakakibara ,  Reiji Kawashima ,  Abdallah Mechi ,  Toshiyuki Maeda

IPC: H01L31/0312 ,  H01L23/52 ,  H01L23/34

CPC classification number: H01L25/16 ,  H01L23/647 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2203/081 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving thermal damage by heat generated at the chip. In a configuration including: a chip portion (20) including a chip (21) made of wide band gap semiconductor and a member (22, 23) having a heat resistant temperature equal to or higher than that of the chip (21); and a peripheral component (25) arranged in the vicinity of the chip portion (20) and having a heat resistant temperature lower than that of the chip (21). The chip (21) and the peripheral component (25) are thermally insulated from each other so that the temperature of the peripheral component (25) does not exceed the heat resistant temperature of the peripheral component (25).

Abstract translation: 在芯片由宽带隙半导体制成的情况下，可以获得能够防止耐热温度低的部件受到芯片产生的热量的热损伤的电力转换装置。 一种构造，包括：包括由宽带隙半导体制成的芯片（21）的芯片部分（20）和具有等于或高于芯片（21）的耐热温度的部件（22,23）; 以及布置在所述芯片部分（20）附近并且具有比所述芯片（21）的耐热温度低的耐热温度的外围部件（25）。 芯片（21）和周边部件（25）彼此绝热，使得周边部件（25）的温度不超过外围部件（25）的耐热温度。

公开(公告)号：US20110094787A1

公开(公告)日：2011-04-28

申请号：US12647431

申请日：2009-12-25

Applicant: YING-TSO LAI ,  CHUN-JEN CHEN ,  YU-CHANG PAI ,  PEI-CHUN LIN ,  CHIN-HUI CHEN ,  HSIAO-PING HUANG

Inventor： YING-TSO LAI ,  CHUN-JEN CHEN ,  YU-CHANG PAI ,  PEI-CHUN LIN ,  CHIN-HUI CHEN ,  HSIAO-PING HUANG

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2203/0242 ,  Y10T29/49155

Abstract: A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. A number of thermal engravings are defined in the layer around the through hole. Each thermal engraving is a groove defined in the surface of the layer, without covered with the layer of copper. The number of thermal engravings are not in contact with each other.

Abstract translation: 印刷电路板包括一层。 铜层被覆盖在该层的表面上。 通孔穿过印刷电路板。 在通孔周围的层中限定了许多热雕刻。 每个热雕刻是在层的表面中限定的凹槽，而不被铜层覆盖。 热雕刻的数量彼此不接触。

公开(公告)号：US20110000707A1

公开(公告)日：2011-01-06

申请号：US12826276

申请日：2010-06-29

Applicant: Satoshi Kawai

Inventor： Satoshi Kawai

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0224 ,  H05K1/113 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0723 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/09709

Abstract: An electronic circuit unit includes a multi-layer substrate in which high frequency circuits are provided on two different layers and a ground layer is formed between the two layers, and grounding lands connected to peripheral conductive members through connection bars formed on a plurality of layers of the multi-layer substrate. The grounding lands are connected to each other through a via hole and conducted to the ground layer, and the connection bars protruding radially outward from at least two grounding lands provided on different layers are arranged in different directions with respect to a circumferential direction such that the connection bars do not overlap each other along a thickness direction of the multi-layer substrate.

Abstract translation: 电子电路单元包括多层基板，其中高频电路设置在两个不同的层上，并且在两层之间形成接地层，以及通过形成在多个层上的连接条连接到外围导电构件的接地区 多层基板。 接地平台通过通孔相互连接并传导到接地层，并且从设置在不同层上的至少两个接地台径向向外突出的连接杆相对于圆周方向布置在不同的方向上，使得 连接条不沿着多层基板的厚度方向彼此重叠。

公开(公告)号：US07699520B2

公开(公告)日：2010-04-20

申请号：US11700905

申请日：2007-02-01

Applicant: Jae-Wook Yoo ,  Yun-Hyeok Im

Inventor： Jae-Wook Yoo ,  Yun-Hyeok Im

IPC: G01K17/00

CPC classification number: G01K17/20 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/10151

Abstract: Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.

Abstract translation: 提供具有降低的耐热性的微型热通量传感器阵列。 微型热通量传感器阵列可以包括衬底，形成在衬底的第一侧上的多个第一传感器和形成在衬底的第二侧上的多个第二传感器。 多个第一传感器和第二传感器中的每一个可以包括第一导电材料的第一布线图案层，与第一布线图案层接触的第二导电材料的第二布线图案层和与第一和第二传感器接触的绝缘层 接线方式

公开(公告)号：US20100090792A1

公开(公告)日：2010-04-15

申请号：US12483754

申请日：2009-06-12

Applicant: Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

Inventor： Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

IPC: H01H85/22

CPC classification number: H05K3/301 ,  H01H85/0418 ,  H01H85/202 ,  H01H2085/0414 ,  H01H2085/2085 ,  H05K3/3426 ,  H05K2201/062 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insulative fuse body is provided to further decouple the fuse element from its surroundings.

Abstract translation: 在本发明的一个方面，通过连接到保险丝端盖的夹子将超小型保险丝焊接到PCB。 夹子物理连接到PCB焊盘，使熔断器可以更换，如果需要，并提供保险丝和加热焊锡/ PCB焊盘之间的热解耦。 保险丝和夹子也可以被拾取并放置在一个操作中。 在另一方面，提供了改进的熔断器夹，其包括将夹子的壳体部分与加热凹陷焊料/ PCB焊盘分离的突片。 这种改进的夹子进一步增强了热解耦。 在另一方面，提供了一种改进的保险丝，其中刚刚描述的热去耦接头直接与保险丝一起提供。 在另一方面，提供了一种绝热熔丝体，以进一步使熔丝元件与其周围环路分离。

公开(公告)号：US20100014255A1

公开(公告)日：2010-01-21

申请号：US12567276

申请日：2009-09-25

Applicant: Yousuke Watanabe

Inventor： Yousuke Watanabe

IPC: H05K7/20

CPC classification number: H05K1/0207 ,  G06F1/203 ,  H04M1/0202 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/141 ,  H05K1/148 ,  H05K3/4641 ,  H05K2201/062

Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure. Furthermore, the rigidity of the circuit board can be raised, and the reliability of the mobile terminal device can be improved.

Abstract translation: 在移动终端装置中，在安装了电子部件的电路基板的内部设置有由导热性优异的铜，铝或碳等构件形成的至少一个导热层。 在电子部件中产生的热量通过导热层迅速地分散在电路板的表面方向上，并从电路板的整个面传递到操作部件，例如键和壳体，以及 然后辐射到外面。 利用这种结构，可以抑制操作构件和壳体处的局部温度上升，并且可以使移动终端装置的表面上的温度均匀，而不会显着增加移动终端装置的成本和厚度。 此外，通过采用该结构，可以使用高性能的电子部件。 此外，可以提高电路板的刚性，并且可以提高移动终端装置的可靠性。

公开(公告)号：US20090256161A1

公开(公告)日：2009-10-15

申请号：US12439451

申请日：2007-08-22

Applicant: Morimitsu Sekimoto ,  Hitoshi Haga ,  Kenichi Sakakibara ,  Reiji Kawashima ,  Abdallah Mechi ,  Toshiyuki Maeda

Inventor： Morimitsu Sekimoto ,  Hitoshi Haga ,  Kenichi Sakakibara ,  Reiji Kawashima ,  Abdallah Mechi ,  Toshiyuki Maeda

IPC: H01L29/24 ,  H01L23/34

CPC classification number: H01L25/16 ,  H01L23/647 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2203/081 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving thermal damage by heat generated at the chip. In a configuration including: a chip portion (20) including a chip (21) made of wide band gap semiconductor and a member (22, 23) having a heat resistant temperature equal to or higher than that of the chip (21); and a peripheral component (25) arranged in the vicinity of the chip portion (20) and having a heat resistant temperature lower than that of the chip (21). The chip (21) and the peripheral component (25) are thermally insulated from each other so that the temperature of the peripheral component (25) does not exceed the heat resistant temperature of the peripheral component (25).

Abstract translation: 在芯片由宽带隙半导体制成的情况下，可以获得能够防止耐热温度低的部件受到芯片产生的热量的热损伤的电力转换装置。 一种构造，包括：包括由宽带隙半导体制成的芯片（21）的芯片部分（20）和具有等于或高于芯片（21）的耐热温度的部件（22,23）; 以及布置在所述芯片部分（20）附近并且具有比所述芯片（21）的耐热温度低的耐热温度的外围部件（25）。 芯片（21）和周边部件（25）彼此绝热，使得周边部件（25）的温度不超过外围部件（25）的耐热温度。

公开(公告)号：US20090039505A1

公开(公告)日：2009-02-12

申请号：US11891530

申请日：2007-08-10

Applicant: Toshiki Hirano ,  Haruhide Takahashi ,  Tatsumi Tsuchiya

Inventor： Toshiki Hirano ,  Haruhide Takahashi ,  Tatsumi Tsuchiya

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/49816 ,  G11B5/4853 ,  G11B5/4873 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0201 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/10727 ,  H05K2203/041 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49028 ,  Y10T29/4903 ,  Y10T29/49032 ,  H01L2924/00

Abstract: A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.

Abstract translation: 描述了用于焊料回流的隔热焊盘。 接合焊盘包括结构。 该结构形成接合垫。 接合焊盘还包括形成在结构上的绝缘体。 绝缘体被配置为插入在结构和要布置所述接合焊盘的部件的基板之间。 当所述接合焊盘经受在其上进行的焊料回流工艺时，所述接合焊盘为所述衬底提供热绝缘。

公开(公告)号：US07450346B2

公开(公告)日：2008-11-11

申请号：US11037752

申请日：2005-01-18

Applicant: Satya Prakash Arya ,  Xinzhi Xing

Inventor： Satya Prakash Arya ,  Xinzhi Xing

IPC: G11B21/16 ,  G11B5/48

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0201 ,  H05K1/056 ,  H05K1/111 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/0969 ,  Y02P70/611

Abstract: An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.

Abstract translation: 一种用于减少电铅悬架（ELS）上的焊盘周围的吸热的装置和方法。 该方法提供具有至少一个开口的基底金属层。 电介质层也设置在母金属层的上方，电介质层覆盖基底金属层的一部分和基底金属层中的至少一个开口。 信号导电层设置在电介质层的上方。 信号导电层承载至少一个焊料焊盘部分，其中焊料焊盘部分放置在电介质层的部分上方，使得焊料焊盘部分不与基体金属层中的至少一个开口对准。 在这样做时，相对于基底金属层的吸热性降低。

公开(公告)号：US20080241563A1

公开(公告)日：2008-10-02

申请号：US12056121

申请日：2008-03-26

Applicant: Khamvong Thammasouk ,  Polsak Lertputipinyo

Inventor： Khamvong Thammasouk ,  Polsak Lertputipinyo

IPC: B32B27/36 ,  B29C65/00 ,  B05D5/12

CPC classification number: H05K3/3494 ,  B29C65/1412 ,  B29C65/4815 ,  B29C66/348 ,  B29C66/47 ,  B29C66/7352 ,  B29C2035/0822 ,  B29K2067/00 ,  B29K2101/12 ,  B29L2031/3425 ,  H05K1/0201 ,  H05K1/0393 ,  H05K1/162 ,  H05K1/182 ,  H05K1/189 ,  H05K3/243 ,  H05K3/28 ,  H05K3/281 ,  H05K3/282 ,  H05K3/3442 ,  H05K2201/055 ,  H05K2201/062 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2203/0557 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T156/10 ,  Y10T428/31786

Abstract: In one embodiment, the present invention comprises a method for fixedly and electronically coupling an electronic component to a polymer substrate. In this embodiment, a polymer substrate is received. The polymer substrate has an electronic component disposed proximate a bonding agent which is coupled to the polymer substrate. The present embodiment also provides a heat shielding fixture which is configured to shield at least a portion of the polymer substrate from a heat source. The heat shielding fixture is configured to allow heat from the heat source to access the bonding agent. The present embodiment then subjects the bonding agent to the heat source such that the heat from the heat source causes the electronic component to be fixedly and electronically coupled to the polymer substrate once the bonding agent solidifies.

Abstract translation: 在一个实施例中，本发明包括用于将电子部件固定和电子耦合到聚合物基底的方法。 在该实施例中，接收聚合物基板。 聚合物基底具有邻近结合剂设置的电子部件，所述粘结剂与聚合物基底相连。 本实施例还提供了一种隔热夹具，其构造成将聚合物基板的至少一部分与热源屏蔽。 隔热夹具构造成允许来自热源的热量进入粘合剂。 因此，本实施方案将粘合剂施加到热源，使得来自热源的热量使得一旦粘合剂固化就将电子部件固定地和电子地耦合到聚合物基底。