公开(公告)号：US20170181267A1

公开(公告)日：2017-06-22

申请号：US15443946

申请日：2017-02-27

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael Gaynes

IPC: H05K1/02 ,  H01L23/498 ,  B32B3/26 ,  B32B37/12 ,  B32B7/14 ,  H01L23/373 ,  H01L21/48

CPC classification number: H05K1/0204 ,  B32B3/266 ,  B32B7/14 ,  B32B37/1292 ,  B32B2037/1253 ,  B32B2250/03 ,  B32B2255/26 ,  B32B2307/20 ,  B32B2307/302 ,  B32B2457/08 ,  B32B2457/14 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/49838 ,  H05K2201/066 ,  Y10T156/10 ,  Y10T428/24339

Abstract: A method comprises applying an adhesive to a first substrate and a second substrate to secure the first substrate to the second substrate. The adhesive extends in a plane on one side of an interposer that also extends in the plane, and is contiguous with the adhesive. The interposer comprises openings to enable flow of adhesive through the openings to form adhesive bond areas on one of the substrates where the areas substantially conform to the openings and lie adjacent to adhesive free areas. The adhesive substantially covers the other of the substrates so that the bond areas produce regions of reduced adhesive strength to the one substrate compared to the bond strength of the adhesive to the other substrate. Adjusting opening sizes adjusts area bond strengths. One substrate may comprise a VTM, the other a heat spreader, and the adhesive, a TIM. An article of manufacture comprises the substrate-adhesive-interposer-adhesive-substrate layers.

公开(公告)号：US20170175990A1

公开(公告)日：2017-06-22

申请号：US15138693

申请日：2016-04-26

Applicant: Jitendra Patel

Inventor： Jitendra Patel

IPC: F21V29/70 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/181 ,  F21S8/00 ,  F21V3/049 ,  F21V15/01 ,  F21V29/507 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K1/115 ,  H05K2201/066 ,  H05K2201/10106 ,  Y02P70/611

Abstract: An LED apparatus is provided in which at least one LED is simply and reliably mounted. LEDs are connected mechanically, electrically, and thermally within a lighting assembly. An LED comprises an emission layer on a substrate such as a circuit board. The circuit board is both an LED support and a conductor for connection to LED terminals. A frame has a cutout receiving the printed circuit board. The frame is fastenable to a heat dissipating surface. The cutout also defines cantilevered beams cut out within the surface of the frame. The cantilevered beams surround the LED to distribute force across the LED. The circuit board includes copper vias providing power to terminals on the LED. The terminals may be soldered to the power contact without the need for additional wiring.

公开(公告)号：US20170147045A1

公开(公告)日：2017-05-25

申请号：US15428000

申请日：2017-02-08

Applicant: Western Digital Technologies, Inc.

Inventor： Kevin M. TAKEUCHI

IPC: G06F1/20 ,  H05K7/20 ,  H05K1/02

CPC classification number: G06F1/20 ,  F16B5/0233 ,  F16B35/06 ,  H05K1/021 ,  H05K7/20172 ,  H05K7/20409 ,  H05K2201/066 ,  Y10T29/49117

Abstract: A heat sink including a top surface, a first bottom surface configured to thermally contact a first controller having a first height from a circuit board, and a second bottom surface configured to thermally contact a second controller having a second height from the circuit board, wherein the second height is different than the first height.

公开(公告)号：US09648750B2

公开(公告)日：2017-05-09

申请号：US14510299

申请日：2014-10-09

Applicant: RSM Electron Power, Inc.

Inventor： Ching Au

IPC: F21V19/00 ,  H05K1/18 ,  H05K1/02 ,  F21V29/74 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: H05K1/189 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10106

Abstract: A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.

公开(公告)号：US20170112009A1

公开(公告)日：2017-04-20

申请号：US15396102

申请日：2016-12-30

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: H05K5/02 ,  G09G3/32 ,  H05K7/20 ,  H05K5/00 ,  H05K5/03 ,  H05K3/32 ,  F21K9/20 ,  F21K9/90 ,  F21V23/02 ,  F21V31/00 ,  H05K1/18 ,  G06F3/14 ,  H05K5/06

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to integrated modular display systems. In one embodiment, a modular multi-panel display system includes a mechanical support structure, and a plurality of display panels detachably mounted to the mechanical support structure so as to form an integrated display panel. Each LED panel includes an LED array and an LED driver coupled to the LED array. Each panel further includes a power supply unit disposed outside the housing and electrically coupled to the receiver circuit. The mechanical structure is configured to provide mechanical support to the plurality of display panels without providing hermetic sealing. Each of the plurality of display panels is hermetically sealed.

公开(公告)号：US20170105315A1

公开(公告)日：2017-04-13

申请号：US15284544

申请日：2016-10-04

Applicant: Sercomm Corporation

Inventor： Yuan-Heng Huang

IPC: H05K7/20 ,  H05K1/02 ,  F28F21/06

CPC classification number: H05K7/20409 ,  F28F21/06 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/552 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/0243 ,  H05K2201/066 ,  H05K2201/10098

Abstract: A heat conductive plastic radiator and a communication device are provided. The communication device includes the heat conductive plastic radiator, a communication chip and an antenna. The heat of the communication chip is dissipated by the heat conductive plastic radiator. Along any direction, the heat conductive plastic radiator has a plurality of cross-sections perpendicular to the direction, and the plurality of cross-sections have different shapes. Therefore, one of the advantages of the heat conductive plastic radiator is that it less severely interferes with the antenna while efficiently dissipating heat.

公开(公告)号：US09622385B2

公开(公告)日：2017-04-11

申请号：US14276805

申请日：2014-05-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Cheng-Wei Hsu ,  Hung-Chuan Chen

IPC: B23P19/00 ,  H05K7/20 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K7/20509 ,  H05K1/0203 ,  H05K3/3447 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/105 ,  Y10T29/49142

Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

公开(公告)号：US20170099745A1

公开(公告)日：2017-04-06

申请号：US15383405

申请日：2016-12-19

Applicant: Cisco Technology, Inc.

Inventor： Long Dang ,  Don Nguyen ,  Michael Brooks

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  F16B2/248 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10265 ,  H05K2201/10393

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

公开(公告)号：US20170084211A1

公开(公告)日：2017-03-23

申请号：US15369304

申请日：2016-12-05

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  G09F9/302 ,  G06F1/18 ,  G06F1/20 ,  G09G5/14

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to integrated modular display panels. In one embodiment, modular display panel includes a shell with a first thermally conductive material, a printed circuit board disposed in the shell, and a plurality of LEDs attached to a first side of the printed circuit board. A driver circuit is disposed in the shell and coupled to the plurality of LEDs from a second side of the printed circuit board. The panel further includes a power supply unit for powering the LEDs. The printed circuit board are disposed between the power supply unit and the plurality of LEDs. A second thermally conductive material is disposed between the power supply unit and an outer back side of the panel. A protective structure is disposed over the first side of the printed circuit board, where a display side of the panel, opposite the outer back side, is waterproof.

公开(公告)号：US20170080881A1

公开(公告)日：2017-03-23

申请号：US15126441

申请日：2015-04-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Tomohiro Ooi ,  Shigeki Yamane ,  Takehito Kobayashi ,  Yukinori Kita ,  Yoshikazu Sasaki

IPC: B60R16/023 ,  H02G3/04 ,  H02G3/03 ,  H02G3/08 ,  H05K7/20

CPC classification number: B60R16/0238 ,  H02G3/03 ,  H02G3/04 ,  H02G3/08 ,  H05K1/0209 ,  H05K7/20418 ,  H05K7/20854 ,  H05K2201/066

Abstract: An electrical junction box to be attached to a vehicle includes a heat dissipation member having a base plate portion that has a plate shape having a first surface and a second surface, a plurality of fins that protrude from the second surface, and a pedestal that is provided protruding from the second surface and that has a smaller protruding height from the second surface than the fins as well as a bracket having a pedestal attachment portion that is attached to the pedestal and a vehicle body attachment portion that is continuous with that attachment portion, extends in a direction away from the heat dissipation member, and is attachable to a vehicle body of the vehicle.