公开(公告)号：US20240312927A1

公开(公告)日：2024-09-19

申请号：US18671764

申请日：2024-05-22

Applicant: Snap Inc.

Inventor： Stephen Andrew Steger ,  Emily Lauren Clopp

IPC: H01L23/552 ,  H05K1/02 ,  H05K9/00

CPC classification number: H01L23/552 ,  H05K1/0216 ,  H05K9/0081 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K2201/0707 ,  H05K2201/10371

Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

公开(公告)号：US20240224410A1

公开(公告)日：2024-07-04

申请号：US18432920

申请日：2024-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongseok LEE ,  Hyein PARK ,  Jaedeok LIM

IPC: H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/0215 ,  H05K2201/0112 ,  H05K2201/0707 ,  H05K2201/10151 ,  H05K2201/2054

Abstract: An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.

公开(公告)号：US20230336033A1

公开(公告)日：2023-10-19

申请号：US18213656

申请日：2023-06-23

Applicant: Microsoft Technology Licensing, LLC

Inventor： Casey Sean CALLAN ,  Stefan Jon KRISTJANSSON ,  Daniel Thomas NEVISTIC ,  George KARAVAEV ,  Michael Francis DEILY ,  David William VOTH ,  Srinivas Reddy NAGAMPET

IPC: H02J50/40 ,  H02J50/10 ,  H05K3/46

CPC classification number: H02J50/402 ,  H02J50/10 ,  H05K3/4691 ,  H05K2201/0707

Abstract: A device for inductively charging an electronic accessory includes a first portion, a second portion, and a spacer. The first portion includes a first transmission coil in a first plane where the first transmission coil is configured to generate a first magnetic field, and the second portion includes a first transmission coil in a second plane where the second transmission coil is configured to generate a second magnetic field. The spacer is positioned between the first transmission coil and the second transmission coil and between the first plane and the second plane. The spacer material magnetically insulates the second transmission coil from the first magnetic field.

公开(公告)号：US11758643B2

公开(公告)日：2023-09-12

申请号：US17729933

申请日：2022-04-26

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yo Kobayashi ,  Koji Hirai

IPC: H05K1/02

CPC classification number: H05K1/0219 ,  H05K1/0215 ,  H05K2201/0707 ,  H05K2201/10409

Abstract: A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

公开(公告)号：US11744019B2

公开(公告)日：2023-08-29

申请号：US17505674

申请日：2021-10-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeyuki Kamio ,  Makoto Takeoka ,  Sho Suzuki

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0306 ,  H05K1/11 ,  H05K9/0024 ,  H05K9/0028 ,  H05K1/0237 ,  H05K1/185 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/10803

Abstract: A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.

公开(公告)号：US20230255011A1

公开(公告)日：2023-08-10

申请号：US18063524

申请日：2022-12-08

Applicant: NANOTECH ENERGY, INC.

Inventor： Richard B. KANER ,  Maher F. EL-KADY ,  Jack KAVANAUGH ,  Scott LAINE

IPC: H05K9/00 ,  H05K1/03

CPC classification number: H05K9/0081 ,  H05K1/03 ,  H05K2201/0707 ,  H05K2201/10371

Abstract: Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

公开(公告)号：US20230141689A1

公开(公告)日：2023-05-11

申请号：US18153051

申请日：2023-01-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuya ODA

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K9/00 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10371 ,  H05K2201/0707

Abstract: A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.

公开(公告)号：US20180206356A1

公开(公告)日：2018-07-19

申请号：US15921433

申请日：2018-03-14

Applicant: Conti Temic microelectronic GmbH

Inventor： Frieder Wittmann ,  Karin Beart ,  Johannes Bock ,  Thomas Schmidt ,  Bernhard Schuch

IPC: H05K5/06 ,  H05K5/00 ,  H05K5/03 ,  H05K5/02 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K5/065 ,  H01L21/56 ,  H05K1/142 ,  H05K1/181 ,  H05K1/189 ,  H05K5/0017 ,  H05K5/0082 ,  H05K5/0247 ,  H05K5/03 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K9/0081 ,  H05K2201/0707 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The peripheral edge region is encapsulated by injection molding in a media-tight manner by a polymer at least in the region of the connecting seam between the housing cover and the connecting apparatus.

公开(公告)号：US20180206355A1

公开(公告)日：2018-07-19

申请号：US15921383

申请日：2018-03-14

Applicant: Conti Temic microelectronic GmbH

Inventor： Frieder Wittmann ,  Karin Beart ,  Johannes Bock ,  Thomas Schmidt ,  Bernhard Schuch

IPC: H05K5/06 ,  H05K5/00 ,  H05K5/03 ,  H05K5/02 ,  H05K1/18 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K5/065 ,  H01L21/56 ,  H01L23/28 ,  H05K1/142 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K5/0017 ,  H05K5/0082 ,  H05K5/0247 ,  H05K5/03 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K9/0081 ,  H05K2201/0707 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The housing cover is encapsulated by injection molding in a media-tight manner by a polymer beyond the peripheral edge region.

公开(公告)号：US09999121B2

公开(公告)日：2018-06-12

申请号：US15490012

申请日：2017-04-18

Applicant: Laird Technologies, Inc.

Inventor： Mohammadali Khorrami ,  Paul Francis Dixon ,  George William Rhyne

IPC: H01L23/552 ,  H05K1/02 ,  H05K9/00 ,  H01L23/31 ,  H01L23/64 ,  H01L23/00 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H01L23/3114 ,  H01L23/552 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/85 ,  H01L2924/141 ,  H01L2924/1615 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0233 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0003 ,  H05K9/0028 ,  H05K2201/0707 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.