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    HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD THEREOF
    72.
    发明申请
    HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD THEREOF 有权
    多层基板的混合结构及其制造方法

    公开(公告)号：US20110124155A1

    公开(公告)日：2011-05-26

    申请号：US13015739

    申请日：2011-01-28

    Applicant: Chih-kuang Yang

    Inventor： Chih-kuang Yang

    IPC: H01L21/50

    CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

    Abstract translation: 多层基板的混合结构包括第一多层基板和第二多层基板。 第一多层基板交替地堆叠第一金属层，第一介电层并具有VIA。 第一金属层的边界区域与相应的第一介电层的边界区域连接。 边界区域与相邻的第一金属层和相邻的第一介电层分离。 第二多层基板交替堆叠第二金属层和第二电介质层。 第二金属层的边界区域与相应的第二电介质层的边界区域连接。 边界区域与相邻的第二金属层和相邻的第二介电层分离。 VIA位于第一电介质层的边界区，并且每个VIA具有导电体，以将一个第一金属层与一个第二金属层连接。

    Thin multi-chip flex module
    73.
    再颁专利
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：USRE42252E1

    公开(公告)日：2011-03-29

    申请号：US12804381

    申请日：2010-07-20

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K1/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

    MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
    74.
    发明申请
    MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD 审中-公开
    多层微波校正印刷电路板及方法

    公开(公告)号：US20110024160A1

    公开(公告)日：2011-02-03

    申请号：US12534077

    申请日：2009-07-31

    Applicant: Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

    Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

    IPC: H05K1/00 ,  H05K3/36

    CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

    Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.

    Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，本发明涉及一种用于互连波纹印刷电路板的部件的方法，所述部件包括在第一柔性层的表面上具有第一信号线的第一柔性层和具有第二信号线的第二柔性层 在所述第二柔性层的表面上，所述方法包括在所述第一柔性层中形成至少一个第一孔，在所述第二柔性层上形成导电垫，在非导电粘合剂层中形成至少一个第二孔， 至少一个具有所述至少一个第一孔和所述导电垫的第二孔，将所述第一柔性层和所述第二柔性层结合，所述非导电粘合剂层设置在所述第一孔和所述第二柔性层之间，并填充所述至少一个第一孔和所述第二孔 至少一个具有导电膏的第二孔，用于将第一信号线与第二信号线电耦合。

    PATTERNING METHODS FOR STRETCHABLE STRUCTURES
    75.
    发明申请
    PATTERNING METHODS FOR STRETCHABLE STRUCTURES 有权
    适应性强的结构方法

    公开(公告)号：US20100143848A1

    公开(公告)日：2010-06-10

    申请号：US12331131

    申请日：2008-12-09

    Applicant: Kanti Jain ,  Kevin Lin

    Inventor： Kanti Jain ,  Kevin Lin

    IPC: G03F7/20

    CPC classification number: H05K1/0283 ,  B23K26/40 ,  B23K2103/172 ,  B81B2201/0292 ,  B81B2203/0109 ,  B81B2207/07 ,  B81C1/0019 ,  H05K3/0032 ,  H05K3/007 ,  H05K2201/09109 ,  H05K2203/0554 ,  H05K2203/308

    Abstract: Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm2 or greater or 1 m2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.

    Abstract translation: 这里描述了使用激光烧蚀图案化方法制造可拉伸和/或柔性电子器件的处理技术。 本文使用的激光烧蚀图案化方法允许有效地制造大面积（例如，高达1mm 2或更大或1m 2或更大）的可拉伸和/或柔性电子器件，例如允许减少步数的制造方法。 本文描述的技术进一步提供了改进的电子设备内的组件的异构集成，例如具有电子设备内的改进的对准和/或相对定位的组件。 本文还描述了柔性和/或可拉伸的电子设备，例如互连，传感器和致动器。

    ELECTRICAL AND OPTICAL HYBRID FILM, AND ELECTRONIC APPARATUS RECEIVING THE SAME
    76.
    发明申请
    ELECTRICAL AND OPTICAL HYBRID FILM, AND ELECTRONIC APPARATUS RECEIVING THE SAME 有权
    电子和光学混合膜，以及接收它们的电子设备

    公开(公告)号：US20090317048A1

    公开(公告)日：2009-12-24

    申请号：US12300368

    申请日：2007-05-11

    Applicant: Tsuyoshi Shioda ,  Kazuhiro Yamada

    Inventor： Tsuyoshi Shioda ,  Kazuhiro Yamada

    IPC: G02B6/122

    CPC classification number: G02B6/10 ,  H05K1/0274 ,  H05K2201/09109

    Abstract: An electrical and optical hybrid film having high resistance to bending. The electrical and optical hybrid film has an optical waveguide film and an electrical wiring film on the optical waveguide film. The electrical and optical hybrid film has, between its opposite ends, a separated section where the electrical wiring film and the optical waveguide film are not secured to each other. The optical waveguide film has, at the separated section, a slit extending in the longitudinal direction, and the slit penetrates the optical waveguide film.

    Abstract translation: 具有高耐弯曲性的电光复合膜。 电光复合膜在光波导膜上具有光波导膜和电布线膜。 电气和光学混合膜在其相对端之间具有分离的部分，其中电布线膜和光波导膜彼此不固定。 光波导膜在分离部分具有沿纵向方向延伸的狭缝，并且狭缝穿透光波导膜。

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