公开(公告)号：US20070102830A1

公开(公告)日：2007-05-10

申请号：US11586209

申请日：2006-10-24

Applicant: Akira Muto ,  Tomokazu Tanaka

Inventor： Akira Muto ,  Tomokazu Tanaka

IPC: H01L23/52

CPC classification number: H05K1/118 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/0237 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09727 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.

Abstract translation: 柔性印刷电路板具有绝缘层，包括微带线的第一信号布线层，包括用于允许微带线将外部连接器电连接的信号连接端子的第二信号布线层和具有地面的接地导电部分 用于连接外部连接器的连接端子。 微带线和信号连接端子通过布线孔相互连接。 布线通孔穿过绝缘层，第一信号布线层和第二信号布线层。 微带线具有锥形部，其在布线通孔附近逐渐扩大微带线的宽度朝向布线通孔。 对应于微带线的接地导电部分具有与微带线的锥形部分匹配的形状的锥形部分。

公开(公告)号：US20070093107A1

公开(公告)日：2007-04-26

申请号：US11585959

申请日：2006-10-25

Applicant: Kenji Motohashi ,  Takashi Yanagimoto ,  Hideji Miyanishi ,  Kazumasa Aoki

Inventor： Kenji Motohashi ,  Takashi Yanagimoto ,  Hideji Miyanishi ,  Kazumasa Aoki

IPC: H01R29/00

CPC classification number: H05K1/117 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.

Abstract translation: 提供印刷电路板的设计规则。 导电层和焊盘在由设计规则限定的距离内彼此分开，这足以防止导电层和焊盘之间的电容耦合。

公开(公告)号：US20070090398A1

公开(公告)日：2007-04-26

申请号：US11583212

申请日：2006-10-18

Applicant: William McKinzie

Inventor： William McKinzie

IPC: H01L31/00

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

Abstract translation: 用于宽带抑制印刷电路板上的噪声的混合电磁带隙（EBG）结构包括通过串联电感互连到电网中的共面贴片阵列，以及将共面贴片连接到第二导电平面的相应阵列的分流LC网络。 串联电感和并联谐振通孔的组合降低了基波阻带的截止频率。 串联电感和分流电容可以使用表面贴装元件技术或印刷迹线实现。 补片也可以通过共面耦合传输线相互连接。 可以通过在与传输线相对布置的第二导电平面中形成槽，降低截止频率并增加基带阻带的带宽来增加耦合线的偶模和奇模阻抗。 共面EBG结构可以集成到用于宽带抑制电磁噪声的印刷线路板的配电网络中。

公开(公告)号：US20070069325A1

公开(公告)日：2007-03-29

申请号：US11516005

申请日：2006-09-05

Applicant: Yasuhisa Yamanaka

Inventor： Yasuhisa Yamanaka

IPC: H01L29/00

CPC classification number: H05K1/0216 ,  H05K1/0218 ,  H05K2201/0723 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: Mounting components such as LSIs, which emit noise to the outside and are subjected to the influence of external noise, on the top-most layer and the bottom-most layer respectively, a co-existing layer of the ground region and the power source region has been employed, where a ground region has been provided respectively to the range corresponding to the position the LSIs on the next layer below the top-most layer and the next layer above the bottom-most layer. Accordingly, the number of layers to be laminated to form the multilayer substrate has been reduced, because it is no longer required, unlike the related art, to provide a ground layer where the ground pattern is formed substantially over the entire surface of layer respectively to the next layer below the top-most layer having mounted a LSI thereon and of the next layer above the bottom-most layer having mounting a LSI thereon.

Abstract translation: 分别在最上层和最底层上分别向外部发出噪声并受到外部噪声的影响的诸如LSI的安装部件，接地区域和电源区域的共存层 已经使用了地面区域分别设置在与最上层下面的下一层的LSI的位置相对应的范围和最底层以上的下一层的范围内。 因此，与现有技术不同，由于不再需要层叠以形成多层基板的层的数量，因此提供接地层，其基本上在层的整个表面上分别形成接地图案， 在其上安装有LSI的最上层的下一层和在其上安装有LSI的最底层之上的下一层。

公开(公告)号：US20070039171A1

公开(公告)日：2007-02-22

申请号：US11537754

申请日：2006-10-02

Applicant: Joel Goergen

Inventor： Joel Goergen

IPC: H01R43/00

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: Method and apparatus are disclosed for flow control over Point-to-Point Protocol (PPP) data links. A method of negotiating such flow control between two PPP peers is disclosed, along with methods for operating flow control across a PPP link. In one embodiment, flow control frames carry an IEEE802.3x MAC control frame payload—the PPP implementation repackages such frames as MAC control frames and passes them to a MAC, which performs flow control. In another embodiment, flow control frames allow flow control commands to be applied differently to different service classes such that PPP flow can be controlled on a per-class basis.

Abstract translation: 公开了用于在点对点协议（PPP）数据链路上的流控制的方法和装置。 公开了一种在两个PPP对等体之间协商这种流量控制的方法，以及用于在PPP链路上操作流量控制的方法。 在一个实施例中，流控制帧携带IEEE802.3x MAC控制帧有效载荷 - PPP实现将诸如MAC控制帧的帧重新封装，并将其传递给执行流控制的MAC。 在另一个实施例中，流控制帧允许流控制命令被不同地应用于不同的服务类，使得PPP流可以基于每个级别进行控制。

公开(公告)号：US20070015380A1

公开(公告)日：2007-01-18

申请号：US11533676

申请日：2006-09-20

Applicant: Lewis Aronson

Inventor： Lewis Aronson

IPC: H05K1/00

CPC classification number: H05K1/117 ,  G02B6/43 ,  H01R12/721 ,  H01R13/6585 ,  H05K1/0216 ,  H05K2201/0373 ,  H05K2201/093 ,  H05K2201/094 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an electrical connection system is provided that includes a circuit board upon which are disposed a one or more signal contact pads, each of which is configured to communicate with a complementary element of an external electrical device such that a respective shunt capacitance is defined. One or more of the signal contact pads define at least one open portion through which communication signals cannot pass. The open portions of the one or more signal contact pads are configured to reduce a shunt capacitance that is defined at the coupling of each signal contact pad and corresponding connector. As well, one or more signal lines are likewise disposed on the circuit board such that each signal line is connected to a respective one of the signal contact pads. The circuit board finally includes one or more ground contact pads and power contact pads.

Abstract translation: 该公开涉及被配置为在高速数据传输环境中实现阻抗匹配方案的系统和设备。 在一个示例中，提供了一种电连接系统，其包括电路板，在该电路板上布置有一个或多个信号接触焊盘，每个信号接触焊盘被配置为与外部电气设备的互补元件通信，从而定义相应的分流电容 。 一个或多个信号接触垫限定通信信号不能通过的至少一个开口部分。 一个或多个信号接触焊盘的开口部分被配置为减小在每个信号接触焊盘和对应的连接器的耦合处限定的并联电容。 同样，一个或多个信号线同样设置在电路板上，使得每个信号线连接到相应的一个信号接触焊盘。 电路板最后包括一个或多个接地焊盘和电源接触焊盘。

公开(公告)号：US20060290463A1

公开(公告)日：2006-12-28

申请号：US11135762

申请日：2005-05-23

Applicant: Devin Bingham ,  Daniel Ayres ,  Alvin Chow

Inventor： Devin Bingham ,  Daniel Ayres ,  Alvin Chow

IPC: H01C10/00

CPC classification number: H05K1/162 ,  H05K1/0293 ,  H05K1/0298 ,  H05K3/027 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2203/107 ,  H05K2203/171 ,  H05K2203/175

Abstract: A circuit element has a substrate layer with first and second faces. A conductive first layer overlays the first surface, and a conductive second layer overlays the second surface. The first layer defines a pattern with a trimmable portion. The second layer defines a pattern having a first conductive element registered with at least a portion of the trimmable portion, and a second conductive element electrically isolated from first element and encompassing the first element. The second element may be a ground plane that has an aperture surrounding the first component, which serves as a shield to prevent damage to any elements beyond the second layer.

Abstract translation: 电路元件具有带有第一和第二面的衬底层。 导电第一层覆盖第一表面，并且导电的第二层覆盖第二表面。 第一层定义具有可调节部分的图案。 第二层限定了具有与可调节部分的至少一部分配准的第一导电元件的图案，以及与第一元件电隔离并且包围第一元件的第二导电元件。 第二元件可以是具有围绕第一部件的孔的接地平面，其用作屏蔽件以防止损坏超出第二层的任何元件。

公开(公告)号：US07152312B2

公开(公告)日：2006-12-26

申请号：US10073701

申请日：2002-02-11

Applicant: Gary Gottlieb

Inventor： Gary Gottlieb

IPC: H01R43/00 ,  H05K3/36

CPC classification number: H05K1/116 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for transmitting high-frequency current through a substrate is provided. The method comprises receiving the high-frequency current at a via passing through at least one conductive plane disposed within the substrate and coupled to the via with one or more tabs which span a gap between the at least one conductive plane and the via; and directing the high-frequency current along an uninterrupted path substantially on a surface of the via thereby bypassing the at least one conductive plane by conducting at least a portion of the high-frequency current between the one or more tabs.

Abstract translation: 提供了一种通过基板传输高频电流的方法。 该方法包括在穿过设置在衬底内的至少一个导电平面的通孔处接收高频电流，并且通过跨越至少一个导电平面和通孔之间的间隙的一个或多个接片连接到通孔; 以及基本上在所述通孔的表面上沿着不间断的路径引导所述高频电流，从而通过在所述一个或多个突片之间传导所述高频电流的至少一部分来绕过所述至少一个导电平面。

公开(公告)号：US20060274478A1

公开(公告)日：2006-12-07

申请号：US11147412

申请日：2005-06-06

Applicant: Macushla Chen ,  James Howard

Inventor： Macushla Chen ,  James Howard

IPC: H01G4/20 ,  H01G9/00

CPC classification number: H05K1/162 ,  H05K1/0216 ,  H05K1/165 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2201/1006

Abstract: An etched capacitor laminate for reducing electrical noise. The etched capacitor laminate is configured to be an element of a printed circuit board. The etched capacitor laminate comprises a first conductive sheet, an intermediate sheet of dielectric material, and a second conductive sheet. The first conductive sheet further comprises a plurality of etched forms wherein each of the etched forms is causing a local capacitive effect and a local inductive effect. The local capacitive effect and local inductive effect generates a plurality of local filters that reduce electrical noise. The intermediate sheet of dielectric material is bonded to the first conductive sheet, and the second conductive sheet is also bonded to the intermediate sheet.

Abstract translation: 用于降低电气噪声的蚀刻电容层压板。 蚀刻电容器层叠体被构造为印刷电路板的元件。 蚀刻电容器层叠体包括第一导电片，介电材料的中间片和第二导电片。 第一导电片还包括多个蚀刻形式，其中每个蚀刻形式引起局部电容效应和局部感应效应。 本地电容效应和局部感应效应产生多个降低电噪声的局部滤波器。 电介质材料的中间片与第一导电片接合，第二导电片也与中间片接合。

公开(公告)号：US20060237322A1

公开(公告)日：2006-10-26

申请号：US11377142

申请日：2006-03-16

Applicant: Shou-Kuo Hsu

Inventor： Shou-Kuo Hsu

IPC: C25D5/02

CPC classification number: H05K1/0245 ,  H05K1/0237 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969

Abstract: A printed circuit board includes a first ground layer and a second ground layer. The second ground layer is below the first ground layer. A signal transmission line is arranged on the printed circuit board. The first ground layer includes a chamber located below the transmission line. Therefore, the signal transmission line takes the second ground layer as a reference ground layer, so impedance of the signal transmission line is increased.

Abstract translation: 印刷电路板包括第一接地层和第二接地层。 第二接地层位于第一接地层之下。 信号传输线布置在印刷电路板上。 第一接地层包括位于传输线下方的腔室。 因此，信号传输线将第二接地层作为参考接地层，从而信号传输线的阻抗增加。