公开(公告)号：US07922291B2

公开(公告)日：2011-04-12

申请号：US11700343

申请日：2007-01-31

Applicant: Tomoyuki Kubo ,  Seiji Shimizu ,  Hiroo Ogawa ,  Hiromitsu Mizutani ,  Atsushi Ito

Inventor： Tomoyuki Kubo ,  Seiji Shimizu ,  Hiroo Ogawa ,  Hiromitsu Mizutani ,  Atsushi Ito

IPC: B41J2/14 ,  B41J2/05 ,  B41J2/045

CPC classification number: B41J2/14209 ,  B41J2/055 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14419 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2203/0278

Abstract: An ink jet head, includes: an actuator including a plurality of terminals; a wiring material including a base made of a flexible resin film on which a plurality of lands are arranged in arrays corresponding to the plurality of terminals, the wiring material of which one end is superimposed on a surface of the actuator, and which is extended in a direction parallel to the surface of the actuator; and a drive circuit for driving the actuator, wherein: the wiring material includes a small width portion, of which a width in a direction, perpendicular to an extended direction is smaller than that of the one end superimposed on the actuator, arranged on an extended portion; and the drive circuit is mounted on the extended portion; and wiring patterns are formed on the wiring material, for connecting the drive circuit and the plurality of lands.

Abstract translation: 一种喷墨头，包括：包括多个端子的致动器; 布线材料，其包括由柔性树脂膜构成的基底，多个平台排列成与多个端子对应的阵列，所述布线材料的一端重叠在所述致动器的表面上，并且延伸到 平行于致动器表面的方向; 以及用于驱动所述致动器的驱动电路，其中：所述布线材料包括小宽度部分，其宽度方向垂直于延伸方向的宽度小于重叠在致动器上的一端的宽度，布置在延伸方向上 一部分; 并且驱动电路安装在延伸部分上; 并且布线图案形成在布线材料上，用于连接驱动电路和多个焊盘。

公开(公告)号：US07910402B2

公开(公告)日：2011-03-22

申请号：US12125421

申请日：2008-05-22

Applicant: Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

Inventor： Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

IPC: H01L21/00

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16013 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/0379 ,  H05K2201/09427 ,  H05K2203/1121 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: For a suppressed breakage after a flip chip connection of a semiconductor device using a low-permittivity insulation film and a lead-free solder together, with an enhanced production yield, bump electrodes (2) are heated by a temperature profile having, after a heating up to a melting point of the bump electrodes (2) or more, a cooling in which a temperature within a range of 190 to 210° C. is kept for an interval of time within a range of 3 to 15 minutes, and a condition is met, such that 1.4

Abstract translation: 为了在使用低介电常数绝缘膜和无铅焊料的半导体器件的倒装芯片连接之后抑制破坏，以提高的生产成本，凸起电极（2）被加热了在加热之后的温度分布 直到凸起电极（2）的熔点以上，将在190〜210℃的范围内的温度保持在3〜15分钟的范围内的时间间隔的冷却，以及条件 使得1.4

公开(公告)号：US07779538B2

公开(公告)日：2010-08-24

申请号：US11917527

申请日：2006-06-21

Applicant: Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

Inventor： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

IPC: H05K3/36

CPC classification number: H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

Abstract: A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Abstract translation: 一种用于连接电路板的方法，包括：（i）制备具有分配给多个导体布线的端部的连接部分的第一电路板和具有分配给多个导体布线的相应端部的连接部分的第二电路板 ; （ii）将第一电路板的连接部分设置成与电路板的连接部分之间的热固性粘合膜面对第二电路板的连接部分; 和（iii）对连接部分和热固性粘合剂膜施加足够高的热量和压力，以充分地推开粘合剂膜，以便在彼此面对的电路板的连接部分之间建立电接触，并允许固化 胶粘剂; 其中构成第一和第二电路板中的至少一个的连接部分的导体配线包含非线性配线。

公开(公告)号：US20100027229A1

公开(公告)日：2010-02-04

申请号：US12577867

申请日：2009-10-13

Applicant: Tomofumi Kitada ,  Hiroki Maruo

Inventor： Tomofumi Kitada ,  Hiroki Maruo

IPC: H05K7/00 ,  H05K1/09

CPC classification number: H05K3/363 ,  H05K1/117 ,  H05K2201/09427 ,  H05K2201/097 ,  H05K2201/09727

Abstract: A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.

Abstract translation: 一种具有绝缘基材的印刷线路板; 形成在所述绝缘基材的至少一个表面上的布线，所述布线形成预定的电路图案; 第一连接端子部分，形成在表面上并电连接到布线，第一连接端子部分具有第一宽度; 形成在表面上并电连接到布线的第二连接端子部分，第二连接端子部分具有第二宽度; 以及覆盖层，其被配置为覆盖所述布线并暴露所述第一连接端子部和所述第二连接端子部。

公开(公告)号：US20090227172A1

公开(公告)日：2009-09-10

申请号：US12465012

申请日：2009-05-13

Applicant: SUNG-TAE KIM

Inventor： SUNG-TAE KIM

IPC: H01J9/14

CPC classification number: H05K3/361 ,  H01J11/10 ,  H01J11/46 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09427 ,  H05K2201/098

Abstract: A plasma display apparatus comprising a connector is provided. The plasma display apparatus comprises a plasma display panel comprising an electrode of a predetermined width and a connector comprising an electrode line of a width narrower than the predetermined width of the electrode to supply a driving signal to the electrode. A distance between the electrode line and an adjacent electrode line is longer than a distance between the electrode and an adjacent electrode.

Abstract translation: 提供了包括连接器的等离子体显示装置。 等离子体显示装置包括等离子体显示面板，其包括预定宽度的电极和包括宽度比电极的预定宽度窄的电极线的连接器，以向电极提供驱动信号。 电极线和相邻电极线之间的距离比电极和相邻电极之间的距离长。

公开(公告)号：US07488896B2

公开(公告)日：2009-02-10

申请号：US11265952

申请日：2005-11-03

Applicant: Hajime Saiki ,  Masahiro Iba

Inventor： Hajime Saiki ,  Masahiro Iba

IPC: H05K1/16

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/81191 ,  H01L2924/01322 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/09427 ,  H05K2201/099 ,  H05K2201/10992 ,  H05K2203/0465 ,  H05K2203/0594 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a flip-chip connection. The semiconductor component is flip-chip bonded at a pad array at a component side thereof to a pad array at a board side by way of an individual solder joint portion. In a solder resist layer at a semiconductor component side and a solder resist layer at a board side, D/D0 is prepared to be in a range of 0.70 to 0.99, where D is a bottom inner diameter of an opening at the board side and D0 is a bottom inner diameter of an opening at the component side.

Abstract translation: 一种由具有半导体部件的布线板构成的电子装置。 在倒装芯片连接的回流工艺期间，器件不太可能具有任何缺陷，例如焊接部分的裂纹。 半导体部件在其一侧的焊盘阵列处通过单独的焊接部分在基板侧被倒装成焊盘阵列。 在半导体部件侧的阻焊层和基板侧的阻焊层中，D / D0为0.70〜0.99的范围，D为板侧的开口的底部内径， D0是部件侧的开口的底部内径。

公开(公告)号：US07450395B2

公开(公告)日：2008-11-11

申请号：US12100479

申请日：2008-04-10

Applicant: Norio Sakai

Inventor： Norio Sakai

IPC: H05K7/00

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09427 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between. Circuit components are provided in portions of a surface of the plate-shaped board, the portions being located inward relative to the frame-shaped board. A sealing resin is filled and cured in a cavity, which is defined by the frame-shaped board and the plate-shaped board. Since the center of each of the connection electrodes on the frame-shaped board is inwardly displaced relative to the center of a corresponding one of the connection electrodes on the plate-shaped board by α, a curing contraction stress of the sealing resin is mitigated by a curing contraction stress of the conductive bonding materials. Thus, deformation of the frame-shaped board is suppressed.

Abstract translation: 电路模块包括板状板上的连接电极和框架形板上的连接电极，其间连接有导电接合材料。 电路部件设置在板状板的表面的一部分中，该部分相对于框状板位于内侧。 密封树脂在由框状板和板状板限定的空腔中填充和固化。 由于框架板上的每个连接电极的中心相对于板状板上相应的一个连接电极的中心向内移位，所以密封树脂的固化收缩应力被减轻 导电接合材料的固化收缩应力。 因此，能够抑制框状板的变形。

公开(公告)号：US20080230901A1

公开(公告)日：2008-09-25

申请号：US11688271

申请日：2007-03-20

Applicant: Eric Duchesne ,  Julien Sylvestre

Inventor： Eric Duchesne ,  Julien Sylvestre

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/49816 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16104 ,  H01L2224/17104 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/09427 ,  Y02P70/613

Abstract: A structure, for controlled collapse chip connection (C4) between an integrated circuit (IC) and a substrate, that alleviates the adverse effects resulting from induced stresses in C4 solder joints, the structure includes: a first and second array defined on the ball limiting metallurgy (BLM) side of the IC; a first and second array of surface mount (SM) pads arranged on the substrate placement side; and wherein the reduction of the adverse effects resulting from the induced stress in the solder joints is facilitated by varying the relative alignment of the first and second arrays of SM pads to the first and second arrays of solder balls.

Abstract translation: 一种结构，用于在集成电路（IC）和衬底之间的受控崩溃芯片连接（C4），其减轻由C4焊接点中的应力引起的不利影响，所述结构包括：限定在限制球上的第一和第二阵列 ICM冶金（BLM）侧; 布置在基板放置侧的第一和第二表面安装阵列阵列（SM）焊盘; 并且其中通过改变SM焊盘的第一和第二阵列与第一和第二焊料阵列的相对对准来促进由焊点中的感应应力引起的不利影响的减小。

公开(公告)号：US20080061696A1

公开(公告)日：2008-03-13

申请号：US11939325

申请日：2007-11-13

Applicant: Sung-Tae KIM

Inventor： Sung-Tae KIM

IPC: H01J17/49

CPC classification number: H05K3/361 ,  H01J11/10 ,  H01J11/46 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09427 ,  H05K2201/098

Abstract: A plasma display apparatus comprising a connector is provided. The plasma display apparatus comprises a plasma display panel comprising an electrode of a predetermined width and a connector comprising an electrode line of a width narrower than the predetermined width of the electrode to supply a driving signal to the electrode. A distance between the electrode line and an adjacent electrode line is longer than a distance between the electrode and an adjacent electrode.

Abstract translation: 提供了包括连接器的等离子体显示装置。 等离子体显示装置包括等离子体显示面板，其包括预定宽度的电极和包括宽度比电极的预定宽度窄的电极线的连接器，以向电极提供驱动信号。 电极线和相邻电极线之间的距离比电极和相邻电极之间的距离长。

公开(公告)号：US20080042257A1

公开(公告)日：2008-02-21

申请号：US11846703

申请日：2007-08-29

Applicant: Chi-Hsing Hsu

Inventor： Chi-Hsing Hsu

IPC: H01L23/48

CPC classification number: H01L23/5389 ,  H01L24/06 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/08237 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0219 ,  H05K1/113 ,  H05K1/183 ,  H05K3/4682 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09854

Abstract: A bumpless chip package including at least one chip and an interconnection structure is provided. The chip has an active surface and a non-active surface opposite the active surface, and has a die pad arrangement disposed on the active surface of the chip. The die pad arrangement includes at least one first pad and at least one second pad. On the active surface of the chip, the projection area of the second pad is greater than that of the first pad. The active surface of chip faces the interconnection structure to embed within the interconnection structure. The interconnection structure has an inner circuit and a plurality of contact pads. The contact pads are disposed on a contact surface of the interconnection structure. Moreover, at least one of the first pad and the second pad is electrically coupled to at least one of the contact pads through the inner circuit.

Abstract translation: 提供了包括至少一个芯片和互连结构的无扰动芯片封装。 芯片具有与有源表面相对的有源表面和非有效表面，并且具有设置在芯片的有源表面上的管芯焊盘布置。 管芯焊盘布置包括至少一个第一焊盘和至少一个第二焊盘。 在芯片的有源表面上，第二焊盘的投影面积大于第一焊盘的投影面积。 芯片的有源表面面向互连结构以嵌入在互连结构内。 互连结构具有内部电路和多个接触焊盘。 接触垫设置在互连结构的接触表面上。 此外，第一焊盘和第二焊盘中的至少一个通过内部电路电耦合到至少一个接触焊盘。