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    Method for manufacturing a three dimensional circuit board
    72.
    发明授权
    Method for manufacturing a three dimensional circuit board 失效
    三维电路板的制造方法

    公开(公告)号：US08528202B2

    公开(公告)日：2013-09-10

    申请号：US11513478

    申请日：2005-02-17

    Applicant: Tetsuo Yumoto

    Inventor： Tetsuo Yumoto

    IPC: H05K3/42

    CPC classification number: G01R31/28 ,  H05K1/0284 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49176

    Abstract: A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board, prescribed circuit patterns made of a conductive material are formed, and on the rear plane, prescribed circuit patterns are also formed. On the circuit board, a through hole is formed to carry electricity between the circuit patterns on both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns and wide in a circuit extending direction.

    Abstract translation: 防止金属模具的成型销断裂，确实沉积焊料，因此可以将电路间距减小到极限。 在电路板的正面上，形成由导电材料制成的规定的电路图案，在背面也形成规定的电路图形。 在电路板上，形成通孔，以在两个平面上的电路图案之间承载电力。 通孔的内部形状在相邻电路图案之间的方向上窄，并且在电路延伸方向上宽。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    73.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    接线板及其制造方法

    公开(公告)号：US20130219714A1

    公开(公告)日：2013-08-29

    申请号：US13853087

    申请日：2013-03-29

    Applicant: IBIDEN CO., LTD.

    Inventor： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

    IPC: H05K3/40

    CPC classification number: H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

    Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

    Abstract translation: 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

    METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD
    74.
    发明申请
    METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD 审中-公开
    印刷线路板和印刷电路板的制作方法

    公开(公告)号：US20130213705A1

    公开(公告)日：2013-08-22

    申请号：US13756898

    申请日：2013-02-01

    Applicant: FUJITSU LIMITED

    Inventor： Mitsuo SUEHIRO ,  Tsuyoshi YAMAMOTO

    IPC: H05K1/02 ,  H05K3/34 ,  H05K3/00

    CPC classification number: H05K1/0296 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/341 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2203/0415 ,  Y10T29/49124 ,  Y10T29/49144

    Abstract: A method of fabricating a printed-wiring board, includes: forming a through-hole across a thickness of a printed-wiring board, the forming of the through-hole including forming a first opening part having a first diameter, forming a second opening part having a second diameter, and forming a third opening part provided between the first opening part and the second opening part, wherein the second diameter is larger than the first diameter, and the third opening part is formed in a tapered shape whose diameter decreases toward the first opening part from the second opening part.

    Abstract translation: 一种制造印刷电路板的方法，包括：在印刷电路板的厚度上形成通孔，形成通孔，该通孔包括形成具有第一直径的第一开口部，形成第二开口部 具有第二直径，并且形成设置在第一开口部和第二开口部之间的第三开口部，其中第二直径大于第一直径，第三开口部形成为锥形，其直径朝向 第一开口部分从第二开口部分开始。

    Electrical connector with solder columns
    75.
    发明授权
    Electrical connector with solder columns 有权
    带焊料柱的电连接器

    公开(公告)号：US08507804B2

    公开(公告)日：2013-08-13

    申请号：US12710189

    申请日：2010-02-22

    Applicant: Alan MacDougall ,  Robert Daniel Hilty ,  George Jyh-Shann Chou

    Inventor： Alan MacDougall ,  Robert Daniel Hilty ,  George Jyh-Shann Chou

    IPC: H05K1/09

    CPC classification number: H01R12/52 ,  G01R1/0416 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K2203/162 ,  Y02P70/613

    Abstract: An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.

    Abstract translation: 提供电连接器用于与电气部件配合。 连接器包括具有配合侧的基板和从基板的配合侧延伸的焊料柱。 焊料柱包括与基底接合的基底。 焊料柱从衬底的配合侧向尖端延伸一段长度。 尖端包括被配置为接合并电连接到电气部件的电触点的接触表面。 焊料柱沿着从基部到尖端的长度的至少一部分线性渐缩。

    Process for fabricating a connector
    76.
    发明授权
    Process for fabricating a connector 有权
    连接器制造工艺

    公开(公告)号：US08499442B2

    公开(公告)日：2013-08-06

    申请号：US12584629

    申请日：2009-09-08

    Applicant: James J Levante ,  Dennis Johnson ,  Tom Sahakian

    Inventor： James J Levante ,  Dennis Johnson ,  Tom Sahakian

    IPC: H01R9/00

    CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

    Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

    Abstract translation: 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，Ultem®，Polyimide，Torlon®。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。

    Printed wiring board and method for manufacturing the same
    78.
    发明授权
    Printed wiring board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08431833B2

    公开(公告)日：2013-04-30

    申请号：US12645791

    申请日：2009-12-23

    Applicant: Kazuki Kajihara

    Inventor： Kazuki Kajihara

    IPC: H05K1/11

    CPC classification number: H05K3/427 ,  H05K1/0366 ,  H05K3/0032 ,  H05K3/0038 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/1572 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A printed wiring board includes a substrate having a first surface, a second surface on the opposite side of the first surface and a through-hole extending between the first and second surfaces, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor filling the through-hole and connecting the first and second conductive circuits. The through-hole has a first opening portion tapering from the first surface toward the second surface and a second opening portion tapering from the second surface toward the first surface. The substrate is made of a resin and a reinforcing material portion in the resin. The reinforcing material portion has a protruding portion protruding into the through-hole at the intersection of the first and second opening portions. The protruding portion encroaches into the through-hole conductor.

    Abstract translation: 印刷电路板包括具有第一表面，在第一表面的相对侧上的第二表面和在第一和第二表面之间延伸的通孔的基板，形成在基板的第一表面上的第一导电电路， 形成在基板的第二表面上的第二导电电路和填充通孔并连接第一和第二导电电路的通孔导体。 通孔具有从第一表面朝向第二表面渐缩的第一开口部分和从第二表面朝向第一表面渐缩的第二开口部分。 基板由树脂和增强材料部分在树脂中制成。 增强材料部分具有在第一和第二开口部分的相交处突出到通孔中的突出部分。 突出部分侵入通孔导体。

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