公开(公告)号：US20130257670A1

公开(公告)日：2013-10-03

申请号：US13852510

申请日：2013-03-28

Applicant: WAVECONNEX, INC.

Inventor： Emilio Sovero ,  Gary D. McCormack

IPC: H01Q1/24 ,  H01P3/00

CPC classification number: H01Q13/103 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01P3/006 ,  H01P3/121 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H05K1/0218 ,  H05K1/0274 ,  H05K2201/0191 ,  H05K2201/0919 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.

Abstract translation: 用于发送或接收信号的系统可以包括具有主面的电介质基板，通信电路和电磁能指导组件。 电路可以包括被配置为在RF电和RF电磁信号之间转换并且被支撑在与可操作地耦合到换能器的衬底的主面间隔开的位置的换能器。 引导组件可以由与换能器间隔开的基板支撑，并且被构造成在包括换能器的区域中并且沿着远离换能器并横向于主面平面的线引导EM能量。

公开(公告)号：US20130225004A1

公开(公告)日：2013-08-29

申请号：US13404862

申请日：2012-02-24

Applicant: Arash Behziz ,  Dustin Grant Rowe

Inventor： Arash Behziz ,  Dustin Grant Rowe

IPC: H01R9/03

CPC classification number: H01R12/53 ,  H01R9/034 ,  H05K1/0218 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/10356

Abstract: An electrical connector assembly including a printed circuit board that has base and cover layers of dielectric material and first and second ground planes of conductive material. The base and cover layers are stacked relative to each other and located between the first and second ground planes. The base layer has a conductor-receiving portion that extends beyond the cover layer. The circuit board also includes signal traces that are exposed to an open space that exists above the conductor-receiving portion. The connector assembly also includes a compression component that is configured to be positioned in the open space to press wire-terminating ends of signal conductors onto the signal traces at the conductor-receiving portion.

Abstract translation: 一种电连接器组件，包括具有介电材料的基底和覆盖层以及导电材料的第一和第二接地平面的印刷电路板。 底层和覆盖层相对于彼此堆叠并位于第一和第二接地平面之间。 基层具有延伸超过覆盖层的导体接收部分。 电路板还包括暴露于存在于导体接收部分之上的开放空间的信号迹线。 连接器组件还包括被配置为定位在开放空间中的压缩部件，以将信号导体的线端部按压到导体接收部分处的信号迹线上。

公开(公告)号：US20130161085A1

公开(公告)日：2013-06-27

申请号：US13402638

申请日：2012-02-22

Applicant: Hueng Jae Oh ,  Boo Yang Jung ,  Dae Young Lee ,  Jin Won Choi

Inventor： Hueng Jae Oh ,  Boo Yang Jung ,  Dae Young Lee ,  Jin Won Choi

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/11474 ,  H01L2224/1184 ,  H01L2224/119 ,  H01L2224/11912 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/831 ,  H05K1/111 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0588 ,  Y02P70/611 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.

Abstract translation: 这里公开了印刷电路板（PCB）及其制造方法。 PCB包括基底基板，形成在基底基板上的电路层，包括连接焊盘，形成在基底基板的上部上并具有露出连接焊盘的开口的阻焊层，形成在上部的金属柱 的连接焊盘和阻焊层，并且具有多个直径，以及沿着金属柱的界面形成在阻焊层的上部和开口的内壁上的种子层。

公开(公告)号：US20130148319A1

公开(公告)日：2013-06-13

申请号：US13572764

申请日：2012-08-13

Applicant: LEI LI

Inventor： LEI LI

IPC: H05K1/11 ,  H05K5/00

CPC classification number: H05K1/0215 ,  H05K2201/09845 ,  H05K2201/10409

Abstract: An exemplary printed circuit board includes a main body and a fixing component. The main body includes a first signal layer, a grounding layer, a power layer, and a second signal layer, arranged in that order. A through hole is defined on the main body, and includes a latching hole and a connecting hole. The latching hole is defined by and extends through the first signal layer. The connecting hole is defined by and extends from the second signal layer to the grounding layer, and communicates with the latching hole. The fixing component passes through the through hole, and thereby forms a direct connection with a grounding point of an electronic device.

Abstract translation: 示例性印刷电路板包括主体和固定部件。 主体包括按照该顺序排列的第一信号层，接地层，功率层和第二信号层。 通孔被限定在主体上，并且包括锁定孔和连接孔。 锁定孔由第一信号层限定并延伸穿过第一信号层。 连接孔由第二信号层定义并从第二信号层延伸到接地层，并与锁定孔连通。 固定部件通过通孔，从而与电子设备的接地点形成直接连接。

公开(公告)号：US08453322B2

公开(公告)日：2013-06-04

申请号：US12539172

申请日：2009-08-11

Applicant: Raj Kumar ,  Monte Dreyer ,  Michael J. Taylor ,  Ruben Zepeda

Inventor： Raj Kumar ,  Monte Dreyer ,  Michael J. Taylor ,  Ruben Zepeda

IPC: H01K3/10

CPC classification number: H05K3/4614 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed therethrough; and a counter paste filled within the via.

Abstract translation: 制造印刷电路板的至少一部分的方法。 电路板形成为包括多个子组件，每个子组件包括多个电路层并且具有至少一个埋头孔和至少一个孔，该埋头孔具有第一直径和从第一深度 至少一个子组件的第一侧并且进入至少一个子组件，该孔具有小于第一直径的第二直径和比该至少一个子组件的第一侧的第一深度长的第二深度 子组件并进入至少一个子组件在锪孔处; 孔内金属化和埋头孔; 插入在一个和相应的一个子组件之间并且具有通过其形成的至少一个通孔的层压粘合剂; 以及填充在通孔内的计数器糊状物。

公开(公告)号：US20130136887A1

公开(公告)日：2013-05-30

申请号：US13681872

申请日：2012-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kyung Kim

IPC: H05K1/05

CPC classification number: H05K1/056 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0761 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0228 ,  Y10T156/10

Abstract: There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.

Abstract translation: 提供了一种覆铜层压板（CCL），包括：金属板; 绝缘层，其平面面积大于金属板的面积，并且层压在金属板上; 以及层叠在所述绝缘层上的铜层，其中所述绝缘层的边缘向外延伸超过所述金属板的边缘，使得形成将所述金属板的边缘与所述铜层的边缘绝缘的绝缘距离。 绝缘层可以包括聚酰亚胺层和聚酰亚胺接合层。

公开(公告)号：US20130105208A1

公开(公告)日：2013-05-02

申请号：US13661290

申请日：2012-10-26

Applicant: NITTO DENKO CORPORATION

Inventor： Naotaka HIGUCHI ,  Tetsuya OHSAWA

IPC: H05K1/11 ,  H05K1/00

CPC classification number: H05K3/421 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0219 ,  H05K1/056 ,  H05K2201/09845 ,  H05K2201/09854

Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive layer, a second insulating layer, and a ground layer. The first opening of the first insulating layer is surrounded by the second opening of the second insulating layer when projected in the thickness direction, and the ground layer fills the first opening via the second opening so as to come in contact with an upper surface of the metal supporting layer. Alternatively, the first opening surrounds the second opening when projected in the thickness direction, the second insulating layer fills a peripheral end portion of the first opening, and the ground layer fills the second opening so as to come in contact with the upper surface of the metal supporting layer.

Abstract translation: 布线电路板包括金属支撑层，第一绝缘层，导电层，第二绝缘层和接地层。 第一绝缘层的第一开口在第二绝缘层的第二开口沿厚度方向突出时被第二绝缘层包围，并且接地层经由第二开口填充第一开口以与第二绝缘层的上表面接触 金属支撑层。 或者，当沿着厚度方向投影时，第一开口围绕第二开口，第二绝缘层填充第一开口的外周端部，并且接地层填充第二开口以与第二开口的上表面接触 金属支撑层。

公开(公告)号：US20130097856A1

公开(公告)日：2013-04-25

申请号：US13712352

申请日：2012-12-12

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kentaro Kaneko

IPC: H05K3/00 ,  H05K3/40 ,  H05K3/06

CPC classification number: H05K3/007 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/113 ,  H05K3/06 ,  H05K3/205 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2203/0376 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of fabricating a wiring board includes forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer. The method also includes forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed, and removing the support member.

Abstract translation: 一种布线板的制造方法，包括在支撑部件上形成表面镀层，在形成在支撑部件上的表面镀层上形成外部连接焊盘，使得形成在表面镀层上的外部连接焊盘的面积为 小于表面镀层的面积。 该方法还包括在形成外部连接焊盘的支撑部件的表面上形成绝缘层和布线层，并且移除支撑部件。

公开(公告)号：US08405812B2

公开(公告)日：2013-03-26

申请号：US12861853

申请日：2010-08-24

Applicant: Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

Inventor： Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

IPC: G02F1/1345 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: A connecting structure of the present invention includes a first substrate, a second substrate on which the first substrate is laminated, and a sheet like connection body having one end connected to one principal surface of the first substrate and another end connected to one principal surface of the second substrate, wherein a lengthwise direction of the sheet like connection body is parallel to a perimeter part of the first substrate, and the sheet like connection body has a slit part extending from one of end portions thereof to a part thereof along the lengthwise direction, and has a first end and a second end divided by the slit part at one of end portions, the first end is connected to a principal surface of the first substrate in vicinity of a peripheral part of the first substrate, and the second end is connected to a principal surface of the second substrate in vicinity of a peripheral part of the first substrate.

Abstract translation: 本发明的连接结构包括第一基板，层叠有第一基板的第二基板以及与第一基板的一个主面连接的一端的片状连接体， 第二基板，其中片状连接体的长度方向平行于第一基板的周边部分，并且片状连接体具有从其一个端部沿其长度方向延伸到其一部分的狭缝部分 并且具有在一个端部处被狭缝部分分割的第一端和第二端，所述第一端在所述第一基板的周边部分附近与所述第一基板的主表面连接，并且所述第二端是 在第一基板的周边部分附近与第二基板的主表面连接。

公开(公告)号：US08373070B2

公开(公告)日：2013-02-12

申请号：US12830321

申请日：2010-07-04

Applicant: Chih-Kuang Yang

Inventor： Chih-Kuang Yang

IPC: H05K1/09 ,  G03F7/20

CPC classification number: H05K3/4007 ,  H05K1/111 ,  H05K1/118 ,  H05K3/048 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/0594 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved.

Abstract translation: 公开了包括第一金属层和电介质层的多层基板的金属结构。 第一金属层具有嵌入式基座和位于嵌入式基座上的主体。 嵌入式基座的基座面积大于主体的基座面积。 在电介质层覆盖主体和嵌入式基底之后，电介质层在第一金属层的特定位置处开口，用于将第一金属层与电介质层上方的第二金属层连接。 当金属结构用作根据本发明的柔性多层基板的焊盘或金属线时，金属结构不容易从接触的介电层分层或分离。 因此，可以实现柔性多层基板的更高的可靠性。