Abstract:
An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a tip at the other end. The root of each conductor is attached to the integrated circuit package to form a fixed electrical and mechanical connection. The tip of each conductor is adapted to be connected to a surface at a predetermined location. Each of the electrical conductors has at least two bends between the root and the tip for providing strain relief when the tip is connected to a surface.
Abstract:
A low cost aluminum electrolytic capacitor package having axial anode and cathode leads extending in one direction is capable of being seated and wave-solder connected in horizontal position to a printed circuit board without rolling, which unwanted rolling may result in withdrawal of one lead that consequently may not receive solder. A dummy lead is bonded to the opposite end of the package to stabilize the capacitor after solder mounting. One of the three leads has an ox-bow bend that tends to stop the unwanted rolling.
Abstract:
Pin terminals projecting from a side of a switch housing are led out upon being arranged in one direction and in a plane parallel to the side of the switch housing, and distal end portions of the pin terminals are secured to a printed circuit board. This reduces the space needed for mounting the switch, facilitates the mounting of the switch on the printed circuit board and mounts the switch more reliably.
Abstract:
A multilayered interposer powering board is disclosed for the distribution of required voltage levels to integrated circuit chip modules under conditions of high current demand and heat induced expansions. The interposer board is introduced between the module and its module mounting board. Flexible connector fingers are intermetallically or ohmically connected between a given level of the interposer board and a given power level of the module.
Abstract:
A method of fabricating an electrical circuit - usually employing small electronic components - on a generally rigid electrically conductive panel. The panel has apertures through which insulating collars are inserted, the necessary wiring and components then being built up on the panel by inserting the wires through the collars. The wires through each collar respectively are then united into electrical connection by crimping of the collars.
Abstract:
In a small hand-held calculator the electroluminescent display is in the form of a series of light emitting diodes (''''chips'''') which are received on a printed circuit board. The electric signal output of the calculator circuit is communicated to the display through a series of pins which are stake mounted on a printed circuit board and the projected ends of these pins serve the dual purpose of communicating electric signals which determine the display and also serve to mount the printed circuit board of the display and its associated components. The pins are inclined so that the display can be disposed at whatever viewing angle is desired. Thus, although the small calculator may lie flat on a desk or other support surface, the plane of the display is disposed at an angle making viewing much more convenient, that is, at an angle approaching perpendicularity to the line of vision of the viewer. By utilizing the pins both as electrical signal communicating means as well as mounting means it is possible to locate the display at whatever angle is desired and in a much more convenient and economical manner.
Abstract:
A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.