公开(公告)号：US20160141776A1

公开(公告)日：2016-05-19

申请号：US14540480

申请日：2014-11-13

Applicant: LEAR CORPORATION

Inventor： Bert William Eakins ,  George E. Fox

IPC: H01R12/58 ,  H01R43/20

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board.

Abstract translation: 组装电路板的方法可以包括将第一电端子插入电路板的第一侧，并且将第二层焊膏施加到电路板的第二侧，第二侧与第一侧相对设置。 第一电端子可以包括焊接片，焊接片的最大长度可以短于电路板的最小厚度，并且如果第一电端子插入到电路板中，则焊料片可以至少部分延伸 进入电路板，而不会完全延伸穿过电路板。 具有短和/或长焊料突片的一个或多个电端子可以插入电路板的第二侧和/或一个或多个电气部件可以附接到电路板的第二侧。

公开(公告)号：US09125313B2

公开(公告)日：2015-09-01

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H01R12/70 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20140367846A1

公开(公告)日：2014-12-18

申请号：US14221198

申请日：2014-03-20

Applicant: Mitsubishi Electric Corporation

Inventor： Shinya NAKAGAWA ,  Tomofumi TANAKA

IPC: H01L23/34

CPC classification number: H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K2201/10742 ,  H05K2201/1075 ,  H05K2201/10787 ,  H01L2924/00

Abstract: A power semiconductor device includes a plurality of power chips sealed in a package to control power and an IC sealed in the package to control each of the power chips. The IC is disposed at the center part of the package in the plan view. The plurality of power chips are disposed so as to surround the IC in the plan view.

Abstract translation: 功率半导体器件包括密封在封装中以控制功率的多个功率芯片和密封在封装中的IC以控制每个功率芯片。 IC在平面图中设置在包装的中心部分。 多个功率芯片被布置为在平面图中围绕IC。

公开(公告)号：US20140268581A1

公开(公告)日：2014-09-18

申请号：US14289335

申请日：2014-05-28

Applicant: YAZAKI CORPORATION

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.

Abstract translation: 公开了一种布线基板及其制造方法，所述布线基板包括：具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面 ; 连接端子，从所述基板延伸并且在垂直于所述基板的表面的方向上弯曲; 以及一体地安装在连接端子上的散热片部分。

公开(公告)号：US08547706B2

公开(公告)日：2013-10-01

申请号：US12873702

申请日：2010-09-01

Applicant: Hiroaki Tamura ,  Fumihiko Tokura ,  Michinao Nomura ,  Toshihiro Kusagaya ,  Kazuhiro Mizukami

Inventor： Hiroaki Tamura ,  Fumihiko Tokura ,  Michinao Nomura ,  Toshihiro Kusagaya ,  Kazuhiro Mizukami

IPC: H04L9/00

CPC classification number: H05K3/3426 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05K2201/09136 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract translation: 电子部件包括：电子部件主体; 以及固定到电气部件的引线，并且包括由彼此面对的第一和第二倾斜部分限定的突出部分。 第一倾斜部分的焊料润湿性小于第二倾斜部分的焊料润湿性。

公开(公告)号：US20120181077A1

公开(公告)日：2012-07-19

申请号：US13346085

申请日：2012-01-09

Applicant: Kazuya MIYASAKA ,  Kouji KOBAYASHI ,  Akihito FUKUZAWA

Inventor： Kazuya MIYASAKA ,  Kouji KOBAYASHI ,  Akihito FUKUZAWA

IPC: H05K1/11

CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹陷表面，并且所述突出部分的所述印刷电路板的厚度方向的长度大于所述印刷电路板的厚度。

公开(公告)号：US08203168B2

公开(公告)日：2012-06-19

申请号：US12888174

申请日：2010-09-22

Applicant: Felix Schinner ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

Inventor： Felix Schinner ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

IPC: H01L33/00

CPC classification number: H05K3/3442 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/202 ,  H05K2201/10636 ,  H05K2201/10787 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

Abstract translation: 本发明涉及具有半导体元件，特别是半导体芯片的电子部件，以及至少一个SMD元件，具有支撑平台的芯片载体和连接引线。 由此通过芯片连接电连接到连接引线的键指的半导体部件安装在支撑平台上，并且SMD部件通过布置在其上的接触表面将支撑平台连接到连接引线，壳体包围半导体 组件，SMD组件，并且至少部分地是芯片载体。 在SMD部件的区域中的支撑平台和连接引线被成型以形成阻挡层，使得自由流动的材料从连接到芯片载体的SMD部件的接触表面流到支撑平台上， 阻止连接引线。

公开(公告)号：US07635213B2

公开(公告)日：2009-12-22

申请号：US12068470

申请日：2008-02-07

Applicant: Ching-Liang Lee

Inventor： Ching-Liang Lee

IPC: F21V33/00

CPC classification number: H05K3/3405 ,  F21K9/00 ,  F21S41/00 ,  F21V19/0025 ,  F21Y2115/10 ,  H05K1/182 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/1446 ,  Y10S362/80

Abstract: A vehicle light assembly includes a casing with a plurality of frames connected thereto and each frame has a hole for receiving a light bulb of a Light Emitting Diode therein. Each Light Emitting Diode includes two legs and two protrusions extend from the two legs respectively. The legs of the Light Emitting Diodes are connected to a circuit board by a section from a distill end of each leg to the protrusion. The light bulbs are then bent toward a side of the circuit board and engaged with the holes of the frames. The side of the circuit board is shaped to cooperate with the positions of the frames.

Abstract translation: 车灯组件包括具有连接到其上的多个框架的壳体，并且每个框架具有用于接收其中的发光二极管的灯泡的孔。 每个发光二极管包括两条腿，两条突起分别从两条腿延伸。 发光二极管的腿通过从每个支柱的蒸馏端到突起的部分连接到电路板。 然后将灯泡朝向电路板的一侧弯曲并与框架的孔接合。 电路板的一侧被成形为与框架的位置配合。

公开(公告)号：US20090236617A1

公开(公告)日：2009-09-24

申请号：US12115515

申请日：2008-05-05

Applicant: CHIN-LONG KU

Inventor： CHIN-LONG KU

IPC: H01L33/00 ,  F21V21/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21S2/005 ,  F21V29/70 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10787 ,  H05K2201/1084 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED includes a base and a first and a second electrode leads inserted in the base. The first lead forms a groove in an end thereof, and the second lead forms a tab from an end thereof. The tab of each LED is received in the groove of an adjacent LED to thereby cooperatively define an accommodating space in the groove and above the tab. The accommodating space is used for receiving excess solder when soldering the first and the second leads together.

Abstract translation: LED组件包括衬底和安装在衬底上的多个LED。 每个LED包括基座和插入基座中的第一和第二电极引线。 第一引线在其端部形成凹槽，并且第二引线从其端部形成突片。 每个LED的突片被接收在相邻LED的凹槽中，从而在凹槽中并在凸片上方协同地限定容纳空间。 当将第一和第二引线焊接在一起时，容纳空间用于接收多余的焊料。

公开(公告)号：US20090068864A1

公开(公告)日：2009-03-12

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

Abstract translation: 电子设备包括印刷电路板和具有端子的电子元件。 端子具有表面部分和插入部分。 印刷电路板包括从印刷电路板的第一表面延伸到第二表面的通孔，设置在第一表面上的表面焊盘，以及一体地设置在通孔的侧壁上和周围的周边的插入槽 通孔。 表面部分通过焊料与表面焊盘耦合。 插入部设置在通孔中，并通过焊料与插入平台联接。 表面部分具有凹部，凹部的一部分设置成与通孔的一部分轴向对齐。