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    CONNECTION STRUCTURE OF CIRCUIT SUBSTRATE
    73.
    发明申请
    CONNECTION STRUCTURE OF CIRCUIT SUBSTRATE 审中-公开
    电路基板的连接结构

    公开(公告)号：US20080184556A1

    公开(公告)日：2008-08-07

    申请号：US12062461

    申请日：2008-04-03

    Applicant: Sung-Dae CHO ,  Joo-Hyung LEE

    Inventor： Sung-Dae CHO ,  Joo-Hyung LEE

    IPC: H05K3/20

    CPC classification number: H01L23/13 ,  H01L2924/0002 ,  H01L2924/15162 ,  H05K1/0393 ,  H05K1/142 ,  H05K3/0097 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/1545 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: The present invention provides an improved connection for circuit substrates. The circuit substrates are connected at concave and convex portions at their ends. The concave portion is formed such that the inside width is larger than the entrance width. The convex portion fits into the concave portion. Thereby, a connected portion of the circuit substrates has increased tensile strength. Furthermore, abnormality of the connected portion of the circuit substrates may be easily perceived.

    Abstract translation: 本发明提供了一种用于电路基板的改进的连接。 电路基板在其端部以凹凸部连接。 凹部形成为内侧宽度大于入口宽度。 凸部嵌入凹部。 因此，电路基板的连接部分具有增加的拉伸强度。 此外，电路基板的连接部分的异常可能容易察觉。

    System for the mechanical and electrical connection of printed circuits
    74.
    发明申请
    System for the mechanical and electrical connection of printed circuits 审中-公开
    印刷电路机械和电气连接系统

    公开(公告)号：US20070155194A1

    公开(公告)日：2007-07-05

    申请号：US10558311

    申请日：2003-05-20

    Applicant: Aurelio Vega Martinez

    Inventor： Aurelio Vega Martinez

    IPC: H01R12/00

    CPC classification number: H05K1/142 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/209

    Abstract: The invention relates to a system for the mechanical and electrical connection of printed circuit modules. According to the invention, the corresponding module is produced with a series of tongues (1) which are distributed uniformly around the edge thereof and which comprise two symmetrical sections (1a and 1b). Moreover, the configuration of the tongues (1) is identical and symmetrical to the space defined therebetween, such as to enable the corresponding intercoupling of modules. In this way, the modules (7) are connected mechanically and electrically by means of the contact formed by the lateral metallized surface of the tongues and both the upper and lower surfaces of the modules. Asymmetric tongues (2) are disposed at the corners, comprising a single section which is positioned perpendicularly to one of the sections of the adjacent, symmetrical tongue (1). The aforementioned tongues (1 and 2) can be used easily and simply to interconnect modules, by moving one module vertically in relation to the other, without the need for external connectors.

    Abstract translation: 本发明涉及一种用于印刷电路模块的机械和电连接的系统。 根据本发明，相应的模块产生有一系列均匀分布在其边缘上并且包括两个对称部分（1a和1b）的舌片（1）。 此外，舌片（1）的构造与其间限定的空间是相同的和对称的，以便能够实现模块的相应的互耦。 以这种方式，模块（7）通过由舌的侧面金属化表面和模块的上表面和下表面形成的触点机械地和电气地连接。 不对称舌片（2）设置在拐角处，包括垂直于相邻的对称舌部（1）的一个部分定位的单个部分。 上述舌头（1和2）可以通过相对于另一个模块垂直移动一个模块而不需要外部连接器，可以容易且简单地使用模块互连。

    Memory module
    76.
    发明授权
    Memory module 失效
    内存模块

    公开(公告)号：US07119436B2

    公开(公告)日：2006-10-10

    申请号：US10998312

    申请日：2004-11-26

    Applicant: Shih-Hsiung Lien

    Inventor： Shih-Hsiung Lien

    IPC: H01L23/02 ,  H01L23/48 ,  H01L23/34

    CPC classification number: G11C5/04 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/209

    Abstract: The memory module includes a plurality of memory units, each of which include a memory substrate, at least a memory chip having a predetermined memory capacity mounted on the memory substrate, and a conductive terminal provided at a lower edge portion of the memory substrate to electrically connect with the memory chip. An assembling arrangement includes a first joint provided at a side edge of each of the memory substrates and a second joint provided at an opposed side edge of each of the memory substrates, wherein the first joint of the memory unit is detachably engaged with the second joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner, such that the memory units form the memory module.

    Abstract translation: 存储器模块包括多个存储器单元，每个存储器单元包括存储器基板，至少一个具有安装在存储器基板上的预定存储器容量的存储器芯片，以及设置在存储器基板的下边缘部分处以电 连接内存芯片。 组装装置包括设置在每个存储器基板的侧边缘处的第一接头和设置在每个存储器基板的相对侧边缘处的第二接头，其中存储单元的第一接头可拆卸地与第二接头 以使得存储器单元以边缘到边缘方式彼此对准地连接，使得存储器单元形成存储器模块。

    Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
    77.
    发明授权
    Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor 有权
    具有用于连接功能和不起作用的附加物的互连的电路模块及其方法

    公开(公告)号：US07102891B1

    公开(公告)日：2006-09-05

    申请号：US10625290

    申请日：2003-07-23

    Applicant: Jeffrey Alan Miks ,  John Armando Miranda

    Inventor： Jeffrey Alan Miks ,  John Armando Miranda

    IPC: H05K1/14

    CPC classification number: H05K1/142 ,  H05K3/325 ,  H05K2201/09163 ,  H05K2201/209 ,  H05K2203/167

    Abstract: A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.

    Abstract translation: 多用电路模块具有前半模块。 前半模块是功能电路模块，其具有在其前部上的电触点，用于将多用电路模块电耦合到主机设备。 后半模块可拆卸地联接到前半模块。 后半模块通过允许功能和非功能部件耦合到前半模块来增加多用途电路模块的功能。

    Connector, method for manufacturing the same, and wiring board structure employing it
    78.
    发明申请
    Connector, method for manufacturing the same, and wiring board structure employing it 失效
    连接器，其制造方法以及使用它的接线板结构

    公开(公告)号：US20060105587A1

    公开(公告)日：2006-05-18

    申请号：US10520162

    申请日：2003-07-04

    Applicant: Yoshikazu Takagi

    Inventor： Yoshikazu Takagi

    IPC: H01R39/00

    CPC classification number: H05K3/365 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10393 ,  H05K2201/209

    Abstract: The invention relates to a connector for interconnecting an plurality of wiring boards, a method for manufacturing the same, and a wiring board structure employing the connector. The connector has a base member having no conductivity and a conductive wire provided on a surface of the base member, and is arranged so as to be connectable to a wiring board, comprising: a conductive pressing member provided on and protruding from the wire; and a holding member provided on and protruding from a portion in the surface of the base member except where the pressing member is located, the holding member having an affixing surface attachable to the wiring board. The invention can make the wire provided on a surface of the wiring board flat, and therefore it becomes possible to secure the flexibility in designing a wiring pattern of a wiring board.

    Abstract translation: 本发明涉及一种用于互连多个布线板的连接器，其制造方法以及采用该连接器的布线板结构。 连接器具有不具有导电性的基座构件和设置在基座构件的表面上的导线，并且布置成可连接到布线板，包括：导电按压构件，设置在导线上并从导线突出; 以及保持构件，所述保持构件设置在所述基座构件的除了所述按压构件所在的表面之外的部分的突出部上，所述保持构件具有可附接到所述布线板的固定表面。 本发明可以使布线板的表面上设置的布线平坦，从而可以确保设计布线板的布线图案的灵活性。

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