PROCESS WINDOW BASED ON DEFECT PROBABILITY
    82.
    发明公开

    公开(公告)号:US20240126181A1

    公开(公告)日:2024-04-18

    申请号:US18511454

    申请日:2023-11-16

    CPC classification number: G03F7/70633 G03F7/705 G03F7/70558 G03F7/70625

    Abstract: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.

    Method, substrate and system for estimating stress in a substrate

    公开(公告)号:US11953837B2

    公开(公告)日:2024-04-09

    申请号:US17423818

    申请日:2019-11-05

    CPC classification number: G03F7/70783 G03F7/70033

    Abstract: The present invention provides a testing substrate (W) for estimating stress in production substrates due to a substrate support, said testing substrate having a support surface (SS) divided into predefined portions, wherein the predefined portions comprise at least one first portion (1) having a first coefficient of friction being substantially uniform across the at least one first portion, and at least one second portion (2) having a second coefficient of friction being substantially uniform across the at least one second portion, wherein the second coefficient of friction is different to the first coefficient of friction. The present invention also provides a method for estimating stress in a substrate due to a substrate support and a system for making such an estimation.

    Methods and systems for maskless lithography

    公开(公告)号:US11953835B2

    公开(公告)日:2024-04-09

    申请号:US17793726

    申请日:2020-12-28

    CPC classification number: G03F7/70558

    Abstract: Method of exposing a substrate by a patterned radiation beam, comprising: —providing a radiation beam; —imparting the radiation beam by an array of individually controllable elements; —generating, from the radiation beam, a patterned radiation beam, by tilting the individually controllable elements between different positions about a tilting axis; —projecting the patterned radiation beam towards a substrate; —scanning a substrate across the patterned radiation beam in a scanning direction so as to expose the substrate to the patterned radiation beam, whereby the tilting axis of the individually controllable elements is substantially perpendicular to the scanning direction.

    Diffraction based overlay metrology tool and method of diffraction based overlay metrology

    公开(公告)号:US11953450B2

    公开(公告)日:2024-04-09

    申请号:US18056073

    申请日:2022-11-16

    CPC classification number: G01N21/95607 G03F7/7015 G03F7/70633

    Abstract: Systems, methods, and apparatus are provided for determining overlay of a pattern on a substrate with a mask pattern defined in a resist layer on top of the pattern on the substrate. A first grating is provided under a second grating, each having substantially identical pitch to the other, together forming a composite grating. A first illumination beam is provided under an angle of incidence along a first horizontal direction. The intensity of a diffracted beam from the composite grating is measured. A second illumination beam is provided under the angle of incidence along a second horizontal direction. The second horizontal direction is opposite to the first horizontal direction. The intensity of the diffracted beam from the composite grating is measured. The difference between the diffracted beam from the first illumination beam and the diffracted beam from the second illumination beam, linearly scaled, results in the overlay error.

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